@ARTICLE{Security_3DIC,
author={Y. Xie and C. Bao and C. Serafy and T. Lu and A. Srivastava and M. Tehranipoor},
journal={IEEE Transactions on Multi-Scale Computing Systems},
title={Security and Vulnerability Implications of 3D ICs},
year={2016},
volume={PP},
number={99},
pages={1-1},
keywords={Fabrication;Integrated circuit interconnections;Security;Stacking;Three-dimensional displays;Through-silicon vias;3D Integration;Hardware Security;Hardware Trojan;IP Piracy;Side-channel Attack;Trustworthy Computing System},
doi={10.1109/TMSCS.2016.2550460},
month={},}