會議論文

2024

1. Y. C. Tsai, Y. J. Chuang and S. -W. Chen, 2024, “Miscibility gaps in the Ag-Cu-Se-Te quaternary system”, MRS-Taiwan Annual Meeting 2024, Taichung, Taiwan.

2. 莊詠任, 蔡永濬, 陳信文, 2024, “Ag-Se-Te和Cu-Se-Te三元系統的混溶間隙與液相線投影圖”, 2024年中國材料科學學會年會, 中興大學.

3. 林翰辰, 蔡永濬, 陳信文, 2024, “Ag-Sn-Te / Co與Ag-Sn-Te / Ni的界面反應”, 2024年中國材料科學學會年會, 中興大學.

4. Y. C. Tsai, P. S. Huang and S. -W. Chen, 2024, “Ag and Cu whiskers in the Ag-Cu-Se ternary system”, 153rd TMS Annual Meeting & Exhibition, Orlando, Florida, USA.

5. S. -W. Chen*, Y. C. Tsai, P. S. Huang and Y. Hutabalian, 2024, “Phase diagram, whisker and miscibility gap of the Ag-Cu-Te ternary system”, 153rd TMS Annual Meeting & Exhibition, Orlando, Florida, USA.

6. Y. C. Tsai, H. C. Yang, C. H. Ho and S. -W. Chen, 2024, “Co/Bi2(Se,Te)3 interfacial reactions and Bi-Co-Se-Te phase equilibria”, 153rd TMS Annual Meeting & Exhibition, Orlando, Florida, USA.

7. 林德威, 陳信文, 2024, “Liquidus and invariant temperatures of Sn-based Sn-Ag-Cu-Bi and Sn-In-Ni-Zn alloys.”, 2024年第12屆台灣相圖會議, 清華大學.

8. C.-H. Ho, H.-C. Yang, Y. C. Tsai and S.-W. Chen, 2024, “Co/Bi2Se3 interfacial reactions and Bi-Co-Se phase equilibria”, 153rd TMS Annual Meeting & Exhibition, Orlando, Florida, USA.

9. C.-H. Ho, J.-R Chang. H.-C. Yang and S.-W. Chen, 2024, “Co/Bi2Te3 interfacial reactions and Bi-Co-Te phase equilibria”, 153rd TMS Annual Meeting & Exhibition, Orlando, Florida, USA.

10. C.-H. Ho, J.-R Chang, H.-D. Chiang and S.-W. Chen, 2024, “Unexpected interfacial reactions in Co/Bi2Te3 and Ni/Bi2Te3 couples”, MRS-Taiwan Annual Meeting 2024, Taichung, Taiwan.

11. H.-C. Huang, C.-H. Ho and S.-W. Chen, 2024, “Sn-Bi-Cu三元系統液相線投影圖與無變度反應之探討”, MRS-Taiwan Annual Meeting 2024, Taichung, Taiwan.

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2023

12. Y. C. Tsai, Y. Hutabalian and S. -W. Chen, 2023, “Liquidus projections of Ag-Cu-Te and Ag-Cu-Se systems”, 2023 TwIChE, Taipei, Taiwan.

13. 張文俞, 陳信文, 2023, “Phase diagrams of the Al-Cu-Ni-Zn system”, 2023年中國材料科學學會年會, 清華大學.

14. 林德威, 陳信文, 2023, “Thermal analysis, solidification and microstructures of Sn-based Sn-In-Ni-Zn alloys.”, 2023年中國材料科學學會年會, 清華大學.

15. C.-H. Ho and S.-W. Chen, 2023, “Stability diagram of Co-Ni-Sb and Co-Ge-Sb systems”, 2023 TwIChE, Taipei, Taiwan.

16. 陳信文, 2023, ”AI快速發展，化工教育是否需要變化?以化工熱力學為例”, presented at the 2023 TwIChE annual meeting, Taipei, Taiwan.

17. S.-W. Chen, Y.-C. Liu and S.-K. Lin, 2023, “Phase diagrams in the modern age: changed and unchanged”, presented at the 2023 MRS-T International Conference, Hsinchu, Taiwan.

18. S.-W. Chen, J.-R. Chang and H.-C. Yang, 2023, “Interfacial stabilities in thermoelectric devices”, presented at the AIChE conference, Orlando, USA.

19. S.-W. Chen, J.-R. Chang and H.-C. Yang, 2023, “Interfacial reactions in Co/Bi2Te3 abd Co/Bi2Se3 couples”, presented at the MS&T 23 conference, Columbus, USA.

20. S.-W. Chen, P.-S. Huang and J.-Y. Lin, 2023, “Ag and Cu whiskers”, presented at the 4th Annual Meeting of Taiwan Thermoelectric Society, Hwalien, Taiwan.

21. S.-W. Chen, Y. A. Lee and T.-W. Lin, 2023, “Eutectic and liquidus temperatures of Sn-based alloys”, presented at the 50th International Conference on Computer Coupling of Phase Diagrams and Thermochemistry, Boston, USA.

22. S.-W. Chen, 2023, “Understanding peculiar behaviors of electronic materials through phase diagrams”, presented at the 2023 International Conference on Electronic Packaging, Kumamoto, Japan.

23. S.-W. Chen, C.-H. Wang, J.-R. Chang and H.-C. Yang, 2023, “Unexpected reactions observed in Ni/SnSe2 couples”, presented at the 152nd TMS annual meeting, San Diego, USA.

24. S.-W. Chen, P.-S. Huang and Y. Hutabalian, 2023, “Ag and Cu Whisker Formation”, presented at the 152nd TMS annual meeting, San Diego, USA.

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2022

25. 李怡安、陳信文, 2022, “錫-銀-鉍-銅四元系統中錫基合金液相線溫度量測”, 2022台灣化學工程學會年會,淡江大學.

26. 張家瑞、陳信文, 2022, “Co/Bi2Te3的界面反應”, 2022台灣化學工程學會年會，淡江大學.

27. 楊賀程、陳信文, 2022, “Co/Bi2Se3界面反應與Bi-Co-Se相平衡”, 2022台灣化學工程學會, 淡江大學.

28. Y. Hutabalian and S.-W. Chen, 2022, ”Thermodynamics assessments of Cu-Pb-Te system by Calphad method”, 2022台灣化學工程學會, 淡江大學.

29. S.-W. Chen, 2022, “Expected and unexpected whisker formation”, 60 KIChE annual meeting, Korea.

30. Y. Hutabalian and S.-W. Chen, 2022, “Liquidus projection of the ternary Ag-Cu-Te thermoelectric material system”, 2022中國材料科學學會年會, 聯合大學.

31. 黃品碩、陳信文, 2022, “Ag-Cu-Se-Te四元系統晶鬚成長之分析”, 2022中國材料科學學會年會, 聯合大學.

32. S.-W. Chen, 2022, “Phase equilibria of thermoelectric Bi-Sb-Se-Te quaternary system”,2022 CHISA, Prague, Czech.

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2021

33. S.-W. Chen, 2021, “Unexpected phenomena observed in metallurgical studies”, presented at the 150th TMS annual meeting, (virtual).

34. S.-W. Chen, Y.-H. Hsu, H.-W. Shih and S.-K. Lin, “Interfacial reactions in the Bi2Te3 thermoelectric modules”, presented at the 150th TMS annual meeting, (virtual).

35. Y. Hutabalian and S.-W. Chen, 2021, “Interfacial Reaction in Ag/Se, Ag/Te, Ag2Te/Se and Ag2Te/Se-30at.%Te couples and their Related Phase Diagram”, presented at the 150th TMS annual meeting, (virtual).

36. Y. Hutabalian, Z.-K. Hu, H.-H. Chen and S.-W. Chen, 2021, “Ni/Pb-Te and Ni/Se-Sn Interfacial Reactions and Their Related Phase Diagrams”, presented at the 150th TMS annual meeting, (virtual).

37. Y. Hutabalian and S.-W. Chen, 2021, “Diffusion Couples in Cu/Se, Cu2Se/Te, and Cu2Te/Se at 300oC and phase equilibria in the Cu-Se-Te ternary system”, presented at the Materials Research Society-Taiwan International Conference, (virtual).

38. Y. Hutabalian and S.-W. Chen, 2021, “Liquidus projection and isothermal section of the Cu-Se-Te ternary system” presented at the 69th TwIChE annual meeting, Kaohsiung, Taiwan.

39. C.C. Ching and S.-W. Chen, 2021, “Bi-Sb-Se-Te quaternary system: Experimental measurement and Calphad calculation” presented at the 69th TwIChE annual meeting, Kaohsiung, Taiwan.

40. 賴運宏、陳信文, 2021,“(Cu-Ni)/Sb-Ge-Te界面反應與其相關系統相圖”，2021台灣化學工程學會69周年年會、高雄。

41. 陳奕、陳信文, 2021, “(Cu-Ni)/GeTe界面反應與其相關系統相圖”，2021台灣化學工程學會69周年年會、高雄。

42. 郭燿德、陳信文, 2021,“Co-Fe-Ge 三元系統相圖:實驗量測與Calphad計算”，110中國材料科學學會、台北。

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2020

43. S.-W. Chen, H.-W. Shih, W. Wang, Y. Hutabalian, Z.-K. Hu and H.-H. Chen, 2020, "Interfacial reactions between Bi2Te3 substrate with Cu, In, Sn and Ni", presented at the 149th TMS annual meeting, San Diego, CA, USA.

44. Y. Hutabalian and S.-W. Chen, 2020, "Phase Diagrams of Ag-Cu-Te Ternary System and Ag2Te/Cu Interfacial Reaction", presented at the 149th TMS annual meeting, San Diego, CA, USA.

45. S.-W. Chen, J.-Y. Du, Y. Hutabalian, and A. Kroupa, 2020, "Phase diagrams of Ag-Pb-Sn-Te system", presented at the 149th TMS annual meeting, San Diego, CA, USA.

