@INPROCEEDINGS{Lu:interpack:2015,
author={Lu, Tiantao and Srivastava, Ankur},
booktitle={ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems},
title={Electrical-Thermal-Reliability Co-Design for TSV-Based 3D-ICs},
year={2015},
volumn={1},
pages={1-10},
}