Prof. Jungwoo Oh

Research Interests

Semiconductor Processes and Devices (반도체 소자 및 공정)

Atomic Layer Deposition (ALD) of High-k/Ferroelectric dielectrics (원자층 증착법)

AI /Neuromorphic/Synaptic Devices, Process Development (인공지능 반도체)

Chemical Imprinting (Metal-assisted Chemical Etching)

Low dimensional materials for multifunctional applications

Efficient Energy Conversion Materials 

Hydrogen generation, Photoelectrochemistry

Professional Activities

• 정부포상 심사위원회 (정보.전자.통신분야) 

• 초청강연: 반도체공학회 종합학술대회,  양자정보반도체공학연구회 (2023.12)

• Invited talks: CSW 2023 (May), IEEE Nano 2023 (July)

• Committeee Chair, Short Course Chair, Session Chair: IEEE EDTM 2023 (March), Power and Energy Devices

- EDTM: Electron Devices Technology and Manufacturing Conference

• General Chair, co-Chair: IEIE/IEICE AWAD 2019   AWAD 2018   

- *IEIE: The Institute of Electronics and Information Engineers,(Korea),  **IEICE: The Institute of Electronics, Information and Communication Engineers (Japan)

 - AWAD: Asia-Pacific Workshop on Advanced Semiconductor Devices  

• Program Committee;  AWAD 2016, 2017

• 학술위원장 Academic Chair; The Korean Conference on Semiconductors (KCS 2021)

• 학술부위원장 Academic vice-Chair; The Korean Conference on Semiconductors (KCS 2020)

• 조직위원 Organizing committee; The Korean Conference on Semiconductors (KCS 2019)

• Associate Editor; Journal of Semiconductor Technology and Science (JSTS 2020.01-2021.12)

• Guest Editor; Solid-State Electronics (SSE 2019, 2020)

Awards

• 산업통상자원부장관 표창 (반도체의날 2023.10)

• 연세대학교 우수강의교수상 Best Lecture Award, Yonsei University (2021, 2020)

• Best Oral Presentation (ENGE 2022, Dohwan Jung)

• 우수학생논문상 (하계종합학술대회 2022 대한전자공학회, 장윤서)

• 최우수논문상 (한국반도체학술대회 KCS 2020)

• Young researcher poster award (AWAD 2019, 2018, 2017)

• Bronze medal (Samsung Electro-Mechanics Best Paper Award 2017)

• Creative research outcome award; ICT forum 2019

Professional Career

2004-2012  SEMATECH Advanced CMOS & Emerging Tech., USA

• • In charge of emerging technology development, strategic planning, path finding with member companies (Intel, IBM, Samsung, AMD, Globalfoundries, TI, UMC, TSMC, Panasonic, and New York Government), making proposals to external funding agencies (DARPA, TEL, SuVolta, Boeing), collaborating with universities & national labs, managing interdisciplinary tech areas (electronics & photonics, III-V, Ge, Si) for future advanced technologies 

2000-2004   Research Assistant, The University of Texas at Austin, USA

• • Heterogeneously integrated optical receivers with high quantum efficiency and frequency for optical communication and interconnect (collaboration with Motorola)  

1997-2000 Research Assistant, POSTECH & Samsung Advanced Institute of Technology, Korea

• • Single voltage operation III-V pHEMTs integration for low power mobile application (collaboration with ETRI & Samsung)