46. Y. Hutabalian, S.-W. Chen, 2020, “Interfacial reactions in Ag/Se, Ag/Se-30at%Te and Ag2Te/Se couples and Ag-Se-Te phase equilibria”, presented at the 9th TaPhaD conference, Hsinchu, Taiwan.

47. 胡智凱、陳信文、2020、“(Cu-Ni)/Pb-Te-Se 界面反應與其相關系統相圖” 2020第9屆台灣相圖會議、新竹。

48. 陳栩輝、陳信文、2020、“Ni 阻障層與 SnSe2熱電材料之界面反應”, 2020第9屆台灣相圖會議、新竹。

49. 劉君翔、陳信文、2020、“錫-銀-銅-銦-鉍五元合金相平衡探討”, 2020第9屆台灣相圖會議、新竹。

50. 郭燿德、陳信文、2020、“含具觸媒應用潛力之Co-Fe-Ge材料系統相圖”2020中國工程師學會、台北。

51. A. Ramakrishnan, K. Thanigai Arul, C.L. Dong, S.-W. Chen, 2020, “Enhanced electrochemical performance of dealloyed decagonal Al-Co-Ni quasicrystals”, presented at the 67th TwIChE annual meeting, Hsinchu, Taiwan.

52. Y.-D. Guo, Y. Hutabalian, S.-W. Chen, 2020, “Phase diagram of Co-Fe-Ge system” presented at the 67th TwIChE annual meeting, Hsinchu, Taiwan.

53. H.-H. Chen, S.-W. Chen, 2020, “Ni/SnSe2 interfacial reaction”, presented at the 67th TwIChE annual meeting, Hsinchu, Taiwan.

54. 胡智凱、陳信文、2020、“(Cu-Ni)/Pb-Te-Se 界面反應與其相關系統相圖” ，2020台灣化學工程學會67周年年會、新竹。

55. Y. Hutabalian, S.-W. Chen, 2020, “Study the Ag-Se-Te phase diagram and its reaction couples”, presented at the MRS-Taiwan annual meeting, Taipei, Taiwan.

56. 劉君翔、陳信文、2020、“錫-銀-銅-銦-鉍五元合金相平衡探討”、109中國材料科學學會、台北。

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2019

57. 陳家峻、陳信文，2019，'' Sb-Se-Te 三元系統相圖''，2019中國材料科學學會，台南。

58. A. Ramakrishnan, S.-W. Chen, 2019, "Interfacial reaction in Sn/Cu2Se couples", presented at MRS-T conference, Tainan, Taiwan.

59. 石皓瑋、王暐、陳信文，2019，"熱電模組接點之Cu/Bi2Te3與Ni/Bi2Te3界面反應探討"，2019台灣化學工程學會66周年年會，台中。

60. 郭子寧、陳信文，2019，"準晶材料與Ag-Cu共晶及Sn-Cu共晶合金間的界面反應"，2019台灣化學工程學會66週年年會，台中。

61. S.-W. Chen, J.-Y. Du, Y. Hutabalian, A. Kroupa, 2019, "Phase diagrams of Ag-Pb-Sn-Te system", presented at the 66th TwIChE annual meeting, Taichung, Taiwan.

62. Y. Hutabalian, S.-W. Chen, 2019, "Phase diagrams of Ag-Cu-Te ternary system", presented at the 66th TwIChE annual meeting, Taichung, Taiwan.

63. S.-W. Chen, Y.-H. Du and A. Kroupa, 2019, "Phase diagram determination of thermoelectric Ag-Pb-Sn-Te quaternary system", presented at the 2019 AIChE Annual Meeting, Orlando, Florida.

64. S.-W. Chen, 2019, "Interfacial reactions in Ag-Cu/Ni, Ag-Cu/Co, Ag-Sb/Ni and Ag-Sb/Co couples", (Invited speech), presented at the Materials Science and Technology 2019( MS&T19), Portland, Oregon.

65. S.-W. Chen, 2019, "Interesting and unexpected phenomena observed at the joints of electronic products", presented at the 18th Asian Pacific Confederation of Chemical Engineers (APCChE2019), Sapporo, Hokkaido and Hokkaido University (invited speech).

66. A. Ramakrishnan, S.-W. Chen, 2019, "Al-Co-Ni Based Decagonal Quasicrystal: a Study of Phase Transformation and Phase Stability by Synchrotron X-ray Diffraction", NSRRC 25th Users' Meeting & Workshops, Hsinchu, Taiwan.

67. S.-W. Chen, 2019, "Unexpected liquation phenomena at joints", (Invited speech), presented at the 148th TMS annual meeting, San Antonio, Texas, USA.

68. S.-W. Chen and Y.-C. Lin, 2019, "Phase diagrams of the Bi-In-Se-Te quaternary system", (Invited speech), presented at the 148th TMS annual meeting, San Antonio, Texas, USA.

69. A. Ramakrishnan, Z.-Y. Huang, and S.-W. Chen, 2019, "Interfacial reactions in Sn/Ag2Se Couples", presented at the 148th TMS annual meeting, San Antonio, Texas, USA.

70. T.-Y. Huang and S.-W. Chen, 2019, "Phase diagrams of thermoelectric Pb-Se-Sn-Te quaternary system", presented at the 148th TMS annual meeting, San Antonio, Texas, USA.

71. P.-C. Lo, T.-Y. Huang, T.-N. Kuo,and S.-W. Chen, 2019, "Phase diagrams of material systems with quasicrystalline phases", presented at the 148th TMS annual meeting, San Antonio, Texas, USA.

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2018

72. S.-W. Chen* and Y. Hurabalian , 2018, "Phase diagrams of Bi-Sb-Se-Te and Pb-Se-Sn-Te quaternary alloys of thermoelectric interests", presented at ICHEM 2018 (The 2nd International Conference on High-Entropy Materials), Jeju, Korea.

73. 黃澤洋、陳信文，2018，"具熱電應用重要性的Pb-Se-Sn-Te 四元材料系統相圖"，2018年中國材料科學學會年會，台中。

74. 杜怡慧、陳信文*，2018，"Ag-Pb-Sn-Te四元熱電材料系統的相圖實驗與計算"，2018台灣化學工程學會65週年年會，雲林。

75. 羅珮嘉、郭子寧、Anbalagan Ramakrishnan、陳信文*，2018，"含準晶材料的Al-Co-Cu與Al-Co-Ni三元系統相圖"，2018台灣化學工程學會65週年年會，雲林。

76. S.-W. Chen* and Y. Hurabalian , 2018, " In/Bi2(Se,Te)3 interfacial reactions and Bi-In-Se-Te phase diagram", presented at MS&T 18 (Materials Science &Technology) conference, Columbus, Ohio, U.S.A.

77. 陳信文*, 2018, "熱電元件中接點的界面反應", 第十一屆海峽兩岸化學工程學術研討會, 山西太原, 中國.

78. S.-W. Chen*, W. Wang and K.-C. Hsieh, 2018, "Ag-Se phase diagram calculation associating ab-initio molecular dynamics simulation", presented at the CALPHAD XLVII. Juriquilla, Queretaro, Mexico.

79. V. B. Rajkumar and S.-W. Chen*, 2018, " Cu/Bi2Te3 interfacial reactions and Bi-Cu-Te phase diagram ", presented at the CALPHAD XLVII. Juriquilla, Queretaro, Mexico.

80. S.-W. Chen* and Y.-S.Peng, 2018, "Ni/(Ag-41.0at%Sb)1-xNix and Co/(Ag-41.0at%Sb)1-xCox Interfacial Reactions and Their Related Ag-Ni-Sb and Ag-Co-Sb Phase Diagrams ", presented at the International Congress on Chemical, Biological and Environmental Sciences, Hokkaido, Japan.

81. S.-W. Chen*, Z.-Y. Huang, P.-C. Wei and Y.-Y. Chen, 2018, "Phase Diagram of Ag-In-Se System and Thermoelectric Properties of In-containing Ag2Se" (Invited speech), presented at the 147th TMS annual meeting, Phoenix, USA.

82. S.-W. Chen*, T.-.C. Yang and J.-M. Lin, 2018, "Interfacial reaction studies in SLID bonding processes using Ga and In" (Invited speech), presented at the 147th TMS annual meeting, Phoenix, USA.

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2017

83. Y.-C. Lin and S.-W. Chen, 2017, "Phase diagram of thermoelectric In-Se-Te ternary system", 發表於「2017台灣化工年會」，台北。

84. 黃子洋、魏百駿、陳信文、陳洋元, 2017, "Ag-In-Se 相圖與含In的Ag2Se熱電性質", 發表於「2017台灣化工年會」，台北。

85. S.-W. Chen, Y. Hutabalian, and S.-T. Lu, 2017, "Indium/Bi2Te3-based thermoelectric materials interfacial reactions", presented at 18th International Union Materials Research Societies, International Conference in Asia (IUMRS-ICA 2017), Taipei, Taiwan.

86. S.-W. Chen and P.-C. Lo, 2017, "Phase equilibria of Al-Co-Cu ternary quasicrystalline system", presented at 18th International Union Materials Research Societies, International Conference in Asia (IUMRS-ICA 2017), Taipei, Taiwan.

87. S.-W. Chen, Z.-Y. Huang, and Y.-Y. Chen, " Phase diagrams, defect models and thermoelectric properties:β-Ag2Se and CoSb3 ", presented at the AIChE annual meeting, Minneapolis, USA.

88. 陳信文, 2017, "相圖計算、缺陷模型與熱電性質", 發表於「第十屆海峽兩岸化學工程學術研討會」(Invited speech)，銀川，中國。

89. V. B. Rajkumar and S.-W. Chen, 2017, "Modelling the Gibbs energy of Ag-Ge, Ag-Ni and Ag-Ge-Ni by calphad approach", presented at CALPHAD XLI annual meeting, Saint Molo, France.

