@ARTICLE{7849155,
author={T. Lu and C. Serafy and Z. Yang and S. Samal and S. K. Lim and A. Srivastava},
journal={IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems},
title={TSV-based 3D ICs: Design Methods and Tools},
year={2017},
volume={PP},
number={99},
pages={1-1},
keywords={Design tools;Integrated circuit interconnections;Power system reliability;Stacking;Three-dimensional displays;Through-silicon vias;3D IC;Architecture;Design tools;Physical Design},
doi={10.1109/TCAD.2017.2666604},
ISSN={0278-0070},
month={},}