Electronic Packaging

Mechanical failure in microelectronic packaging structures often occurred at the interfaces, due to the formation of microscale, detrimental intermetallics and defects from the complicated bonding processes. Due to the similar length scale, our novel nanomechanical tests provides an ideal solution for this industrial-relevant problem. We are currently looking at the interfacial strength of hybrid-bonded structures, metal layer on polyamide substrate, and Cu/Al wire bondings. We are also interested in process-structure-property relationship of 4H-SiC, and apply the improved understanding for better process optimization strategy. In this research theme, we work closely with semiconductor industries as well as goverment partners