90. S.-W. Chen, J.-S. Chang and C.-H. Wang, 2017, "Phase equilibria of Pb-Sb-Se-Sn quaternary system", presented at CALPHAD XLI annual meeting, Saint Molo, France.

91. S.-W. Chen, 2017, " Phase equilibria studies of thermoelectric materials " (Invited speech), presented at the 2017 APAM Sendai International Conference, Sendai, Japan.

92. T.-C. Yang and S.-W. Chen, 2017, “Interfacial reactions in Cu/In/Ni and Cu/In/Co transient liquid phase bonding“, presented at the 146th TMS annual meeting, San Diego, USA.

93. J.-W. Chen and S.-W. Chen, 2017, “Electromigration effects upon interfacial reactions at the electronic solder joints: relations with bump height and electric current density“, presented at the 146th TMS annual meeting, San Diego, USA.

94. J.-M. Lin and S.-W. Chen, 2017, “Interfacial reactions in Cu/Ga/Ni and Cu/Ga/Co transient liquid phase bonding“, presented at the 146th TMS annual meeting, San Diego, USA.

95. S.-W. Chen, T.-W. Liou and H.-S. Chu, 2017, “Interfacial reactions at the joints in the Bi2Te3-based thermoelectric modules“ (Invited speech), presented at the 146th TMS annual meeting, San Diego, USA.

96. S.-W. Chen, J.-C. Wang and L.-C. Chen, 2017, “Interfacial reactions at the joints of PbTe thermoelectric modules“ (Invited speech), presented at the 146th TMS annual meeting, San Diego, USA.

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2016

97. 陳信文、吳欣潔、張睿紳, 2016, "Thermoelectric materials and thermoelectric modules", 發表於「2016台灣化工年會」，桃園。

98. 張睿紳、陳信文, 2016, "Phase diagram determination of thermoelectric Sn-Sb-Se ternary system", 發表於「2016台灣化工年會」，桃園。

99. 林佶民、陳信文, 2016, "Interfacial reactions in transient liquid phase bonding of Cu/Ga/Ni and Cu/Ga/Co", 發表於「2016台灣化工年會」，桃園。

100. 楊子慶、陳信文, 2016, "Interfacial reactions in Co/In/Cu joints by transient liquid phase bonding in thermoelectric modules", 發表於「2016台灣化工年會」，桃園。

101. 陳敬薇、陳信文, 2016, "Electromigration effects upon interfacial reactions at the electronic solder joints: relations with bump height and electric current density", 發表於「2016台灣化工年會」，桃園。

102. S.-W. Chen, S.-T. Lu, H.-J. Wu and J.-S. Chang, 2016, "Phase Diagram, Microstructure and Thermoelectric Properties", presented at the 2016 AIChE Annual Meeting, San Francisco, California USA.

103. S.-W. Chen, J.-W. Chen, Y.-C. Lin , and T.-C. Chang, 2016, "Electromigration Effects upon Cu/Ni/SnAg and Cu/Ni/SnAgCu Interfacial Reactions", presented at the PRiME 2016/230th ECS Meeting, Honolulu, Hawaii, USA.

104. S.-W. Chen, P.-H. Lin, W. Gierlotka, 2016, "Phase equilibria of the Al-Cu-Fe system with the quasicrystalline phase", presented at the CALPHAD XLV conference, Awaji Island, Hyogo, Japan.

105. J.-S. Chang and S.-W. Chen, 2016, "Phase diagrams of chalcogenide Sn-Sb-Se ternary system", presented at the 145th TMS annual meeting, Nashville, TN, USA.

106. S.-W. Chen, L.-C. Chen, J.-C. Wang and P.-H. Lin, 2016, "Interfacial reactions in the Ni/Ag-Sb and Ni/Ag-Ge couples" (Invited speech), presented at the 145th TMS annual meeting, Nashville, TN, USA

107. P.-H. Lin, S.-W. Chen, S.-M. Tseng, Y. Tang and G. J. Snyder, 2016, "The Ga and In coupling effects in the doping of the CoSb3 compound", presented at the 145th TMS annual meeting, Nashville, TN, USA.

108. S.-W. Chen, T.-R. Yang, H.-W. Hsiao, H.-S. Chu and J.-D. Huang, 2016, "Ni/(Bi0.25Sb0.75)2Te3 and Ni/Bi2(Se0.1Te0.9) interfacial reactions" (Invited speech), presented at the 145th TMS annual meeting, Nashville, TN, USA.

109. A. H. Chu, S.-W. Chen, and D. S.-H. Wong, 2016,"Interfacial reactions at the joints in the CoSb3-based thermoelectric devices", presented at the 145th TMS annual meeting, Nashville, TN, USA.

110. S.-W. Chen, S.-T. Lu and P.-H. Lin, 2016, "Liquidus projection of the Bi-In-Te thermoelectric material system", poster presented at the 145th TMS annual meeting, Nashville, TN, USA, 1st place in the "Alloys and Compounds for Thermoelectric and Solar Cell Applications IV" poster contest.

111. S.-W. Chen, T.-W. Liou, A. H. Chu, H.-S. Chu and J.-D. Huang, 2016, "Interfacial reactions at the joints of Bi2Te3-based thermoelectric devices", poster presented at the 145th TMS annual meeting, Nashville, TN, USA, 3rd place in the "Alloys and Compounds for Thermoelectric and Solar Cell Applications IV" poster contest.

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2015

112. 王仁傑、陳信文、張睿紳, 2015, "熱電元件中Ag-Ge/Ni界面反應與Ag-Ge-Ni三元系統相平衡", 發表於「2015中國材料科學學會年會」，高雄。

113. 陳信文、林伯翰、曲華德, 2015, "相圖與界面反應: 以電子元件與熱電元件為例", 發表於「2015中國材料科學學會年會」，高雄。

114. 陸詩婷、林伯翰、陳信文, 2015, "Bi-Te-In 三元熱電材料系統之液相線投影圖", 發表於「2015中國材料科學學會年會」，高雄。

115. 劉姿?、楊庭瑞、陳信文、朱旭山、黃振東, 2015, "Bi2Te3基熱電元件接點之界面反應", 發表於「2015中國材料科學學會年會」，高雄。

116. A. H. Chu, S.-W. Chen, and D. S.-H. Wong, 2015, "Interfacial reactions in the CoSb3 thermoelectric devices", 發表於「第六十二屆台灣化工學會年會暨科技部化工學門成果發表會」與「台韓日三國化工聯合會議」，高雄。

117. J.-W. Chen, S.-W. Chen, and P.-H. Lin, 2015, "Liquidus projection of the ternary Co-Sb-Yb system", 發表於「第六十二屆台灣化工學會年會暨科技部化工學門成果發表會」與「台韓日三國化工聯合會議」，高雄。

118. L.-C. Chen, S.-W. Chen, and P.-H. Lin, 2015, " Interfacial reactions in the Ni/Ag-Sb couples at 350oC and 550oC ", 發表於「第六十二屆台灣化工學會年會暨科技部化工學門成果發表會」與「台韓日三國化工聯合會議」，高雄。

119. P.-H. Lin, S.-W. Chen, J.-W. Chen and J.-D. Hwang, 2015, "Phase diagram of the Al-Cu-Fe system with the quasicrystalline phase", 發表於「第六十二屆台灣化工學會年會暨科技部化工學門成果發表會」與「台韓日三國化工聯合會議」，高雄。

120. S.-W. Chen, S.-M.Tseng, H. Chu, J.-W. Chen, Y. Tang and G. J. Snyder, 2015, "Phase diagrams of the Co-Sb-X thermoelectric materials systems", presented at the CALPHAD XLIV, Loano, Italy.

121. S.-W. Chen, P.-H. Lin, J.-D. Hwang and J.-S. Chang, 2015, "Phase diagram determinations of the N-type Bi-Se-Te-x alloys", presented at the CALPHAD XLIV, Loano, Italy.

122. H.-J. Wu and S.-W. Chen, 2015, "Formation of [010]-Oriented Sb2Se3 Crystals via Vapor-Liquid-Solid (VLS) Process: The Crystal Structure and Thermal Power", presented at the 144th TMS annual meeting, Orlando, Florida, USA.

123. S.-W. Chen, W.-A. Chen, T.-R. Yang and P.-H. Lin, 2015, "Interfacial Reactions in Thermoelectric Devices" (Invited speech), presented at the 144th TMS annual meeting, Orlando, Florida, USA.

124. P.-H. Lin and S.-W. Chen, 2015, "Phase Equilibria Isoplethal Section at 40at%Bi of the Bi-Te-Se-In System", presented at the 144th TMS annual meeting, Orlando, Florida, USA.

125. W.-T. Chiu, S.-W. Chen and S.-M. Tseng, 2015, "Phase Equilibria of Cu-In-Se Ternary System "(Invited speech), presented at the 144th TMS annual meeting, Orlando, Florida, USA.

126. J.-S. Chang and S.-W. Chen, 2015, "Phase Diagrams of Pb-Sb-Se Ternary System", Best poster award, and presented at the 144th TMS annual meeting, Orlando, Florida, USA.

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2014

127. J.-S. Chang, S.-W. Chen, 2014, "Phase diagram determination and PbSb2Se4 whisker formation of thermoelectric Pb-Sb-Se ternary system", 2014 TwIChe Annual Meeting, Taoyuan, Taiwan.

