Weekly Progress Reports (see sidebar), the Gantt chart, and this Project Management page should be printed out before meetings with the sponsor and instructor.
All team members should be able to explain all items on the progress report.
Place a "*" at the beginning of the title of the active week Progress Report (see * in sidebar).
Project Objectives
High Priority Objectives
Single cooling stage capable of temperatures as low as 4*K
Chip must be oriented perpendicular to induced electromagnetic field.
Electrical connections to chip must be shielded up to 50 GHz.
Design must be 'plug and play' set-up, i.e., a non-destructive mounting of the chip that does not involve any wire bonding or soldering, Contact to the chip's pads should be done by pressure or equivalent method.
Second Priority Objectives
2nd stage that is capable of temperatures as low as 77*K.
Ability to accept different pin out patterns.
Other Constraints and Issues
Stage cannot exceed packaging requirements allowed by surrounding vacuum shroud.
Aluminum silicate stage plate has 4 pre-drilled and tapped holes for fasteners that cannot be altered.
Chip must have exposed face that is perpendicular to field, if face is to be covered it must be by a material that is transparent to electromagnetic waves.
Stage must be non-magnetic and non-metallic
No alternations to sapphire thermal conduction shaft or aluminum silicate stage plate
WOW Design Solution
A ideal solution would involved all high-priority objectives as well as second priority objections. The later of which are considered optional.
Risk Reduction Strategy
Predicted linear expansion
Expected energy required and 'time to cool' analysis.
Intermediate Milestones
Establishment of preliminary design
Electrical connection design
CAD model of preliminary design
Determination of proper materials
Thermal deformation and performance analysis of preliminary design
Finalization of prototype design including proper materials
Prototype testing and experimental analysis
Design optimization