128. 曾思鳴、張睿紳、陳信文，2014，"Co-Sb-In三元材料之相平衡"，2014年台灣化學工程學會61週年年會論文，桃園, Taiwan。

129. 林伯翰、張睿紳、陳信文、黃振東，2014，"四元熱電 Bi-Se-Te-Ga合金系統的相圖"，2014年台灣化學工程學會61週年年會論文，桃園, Taiwan。

130. 楊庭瑞、陳信文、蕭皓文、黃嘉宏，2014，"Ni阻障層與Ag2Te熱電基材之界面反應"，2014年台灣化學工程學會61週年年會論文，桃園, Taiwan。

131. 王仁傑、張睿紳、陳信文，2014，"Interfacial reactions at the Ag-Ge joints in the PbTe thermoelectric devices"，2014年台灣化學工程學會61週年年會論文，桃園, Taiwan。

132. S.-W. Chen, S-M. Tseng and H. Chu, 2014, "Phase diagrams of thermoelectric Co-Sb-In ternary system", 2014 International Union of Materials Research Societies (IUMRS)-International Conference on Electronic Materials(ICEM), Taipei, Taiwan.

133. J.-S. Chang and S.-W. Chen, 2014, "Phase diagram of thermoelectric Pb-Se-Sb ternary system", 2014 International Union of Materials Research Societies (IUMRS)-International Conference on Electronic Materials(ICEM), Taipei, Taiwan.

134. L.-C. Chang, J.-S. Chang and S.-W. Chen, 2014, "Liquidus projection of solar cell Ag-In-Se ternary system", 2014 International Union of Materials Research Societies (IUMRS)-International Conference on Electronic Materials(ICEM), Taipei, Taiwan.

135. W.-T. Chiu, H.-J. Wu, J.-S. Chang, S.-W. Chen, 2014, "Liquidus projection of the ternary Cu-In-Se solar cell material system", 2014 International Union of Materials Research Societies (IUMRS)-International Conference on Electronic Materials (ICEM), Taipei, Taiwan.

136. W.-A. Chen, J.-S. Chang, H.-J. Wu, S.-W. Chen, 2014, "Ni/CoSb3 interfacial reactions and Ni-Co-Sb phase equilibrium", 2014 International Union of Materials Research Societies (IUMRS)-International Conference on Electronic Materials(ICEM), Taipei, Taiwan.

137. S.-W. Chen, H.-J. Wu, 2014, "Phase equilibria of thermoelectric materials: Ag-Sb-Te and AgSbTe2-AgSbSe2" (Invited speech), presented at the 2014 CALPHAD XLIII meeting, Changsha, China.

138. W.-T. Chiu, H.-J. Wu, J.-S. Chang, S.-W. Chen, 2014, "Liquidus projection of the ternary Cu-In-Se solar cell material system", presented at the 2014 CALPHAD XLIII meeting, Changsha, China.

139. J.-S. Chang, S.-W. Chen, K.-C. Chiu, H.-J. Wu, J.-J. Chen, 2014, "Liquidus projection of thermoelectric Ag-Sn-Te ternary system", presented at the 143rd TMS annual meeting, San Diego, CA, USA.

140. S.-M. Tseng, S.-W. Chen, G. J. Snyder, 2014, "Isothermal sections of the thermoelectric Co-Sb-In ternary system", presented at the 143rd TMS annual meeting, San Diego, CA, USA.

141. S.-W. Chen, T.-K. Chen, C.-M. Hsu, J.-S. Chang, S.-M. Tseng, K. Pan, 2014, "Liquidus Projection of Sn-Ag-Co-Ni Alloys", presented at the 143rd TMS annual meeting, San Diego, CA, USA.

142. S.-W. Chen, H.-J. Wu, C.-Y. Wu, and C.-F. Chang, 2014, "Interfacial Reactions of Sn with the n-Type Bi2(Te,Se)3 and p-Type (Bi,Sb)2Te3 Thermoelectric Materials" (Invited speech), presented at the 143rd TMS annual meeting, San Diego, CA, USA.

143. S.-W. Chen, C.-M. Hsu, J.-Y. Lin and J.-S. Chang, 2014, "Ag Whisker Growth of Ag-In-Se Alloys and Alternating Layer Formation in the In/Ag2Se Reaction Couples " (Invited speech), presented at the 143rd TMS annual meeting, San Diego, CA, USA.

144. S.-W. Chen, C.-Y. Wu, H.-J. Wu, C.-F. Chang and C.-Y. Chen, 2014, " CoSb3-InSb Isoplethal Section of Co-Sb-In Ternary Phase Diagram " (Invited speech), presented at the 143rd TMS annual meeting, San Diego, CA, USA.

145. J.-S. Chang, S.-W. Chen, K.-C. Chiu, H.-J. Wu and J.-J. Chen, 2014, "Liquidus Projection of Thermoelectric Ag-Sn-Te Ternary System", presented at the 143rd TMS annual meeting, San Diego, CA, USA.

146. H.-J. Wu and S.-W. Chen, 2014, "Effect of Non-stoichiometry on the Microstructures, Phases and Thermoelectric Properties of Pseudo-binary AgSbSe2-AgSbTe2 System", presented at the 143rd TMS annual meeting, San Diego, CA, USA.

147. Y. Tang, Y. Qiu, L. Xi,, X. Shi, W. Zhang, L. Chen, Y.-C Chien, S.-M. Tseng, S.-W. Chen, and G. J. Snyder, "Phase Diagram of Ga-Co-Sb and In-Co-Ga Systems and Thermoelectric Properties of Ga/In-containing Skutterudites", presented at the 143rd TMS annual meeting, San Diego, CA, USA.

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2013

148. 邱琬婷、張睿紳、陳信文，2013，"綠色材料之液相線投影圖: Sn-Ag-Zn與Sn-Ag-In-Zn系統"，2013台灣化學工程學會60週年年會論文，台北。

149. 張莨鈞、張睿紳、陳信文，2013，"三元熱電材料Se-Sb-Te系統之液相線投影圖"，2013台灣化學工程學會60週年年會論文，台北。

150. 陳韋安、張睿紳、陳信文，2013，"Co-Sb-Ga熱電系統之CoSb3-GaSb等值剖面圖探討"，2013年中國材料科學學會年會，桃園。

151. 曾思鳴、張睿紳、陳信文，2013，"Co-Sb-In三元熱電材料之CoSb3-InSb等值剖面圖探討"，2013中國材料科學學會年會論文，桃園。

152. S.-W. Chen, C.-Y. Wu, H.-J. Wu, C.-F. Chang and C.-Y. Chen, 2013, "Reaction evolution and alternating layer formation in Sn/(Bi1-xSbx)2Te3 couples"(Invited speech), presented at the 142nd TMS annual meeting, San Antonio, TX, USA.

153. H.-J. Wu, W.-J. Foo, S.-W. Chen and G. J. Snyder, 2013, "Ternary eutectic growth of nanostructured thermoelectric Ag-Pb-Te materials", presented at the 142nd TMS annual meeting, San Antonio, TX, USA.

154. Y.-C. Chien, S.-W. Chen, J.-S. Chang and G. J. Snyder, 2013, "Liquidus projection of the ternary thermoelectric Co-Sb-Ga system", presented at the 142nd TMS annual meeting, San Antonio, TX, USA.

155. S.-W. Chen, J.-S. Chang, C.-M. Hsu, W.-T. Chiu, C.-W. Hsu and R.-B. Chang, 2013, "Liquidus projection and solidification of Sn-rich Sn-In-Ag-Zn alloys", presented at the 142nd TMS annual meeting, San Antonio, TX, USA.

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2012

156. S.-W. Chen, R.-B. Chang, C.-W. Hsu, and C.-M. Hsu, 2012, "Interfacial reactions in the Sn-20wt%In/xwt%(Ag or Zn)/(Cu, or Ni) couples", (Keynote Lecture), The International Symposium on Visualization in Joining and Welding Science through Advanced Measurements and Simulation (Visual-JW 2012), Osaka, Japan.

157. J.–S. Chang, C.-M. Hsu, and S.-W. Chen , 2012, "Liquidus projection of lead free solder alloys Ag-In-Zn ternary system", The International Symposium on Visualization in Joining and Welding Science through Advanced Measurements and Simulation (Visual-JW 2012), Osaka, Japan.

158. 陳東楷、許家銘、陳信文，2012， "Sn-Co-Ni三元系統液相線投影圖"，2012台灣化學工程學會59周年年會論文，台中。

159. 吳芷聿、吳欣潔、張鈞斐、陳信文，2012， "Sn與(Bi,Sb)2Te3熱電材料之界面反應"，2012台灣化學工程學會59周年年會論文，台中。

160. 張睿紳、 許家銘、 陳信文，2012， "銀-銦-鋅三元系統之液相線投影圖"， 2012中國材料科學學會年會論文，雲林。

161. 林哲宇、許家銘、陳信文，2012， "太陽能用三元Ag-In-Se材料中之In/Ag2Se之界面反應"，2012中國材料科學學會年會論文，雲林。

162. 錢元俊、張睿紳、陳信文，2012 ，"具熱電應用重要性的Co-Sb-Ga材料系統之液相線投影圖"， 2012中國材料科學學會年會論文，雲林。

163. J.–S. Chang, C.-M. Hsu, and S.-W. Chen , 2012, "Phase diagrams of the Ag-In-Zn ternary system", International Microsystems, packaging, assembly and Circuits Technology conference (IMPACT 2012) , Taipei.

164. T.-K. Chen, C.-M. Hsu, and S.-W. Chen, 2012, "Liquidus projection of Sn-Co-Ni ternary system", International Microsystems, packaging, assembly and Circuits Technology conference (IMPACT 2012) , Taipei.

165. J.–S. Chang, C.-M. Hsu, and S.-W. Chen , 2012, "Liquidus projection of lead free solder alloys Ag-In-Zn ternary system",The International Symposium on Visualization in Joining and Welding Science through Advanced Measurements and Simulation (Visual-JW 2012), Japan.

166. H.-J. Wu, S.-W. Chen, G. Jeffery Snyder, 2012, "Phase stability and thermoelectric properties in the non-stoichiometric AgSbTe2 thermoelectric material." MS&T annual meeting, Pittsburgh, USA.

167. H.-J. Wu, S.-W. Chen, 2012, "Reduced thermal conductivity in Pb-alloyed AgSbTe2 thermoelectric materials." 141th TMS Annual Meeting, March, Orlando, FL, USA.

168. S.-W. Chen, R.-B. Chang, C.-W. Hsu and C.-M. Hsu, 2012, "Interfacial reactions in the Sn-20wt%In-xwt%(Ag, or Zn)/(Cu, or Ni) couples", (Keynote Speech). Presented at Visual-JW 2012 (The International Symposium on Visualization in Joining & Welding Science through Advanced Measurements and Simulation) meeting, November, Osaka, Japan.

169. S.-W. Chen, K.-W. Pan, S.-W. Chen, C.-M. Hsu, and C.-W. Hsu, 2012, "Directional Solidification and Liquidus Projection of Sn-Co-Cu Alloys", (Invited Speech), Presented at the 141st (TMS 2012) TMS Annual Meeting, March , Orlando, Florida, USA.

170. H.-J. Wu, S.-W. Chen, T. Ikeda, G. J. Snyder, 2012, "Unidirectional Solidification of Eutectic Alloys in Thermoelectric Pb-Ag-Sb-Te", Presented at the 141st ( (TMS 2012) TMS Annual Meeting, March , Orlando, Florida, USA.

171. S.-K. Lin and S.-W. Chen, 2012, "Phase Equilibria and Solidification of Ternary Sn-In-Cu Alloys", Presented at the 141st ( (TMS 2012) TMS Annual Meeting, March, Orlando, Florida, USA.

172. C.-M. Chen, C.-M. Hsu and S.-W. Chen, 2012, "Interfacial Reactions in the Sn-Co-Cu/Ni Couples", Presented at the 141st ( (TMS 2012) TMS Annual Meeting, March, Orlando, Florida, USA.

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2011

173. 劉志浩、吳欣潔、陳信文，2011，“Liquidus projection of Bi-Sb-Te ternary system”，2011 台灣化學工程學會58週年年會論文，台南。

174. 張汝柏、許家銘、陳信文，2011，“Interfacial reactions between Sn-In-Zn solders and Ag, Cu substrates”2011，台灣化學工程學會58週年年會論文，台南。

175. 陳崇益、吳欣潔、陳信文，2011，“Liquidus projection of Sn-Se-Te ternary system”, 2011台灣化學工程學會58週年年會論文, 台南。

176. 邱國峻、吳欣潔、陳信文，2011，“Liquidus projection of Ag-Sn-Te ternary system”， 2011台灣化學工程學會58週年年會論文，台南。

177. 許哲瑋、許家銘、陳信文，2011，“Sn-In-Ag liquidus projection and Sn-In-Ag/Cu interfacial reactions”，2011台灣化學工程學會58週年年會論文，台南。

178. S.-W. Chen, W. Gierlotka, J.-S. Chang, C.-M. Hsu, 2011, “Phase equilibria of Ag-In-Zn ternary system” , 12th Annual Meeting of International Union of Materials Research Societies (IUMRS) - International Conference in Asia (ICA), Taipei.

179. W. Gierlotka, S.-W. Chen, H.-J. Wu, Y.-C. Huang, 2011, "CALPHAD method and its application to lead – free solder materials. ternary system", (Invited Speech), 12th Annual Meeting of International Union of Materials Research Societies (IUMRS) - International Conference in Asia (ICA), Taipei.

180. S.-W. Chen, C.-M Hsu, C.-Y. Chou and C.-W. Hsu, 2011，“Isothermal section and liquidus projection of the Sn-Zn-Ni ternary system”, (Invited Speech), 12th Annual Meeting of International Union of Materials Research Societies (IUMRS) - International Conference in Asia (ICA), Taipei.

181. H.-J. Wu and S.-W. Chen, 2011, "Liquidus projection of the ternary Ag-Sb-Te system", Presented at the 140th ( (TMS 2011) TMS Annual Meeting, March, San Diego, California, USA.

182. C.-N. Chiu, C.-M. Hsu and S.-W. Chen, 2011, "Sn-Bi-Te phase equilibria and interfacial reactions in the Sn/Bi2Te3 couples", Presented at the 140th (TMS 2011) TMS Annual Meeting, March, San Diego, California, USA.

183. S.-W. Chen, Y.-R. Lin, H.-J. Wu and H.-M. Lin, 2011, "Interfacial reactions in the Sn-(Pb)/Ni-7wt%V couples", (Invited Speech), Presented at the 140th (TMS 2011) TMS Annual Meeting, March, San Diego, California, USA.

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2010

184. 潘凱文、 陳信文，2010， "Liquidus projection of Sn-Co-Cu ."，2010中國材料科學學會年會論文集(光碟)，03-0631.

185. 陳志銘、陳信文 2010， "Sn-Co-(Cu)/Ni 固-固界面反應."，2010中國材料科學學會年會論文集(光碟)，03-0623.

186. 張証壹、張鈞斐、陳信文， 2010， "Interfacial reactions of Cu2Se/In."，2010中國材料科學學會年會論文集(光碟)，01-0626.

187. H.-J. Wu and S.-W. Chen, 2010, "Phase equilibrium in the ternary Ag-Sb-Te system." 13th Asia Pacific Confederation of Chemical Engineering Congress, 10677.

188. S.-W. Chen, H.-J. Wu and C.-M. Chen, 2010, "Unusual Phenomena Observed in Soldering: Understanding Through Thermodynamics”, Presented at the 2010 Materials Science and Technology Conference, October, Houston, Texas, USA.

189. W.-Y. Lee, S.-W. Chen, C.-F. Yang, C.-M. Hsu and H.-Y. Hsu, 2010, "Sn-In-Ag phase equilibria and Sn-In/Ag Interfacial reactions”, Presented at the 2010 Materials Science and Technology Conference, October, Houston, Texas, USA.

190. C.-M. Chen, C.-M. Hsu, S.-W. Chen, 2010, "Sn-Co-(Cu)/Ni solid/solid interfacial reactions."，2010 IMPACT conference, TW119-1.

191. Y.-R. Lin, K.-W. Pan, H.-J. Wu, S.-W. Chen, 2010, "interfacial reaction at 250oC in the Sn/Ni-7wt.%V couple."，2010 IMPACT conference, TW122-1.

192. C.-F. Yang and S.-W. Chen, 2010, “Interfacial Reactions in the Sn-In-(Zn)/Ag and Sn-In-(Zn)/Ni Couples, Presented at the 139th (TMS 2010) TMS Annual Meeting, February, Seattle, Washington, USA.

193. Y.-K. Chen and S.-W. Chen, “Interfacial Reactions in the Sn-Co/Ni and Sn-Cu-Co/Ni Couples”, (Invited Speech), Presented at the 139th (TMS 2010) TMS Annual Meeting, February, Seattle, Washington, USA.

194. Y.-C. Huang and S.-W. Chen, “Effects of Co Addition upon Sn-8.8Zn/Cu and Sn-57Bi/Cu Interfacial Reactions”, Presented at the 139th (TMS 2010) TMS Annual Meeting, February, Seattle, Washington, USA.

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2009

195. 陳信文、吳欣潔、李宛諭、黃育智、楊青峰，2009，”Sn-In/Ag及Sn-Bi/Ag界面反應、及其相關三元合金固化與相平衡”, (Invited Speech), 2009中國材料科學學會年會論文集(光碟)，C-4.

196. C.-F. Yang and S.-W. Chen, 2009, "Solidification properties and interfacial reactions with Ag and Ni substrates of Sn-In Solders with Zn addition", 2009台灣化學工程學會第56屆年會暨國科會化工學門成果發表會論文集(光碟)，I027。

197. H.-J. Wu and S.-W. Chen, 2009, "Solidification behavior in the thermoelectric ternary Ag-Sb-Te system."，2009台灣化學工程學會第56屆年會暨國科會化工學門成果發表會論文集(光碟)，I032.

198. H.-J. Wu and S.-W. Chen, 2009, "Solidification behavior in the thermoelectric ternary Ag-Sb-Te system."，2009中國材料科學學會年會論文集(光碟)，01-0946。

199. 林昱任、陳信文，2009，”SnPb銲料與Ni-7wt.%V擴散阻障層之界面反應”，2009中國材料科學學會年會論文集(光碟)，03-1021。

200. 黃育智、紀渥德、陳信文，2009，"Thermodynamic modeling and interfacial reaction of the Sn-Bi-Fe ternary system"，2009年中國材料科學學會年會論文集 (光碟)，03-0861。

201. S.-W. Chen, Y.-R. Lin and H.-J. Wu, 2009, "Interfacial reactions in the Solder/Ni-7wt%V alloy couples", (Invited Speech), Presented at 2009 MS&T, Pittsburgh, 2009/10/25-2009/10/29.

202. Y.-C. Huang, K.-H. Wu, and S.-W. Chen, 2009,“Size and Substrate Effects upon Undercooling of Pb-Free Solders”, TMS Annual Meeting, February 2009, Technical Division Student Poster Contest, EMPMD-Grad-19.

203. C.-F. Yang and S.-W. Chen, 2009, “Effect of Sn Layer Thickness upon Au/Sn/Cu Interfacial Reactions”, TMS Annual Meeting, February 2009, Technical Division Student Poster Contest, EMPMD-Grad-17.

204. C.-C. Chen, J.-G. Duh, and S.-W. Chen, 2009,“Solid/Solid Interfacial Reactions between Sn and Ni-Co Alloy", Presented at the 138th (TMS 2009) TMS Annual Meeting, February, San Francisco, California, USA.

205. S.-W. Chen and C.-H. Wang, 2009, “Interesting Phenomena Observed in The Sn/Co Interfacial Reactions”, (Invited Speech), Presented at the 138th (TMS 2009) TMS Annual Meeting, February, San Francisco, California, USA.

206. Y.-C. Huang, K.-H. Wu, and S.-W. Chen, 2009,“Size and Substrate Effects upon Undercooling of Pb-Free Solders”, Presented at the 138th (TMS 2009) TMS Annual Meeting, February, San Francisco, California, USA.

207. W. Gierlotka, S.-W. Chen, and S.-K. Ling, 2009, “Thermodynamic Modeling Studies of the Cu-In And Sn-In-Cu Systems”, Presented at the 138th (TMS 2009) TMS Annual Meeting, February, San Francisco, California, USA.

208. C.-H. Wang, and S.-W. Chen, 2009,“The Peltier Effects upon Interfacial Reactions in the Soldering System”, Presented at the 138th (TMS 2009) TMS Annual Meeting, February, San Francisco, California, USA.

209. C.-F. Yang and S.-W. Chen, 2009 “Interfacial Reactions in the Au/Sn/Cu Sandwich Couples”, Presented at the 138th (TMS 2009) TMS Annual Meeting, February, San Francisco, California, USA.

210. H.-J. Wu, L.-L. Huang, S.-W. Chen, J.-W. Lee, and Y.-T. Lee, 2009, “Anodization of Dental Archwires and Miniscrews”, Presented at the 138th (TMS 2009) TMS Annual Meeting, February, San Francisco, California, USA.

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2008

211. S.-W. Chen, Y.-K. Chen, H.-J. Wu, ad Y.-C. Huang, 2008, "Solidification of Sn-Bi-Ag and Sn-Bi-Ni alloys", (Invited Speech), Presented at 2008 MS&T, Pittsburgh, 2008/10/5-2008/10/9.

212. 陳昱愷、陳信文，2008，”Sn-0.06wt.%Co銲料對Ni基材界面反應之研究”，2008年中國材料科學學會年會暨學會四十周年慶(光碟)，P03-129。

213. 王朝弘、邱政男、陳信文，2008，”內凹角處界面反應之探討”，2008年中國材料科學學會年會暨學會四十周年慶(光碟)，P03-090。

214. 吳欣潔、陳信文，2008，”牙齒矯正線與微型骨釘陽極處理之微結構分析”，2008年中國材料科學學會年會暨學會四十周年慶(光碟)，P02-037。

215. 李宛諭、陳信文，2008，”Interfacial Reactions in the Sn-In/Ag Couples”， 2008台韓日三國化工會議與台灣化學工程學會55週年年會暨國科會化工學們成果發表會(光碟)，PS8024。

216. 黃育智、陳信文，2008，”Sn-Cu-(Ni)/Cu Interfacial Reactions”，2008台韓日三國化工會議與台灣化學工程學會55週年年會暨國科會化工學們成果發表會(光碟)，PS8021。

217. 陳志吉、陳信文，2008，”Solid State Interfacial Reactions in Sn/Ni-Co Couples”，2008台韓日三國化工會議與台灣化學工程學會55週年年會暨國科會化工學們成果發表會(光碟)，PS8018。

218. 楊青峰、陳信文，2008，”Effect of Sn Layer Thickness on Au/Sn/Cu Interfacial Reactions”，2008台韓日三國化工會議與台灣化學工程學會55週年年會暨國科會化工學們成果發表會(光碟)，KS8002。

219. 王朝弘、陳信文，2008，”Investigation of Sn/Ni Interfacial Reactions with Electric Current Passage”，2008台韓日三國化工會議與台灣化學工程學會55週年年會暨國科會化工學們成果發表會(光碟)，OS1006。

220. W. Gierlotka, S.-W. Chen, A.-R. Zi and P.-Y. Chen, 2008, "Thermodynamic Modeling of the Sn-Sb-Ag and Sn-Sb-Cu Systems", Presented at the 137th TMS Annual Meeting, New Orleans, Louisiana, USA.

221. C.-H. Wang and S.-W. Chen, 2008, "Sn/Co Interfacial Reactions", (Invited Speech), Presented at the 137th TMS Annual Meeting, New Orleans, Louisiana, USA.

222. C.-C. Chen, S.-W. Chen and C.-H. Chang, 2008, "Reaction Phases in the Sn/Ni-V Couples", Presented at the 137th TMS Annual Meeting, New Orleans, Louisiana, USA.

223. Y.-C. Huang and S.-W. Chen, 2008, "Liquidus projection of the Sn-Zn-Cu ternary system", Presented at the 137th TMS Annual Meeting, New Orleans, Louisiana, USA.

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2007

224. 陳志吉、陳信文，2007，"Sn-0.7wt.%Cu/Ni-7wt.%V之固態界面反應"，2007中國材料科學學會論文集(光碟)，P03-109。

225. 黃育智、陳信文，2007，"Solidification of the ternary Sn-Zn-Cu alloys", 中國化學工程學會第五十四屆年會暨國科會化學工程學門成果發表會，TI-023.

226. 邱政男、陳信文，2007，“Sn-(Bi)/Te之固固界面反應”，2007年台灣化學工程學會第54屆年會暨國科會化工學門成果發表會 (光碟)，TI-029.

227. C.-F. Yang, L.-L. Huang, W. Gierlotka, and S.-W. Chen, 2007, Phase Equilibria of Sn-Zn-Bi Ternary System.", 2007年中國化學工程學會年會論文全集(光碟)，TI-033.

228. W. Gierlotka, S.-W. Chen, “Thermodynamic and phase equilibria study of Sn-Sb binary system”, 2007 Annual Meeting of the Chinece Society for the Material Science, November 17, 2007, Hsinchu.

229. Y.-C. Huang, W. Gierlotka and S.-W. Chen, 2007, “Dissolution and interfacial reactions of Fe in molten Sn-Pb and Pb-free solders”, TMS Annual Meeting, March 2007, Technical Division Student Poster Contest, EMPMD-Grad-11.

230. Y.-C. Huang and S.-W. Chen, 2007, "Interfacial reactions between the molten Sn-Zn and Sn-Cu solders and the Fe substrate", Presented at the 136th (TMS 2007) TMS Annual Meeting, March 2007, Orlando, Florida.

231. S.-W. Chen, S.-H. D. Wong, C.-M. Hsu, C.-H. Wang, S.-K. Lin, Y.-C. Huang, 2007, "Effects of electromigration on interfacial reactions", Presented at the 136th (TMS 2007) TMS Annual Meeting, March 2007, Orlando, Florida.

232. C.-F. Yang, K.-H. Wu, C.-H. Wang, and S.-W. Chen, 2007, "Interfacial Reactions of Sn-8Zn-3Bi Solder with Cu, Ni, and Ag Substrates.", Presented at the 136th (TMS 2007) TMS Annual Meeting, February, Orlando, Florida, USA.

233. S.-K. Lin and S.-W. Chen, 2007, “Liquation phenomena in the Sn-In/Ni interfacial reactions”, 136th TMS Annual Meeting & Exhibition, February 25-March 1, 2007, Orlando, Florida, USA.

234. S.-W. Chen, C.-C. Chen and C.-N. Chiu, 2007, “Unusual interfacial reactions in the Sn/Ni-7wt.%V and Sn/Te couples”,(Invited Speech), Presented at the 136th (TMS 2007) TMS Annual Meeting, February 2007, Orlando, Florida, USA.

235. S.-W. Chen, C.-N. Chiu, S.-K. Lin, C.-H Wang and C.-F Yang, 2007, “Interfacial Reactions and Phase diagrams of Pb-Free Solders and Related Materials Systems”, Presented at the 136th (TMS 2007) TMS Annual Meeting, February 2007, Orlando, Florida, USA.

236. C.-N. Chiu and S.-W. Chen, 2007, “Cruciform pattern interfacial reactions in the Sn-(Bi)/Te couples”, Presented at the 136th (TMS 2007) TMS Annual Meeting, February 2007, Orlando, Florida, USA.

237. S.-K. Lin, Y. Yorikado, K.-S. Kim, K. Suganuma, S.-W. Chen, M. Tsujimoto and I. Yanada, 2006, “Mechanical deformation-induced Sn whisker formation and microstructure development in electroplated films”, 136th (TMS 2007) TMS Annual Meeting & Exhibition, Technical Division Student Poster Contest, February 25-March 1, 2007, Orlando, Florida, USA.

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2006

238. W. Gierlotka, F.-L. Chen, S.-W. Chen, “Thermodynamic and phase equilibrium study of Sn-Zn-Bi ternary system”, 2006 International Conference on Chemical and Molecular Technologies, December 9, 2006, Tainan.

239. S.-W. Chen, S.-K. Lin, C.-N. Chiu and Y.-C. Huang, "Electromigration effects upon interfacial reactions in teh Pb-free solder joints", 2006 International Conference on Chemical and Molecular Technologies, (Invited lecture), Dec. 9, 2006, Tainan.

240. 趙益祥、陳信文、張志鴻，2006，”Sn-Co-Ni之合金相平衡及其界面反應”，2006中國材料科學學會論文集(光碟)，P03-049.

241. 訾安仁、陳信文，2006，”錫-銻-銅三元系統在250oC之相平衡與錫-銻/銅界面反應”，2006年中國化學工程學會年會論文全集(光碟)，8-P08.

242. 陳伯胤、陳信文，2006，”錫-銻-銀界面反應與錫-銻-銀相平衡”， 2006年中國化學工程學會年會論文全集(光碟)，8-P08.

243. Ching-feng Yang and Sinn-wen Chen, “Sn-Zn-Bi銲料之界面反應與濕潤性”, 2006台灣化學工程學會第53屆年會國科會化工學門成果發表研討會論文集(光碟)，4-P37.

244. Ching-feng Yang and Sinn-wen Chen, “ Interfacial Reactions in the Sn-20at.%In/Ag Couples and Phase Equilibria of the Sn-In-Ag Ternary System”, 2006國際微電子暨構裝學會台灣分會國際研討會論文集(光碟).

245. 黃育智、陳信文，2006，“無鉛波焊中的界面反應”, 台灣化學工程學會第五十三屆年會暨國科會化學工程學門成果發表會(光碟)，4P-11.

246. Y.-C. Huang and S.-W. Chen, 2006, "Interfacial Reactions in the Lead-Free Wave Soldering", IMAPS-Taiwan 2006 international technical symposium.

247. 陳信文、邱政男、王朝弘、林士剛、陳志吉，2006，“無鉛銲點界面反應與其相圖”， 2006中國材料科學學會論文集(光碟)，F05-09.

248. 邱政男、陳信文，2006，“Sn-(Bi)/Te液固界面反應之探討”，2006中國材料科學學會論 文集(光碟)，P03-046.

249. S.-W. Chen and C.-N. Chiu, 2006, “Interfacial reactions in the Sn/Te couples”, Presented at the 2006 E-MRS Fall meting, September 2006,Warsaw, Poland.

250. 王朝弘、陳信文，" 電流作用對Sn/Cu界面反應之影響"，2006年中國材料學會年會論文摘要集(光碟)，P03-048.

251. C.-H. Wang and S.-W. Chen, 2006, "Cu diffusion in Sn/Cu couples by electromigration", Presented at 2006 EMRS fall meeting, Warsaw, Poland.

252. S.-W. Chen, P.-Y. Chen and C.-H. Wang, 2006, "Melting point lowering of the Sn-Sb alloys caused by substrate dissolution", (Invited Speech), Presented at the 135th TMS Annual Meeting, San Antonio, Texas.

253. C.-H. Wang and S.-W. Chen, 2006, "Cu content and size effects upon the reaction layer detachment in the Sn-Cu/Ni couples", Presented at the 135th (TMS 2005) TMS Annual Meeting, San Antonio, Texas.

254. 林士剛、陳信文，2006，” 先進軟板構裝中無鉛銲料電鍍層Sn鬚成長之探討”，2006 台灣化學工程學會五十三週年 (94年年會)暨國科會化學工程學門成果發表會(光碟)，8P-17.

255. Shih-kang Lin, Yuhi Yorikado, Keun-Soo Kim, Katsuaki Suganuma, Sinn-wen Chen, Masanobu Tsujimoto and Isamu Yanada, 2006, “Sn Whiskers Growth on Electroplated Lead-free Solder Finish for Advanced Flexible Electronic Packaging”, Presented at the Sanken International Symposium on Nanoscience and Nanotechnology-2006 (SISNN-2006), September 19-20 2006, Osaka, Japan.

256. Shih-kang Lin, and Sinn-wen Chen, 2006, “Liquidus projection and solidification of the Sn-In-Cu ternary alloys”, Presented at the International Microelectronic and Packaging Society-Taiwan 2006 (IMAPS-Taiwan 2006), June 28-July 1, 2006, Taipei, Taiwan.

257. Y.-C. Huang, S.-W. Chen, S.-K. Lin, C.-H. Chang, and J.-C. Wu, 2006, “Heat Treatment of the Thermal Spray Objects”, 135th TMS Annual Meeting & Exhibition, Technical Division Student Poster Contest, March 12-16, 2006, San Antonio, Texas, USA. SMD-Grad-54.

258. S.-K. Lin and S.-W. Chen, 2006, “Electromigration induced High Reactive Diffusion Path in Sn-In/Cu Joints”, 135th TMS Annual Meeting & Exhibition, Technical Division Student Poster Contest, March 12-16, 2006, San Antonio, Texas, USA.

259. S.-K. Lin and S.-W. Chen, 2006, “Current direction effects upon interfacial reactions in the Sn-In/Cu joints”, 135th TMS Annual Meeting & Exhibition, March 12-16, 2006, San Antonio, Texas, USA.

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2005

260. S.-W. Chen, T.-Y. Chung, S.-K. Lin, and C.-F. Yang, 2005, "Phase Equilibria of the In-Sn-Cu System and the In-Sn/Cu Interfacial Reactions", (Invited Speech), Presented at 2005 MS&T, Pittsburgh, 2005/9/24-2005/9/29.

261. 周沁怡、陳信文，2005，”錫-鋅-銅無鉛銲料與銅、鎳之界面反應”，2005中國材料科學學會論文集(光碟)，2-1-P-058.

262. 陳鳳鴒、陳信文、謝克昌，2005，”Sn-Cu無鉛銲料之熱力學性質量測”，2005中國材料科學學會論文集(光碟)，2-1-P-019.

263. 陳伯胤、王朝弘、陳信文，2005，”錫-銻/銀界面反應”，2005中國材料科學學會論文集(光碟)，2-1-P-004.

264. 楊青峰、訾安仁、陳信文，2005，”錫-鎳-磷三元系統相圖”，2005中國材料科學學會論文集(光碟)，2-1-P-003.

265. 林士剛、陳信文，2005，”電流方向對In-Sn/Cu界面反應的影響”，2005中國材料科學學會論文集(光碟)，2-1-O-004.

266. 王朝弘、陳信文，2005，”Sn-0.7wt%/Cu/Ni在250℃之界面反應”，2005中國材料科學學會論文集(光碟)，2-1-I-002.

267. 陳志吉、陳信文，2005，”溫度效應對錫與鎳-7wt.%釩之界面反應之影響”, 中國化學工程學會五十二週年 (94年年會)暨國科會化學工程學門成果發表會(光碟)，OT-2.

268. 黃育智、陳信文、張家華、吳貞欽，2005，“熔射物件之熱處理”, 國防部軍備局中山科學研究院94年度國防科技學術合作計劃成果發表會論文集.

269. 黃育智、陳信文、張家華、吳貞欽，2005，”熔射物件之界面反應”, 中國化學工程學會五十二週年(94年年會)暨國科會化學工程學門成果發表會(光碟)，OM-2.

270. 林士剛、陳信文，2005，”溫度效應在銦錫合金對鎳之固態界面反應的影響”, 中國化學工程學會五十二週年 (94年年會)暨國科會化學工程學門成果發表會(光碟)，OM-1.

271. 陳信文、王朝弘、林士剛、陳志吉，2005，”電流效應對電子產品中界面反應之影響”, (Invited Speech),中國化學工程學會五十二週年 (94年年會)暨國科會化學工程學門成果發表會(光碟)，pp.28.

272. S.-K. Lin, T.-Y. Chung, C.-F. Yang and S.-W. Chen, "Interfacial reactions in the Sn-20at.%In/Cu couples and phase equilibria of the In-Sn-Cu ternary system", IMAPS-Taiwan 2005 international technical symposium proceeding and CD, pp.149-154.

273. C.-H. Wang and S.-W. Chen, "Electric current effects in the flip chip solder joints", IMAPS-Taiwan 2005 international technical symposium proceeding and CD, pp.190-192.

274. C.-Y. Chou and S.-W. Chen, 2005, "Interfacial reactions and phase equilibria in the Al-Cu/Ta systems", Presented at the 134th (TMS 2005) TMS Annual Meeting, March 2005, San Francisco, California.

275. C.-C. Chen, S.-W. Chen and C.-Y. Kao, 2005, "Interfacial reactions in the Sn-(Ag)/(Ni,V) couples and phase equilibria of the Sn-Ni-V system at the Sn-rich corner", Presented at the 134th (TMS 2005) TMS Annual Meeting, March 2005, San Francisco, California.

276. S.-W. Chen, S.-K. Lin and C.-F Yang, 2005, "Interfacial reactions in the Pb-free composite solders with indium layers”, Presented at the 134th (TMS 2005) TMS Annual Meeting, March 2005, San Francisco, California.

277. S.-W. Chen, 2005, " Phase Equilibria of Sn-Ag-Cu-Ni and Sn-In-Cu-Ni Systems", COST Materials, Action 531, February 24-26, 2005, Lausanne, Switzerland.

278. S.-W. Chen, C.-H. Wang, C.-C. Chen, and S.-K. Lin, 2005, "Electric current effects upon interfacial reactions in the solder joints", (Invited Speech), Presented at the SEMICON Korea 2005, February, 2005 , Seoul, Korea.

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2004

279. 鍾定穎、陳信文，2004，”In-Sn-Cu三元系統相平衡”， 2004年中國化學工程學會年會論文全集(光碟)，pp. 1439-1442.

280. 楊喬陵、陳信文，2004，” 牙齒矯正線之表面處理”， 2004年中國化學工程學會年會論文全集(光碟)，pp. 469-472.

281. 林士剛、M. Marin、陳信文，2004，”In-Sn/Cu與In-Sn/Ni的界面反應”， 2004年中國化學工程學會年會論文全集(光碟)，pp. 399-402.

282. 邱政男、陳信文，2004，” Sn-Ag-Cu-Ni四元系統之相平衡”， 2004年中國化學工程學會年會論文全集(光碟)，pp. 13-16.

283. S.-W. Chen, S.-K. Lin and C.-F. Yang, 2004, “Lead-free composite solder with an indium layer”, (Invited Speech), 2004年中國材料學會年會論文集(光碟)，OB1-06.

284. C.-Y. Chou and S.-W. Chen, 2004, “Interfacial reactions in the Al-Ta couples”, 2004年中國材料學會年會論文集(光碟)，OB1-03.

285. C.-F. Yang, T.-Y. Chung, Y.-M. Tsai and S.-W. Chen, 2004, 2004年中國材料學會年會論文集(光碟)，PB1-044.

286. C. A. Chang, Y.-C. Huang and S.-W. Chen, 2004, “Solidification of the quaternary Sn-Ag-Cu-Ni alloys”, (Invited Speech), Presented at the Materials Science and Technology 2004 (TMS Fall) Meeting, September 26-29, 2004 , New Orleans, Louisiana.; 2004年中國材料學會年會論文集(光碟)，PB1-051.

287. S.-W. Chen, C.-A. Chang and M. Gueguen, 2004, “Liquidus projection of the quaternary Sn-Ag-Cu-Ni system and the alloy’s phase formation sequence during solidification”, presented at the 16th International Congress of Chemical and Process Engineering, CHISA 2004 Summaries 2, (D 3.8), pp. 530-531, August 22-26, 2004, Praha, Czech Republic.

288. 陳信文，”相圖、電遷移、與界面反應”，2004, (Invited Speech), 無鉛銲料研發成果及展望研討會，成功大學，February 27, 2004。

289. S.-W. Chen, “Electromigration effects upon the Pb-free solder/Nickel interfacial reactions in the electronic products”, (Invited Speech), Second 21st Century COE, “Towards Creating New Industries Based on Inter-Nanoscience”, 7th Sanken International Symposium on Hybridization of Chemistry, Biology and Materials Science, pp. 40-41, January 13-14, 2004, Osaka, Japan.

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2003

290. 張辰安、Mathieu Gueguen、陳信文，2003，”Sn-Ag-Cu-Ni四元系統相平衡圖與液相線投影”，中國材料科學學會2003年年會論文集(光碟)，PM-013.

291. 林士剛、陳信文，2003，”電遷移對Sn/Cu/Ni/Sn/Cu/Sn界面反應之影響”，中國材料科學學會2003年年會論文集(光碟)，OM-004.

292. 張辰安、陳信文，2003，”富錫區錫-銀-銅-鎳之相平衡”, 中國化學工程學會五十週年慶(92年年會)暨國科會化學工程學門成果發表會(光碟)，5-08.

293. 林子瑋、陳信文，2003，”鈦鎳合金的Pourbaix圖”, 中國化學工程學會五十週年慶(92年年會)暨國科會化學工程學門成果發表會(光碟)，5-07.

294. 高靖雅、饒瑞孟、陳信文，2003，”電流對銲料中不連續相偏析之影響”, 中國化學工程學會五十週年慶(92年年會)暨國科會化學工程學門成果發表會(光碟)，3-36.

295. S.-W. Chen, S.-W. Lee, C.-H. Wang and M.-C. Yip, ”Relationship between mechanical properties and intermetallic compound formation at the Sn-0.7(0.5, 0.3, 0.1)wt%Cu/Ni joints” (Invited Speech), Presented at the 132nd (TMS 2003) TMS Annual Meeting, March 2003, San Diego, California.

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2002

296. 陳信文、許秀鳳、申有田、顏怡文，2002，"銀-錫/銅與錫-銦/銅系統界面反應的熱力學與動力學探討"，2002年中國化學工程學會年會暨專題研討會論文集(光碟)，C_19.

297. Loic Lerouge、饒瑞孟、陳信文、楊立明、陳志銘，2002，"錫-釩二元系統相平衡及錫/釩反應偶之界面反應"，2002年中國材料學會年會論文集(光碟)，OJ-12-演B.

298. 許秀鳳、陳信文，2002，"錫-銀-鎳三元相平衡圖與錫-銀/鎳界面反應"，2002年中國材料學會年會論文集(光碟)，OJ-10-演B.

299. 李守維、陳信文，2002，"Sn/(Cu,Ni)反應偶之界面反應"，2002年中國材料學會年會論文集(光碟)，OJ-7-演B.

300. S.-W. Chen, S.-H. Wu, C.-M. Chen and C.-H. Wang, 2002, "Electromigration effects upon the lead-free solder joints", Oral index #32 (CD), Presented at the 2002 Taiwan/Korea/Japan Chemical Engineering Conference, October 2002, Taipei, Taiwan.

301. S.-W. Chen, H-Y. Chang, J.-I Lee and E. Viard, 2002, "Determination of reactive wetting properties of Sn-Sn-Cu, Sn-Ag and Sn-Pb alloys by using a wetting balance technique", Presented at the 4th International Conference on Materials for Microelectronics and Nanoengineering, June 2002, Espoo Finland, Published by IOM communications, pp. 173-176.

302. S.-W. Chen and C.-H. Lin, “Phase equilibria and solidification properties of Sn-Cu-Ni alloys”, (Invited Speech), Presented at the 131st (TMS 2002) TMS Annual Meeting, February 2002, Seattle, Washington.

303. 陳信文、陳志銘、王朝弘，2002，"無鉛銲料系統之相平衡與界面反應研究"，第二屆海峽兩岸清華大學先進材料研討會論文集，pp. 218-219.

304. 陳信文，2002，"無鉛銲錫接點之界面反應"，海峽兩岸清華大學化學工程學系學術研討會論文集，p. 17.

305. 王朝弘、李守維、陳信文、顧詩章，2002，"覆晶銲料隆點之界面反應探討"，中華民國第七屆破壞科學研討會論文集 (光碟)，B4-07.

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2001

306. 陳志銘、陳信文，2001，"往返電流對界面影響之模擬計算"，第二十三屆輸送現象與其應用專題研討會專輯， pp.105-108.

307. 陳信文、申有田、吳時涵，2001，"銦-錫-銅三元合金之液相線投影與固化性質"，2001年中國化學工程學會年會暨專題研討會論文集，pp. 67-70.

308. 張秀玉、E. Viard、李柔儀、陳信文，"以濕潤天平量測Sn、Sn-Cu、與Sn-Pb之濕潤性"，2001年中國材料學會年會論文摘要集，P10-12, p. 236.

309. 王朝弘、陳信文、張家華、吳貞欽，"Sn-Cu-Ni三元系統相平衡及界面反應"，2001年中國材料學會年會論文摘要集，P02-12, p. 34.

310. 王朝弘、陳信文、張家華、吳貞欽，"Al-Cu-Ni三元系統在800oC下的相平衡及界面反應"，2001年中國材料學會年會論文摘要集，P02-11, p. 34.

311. C.-M. Chen, S.-W. Chen and M.-Y. Du, 2001, “Effects upon Interfacial Reactions by Electric Currents of Alternating Directions”, Presented at the 2001 TMS Fall Meeting, Indianapolis, Indiana, USA；2001年中國材料學會年會論文摘要集，O10-02, p. 229.

312. S.-W. Chen, 2001, “Phase transformations and interfacial reactions in electronic materials”, Invited speech, Presented at the 2001 ChemTech Conference, Chicago, Illinois, USA. Conference Booklet, pp. 18-19.

313. 陳志銘、杜美瑤、陳信文，2001，"電遷移對銲點界面反應的影響"，海峽兩岸清華大學先進材料研討會論文集，pp. 235-242.

314. C.-M. Chen, S.-W. Chen and M.-Y. Du, 2001, “Electromigration effect upon the Sn-0.7wt%Cu/Ni and Sn-3.5wt%Ag/Ni interfacial reactions”, Presented at the 130th TMS Annual Meeting, New Orleans, Louisiana, USA.

315. S.-W. Chen and Y.-W. Yen, 2001, “Interfacial reactions in the Ag-Sn/Au couples”, Invited speech, Presented at the 130th TMS Annual Meeting, New Orleans, Louisiana, USA.

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2000

316. 王朝弘、陳信文、張家華、與吳貞欽，2000，"熔射製程中鍍層與基材界面之相變化"，中華民國鑄造學會八十九年度論文發表會論文集，pp. 233-236 (NSC89-2623-7-007-007).

317. C.-M. Chen and S.-W. Chen, 2000, “Interfacial Reactions in Zn/Ni and Bi/Ni Couples”, Presented at the 129th TMS Annual Meeting, Nashville, Tennessee, USA.

318. S.-W. Chen and C.-W. Huang, 2000, “Interfacial Reactions in In-Sn/Ni Couples and Phase Equilibria of In-Sn-Ni System”, Presented at the 129th TMS Annual Meeting, Nashville, Tennessee, USA.

319. 郭政雨、呂世源、周更生、與陳信文，2000，"Heat Dissipating Performance of Reticulated Aluminum Structures", The 2000 CIChE Annual Meeting and Conferences, Proceedings 2000 Symposium on Transport Phenomena and Applications, pp. 309-312.

320. 周更生、劉建偉、宋敏安、陳信文、與呂世源，2000，"以泡棉為模子製備低密度鋁金屬網體"，中國材料科學學會89年會論文集 (光碟)，B-46P.

321. 劉建偉、宋敏安、周更生、陳信文、與呂世源，2000，"以鹽粒子製備低密度多孔金屬鋁之研究"，中國材料科學學會89年會論文集 (光碟)，B-41P.

322. 陳志銘與陳信文，2000，"不同溫度下電遷移對錫/鎳與錫/銀界面反應的影響"，中國材料科學學會89年會論文集 (光碟)，H-07.

323. 顏怡文與陳信文，2000，"錫-銀合金與金基材的界面反應"，中國材料科學學會89年會論文集 (光碟)，H-03.

324. 顏怡文與陳信文，2000，"無鉛銲料與基材的界面反應"，中華民國第六屆破壞科學研討會論文集 (光碟)，H-3.

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1999

325. 顏怡文與陳信文，1999，"銀-錫-銅三元系統在450℃與240℃的相平衡"，中國材料科學學會88年會論文集(光碟)，L-06.

326. 陳志銘與陳信文，1999，"電遷移效應對鋅/鎳與鉍/鎳界面反應的影響"，中國材料科學學會88年會論文集(光碟)，H-48.

327. 羅士杰、王朝弘與陳信文，1999，"鎳�{鉻合金與鋯的界面反應"，中國材料科學學會88年會論文集 (光碟)，B-35.

328. 李正德、陳信文與楊志超，1999，"Al3Ti與TiB2添加量對鋁合金細晶化之影響"，中國材料科學學會88年會論文集 (光碟)，B-18.

329. 陳志銘、陳信文、何俊昇與林志豪，1999，"鈦-鎳-釩三元合金相平衡"，1999中國化工學會年會化學工程技術研討會專輯， pp. 357-360. (NSC88-2216-E-007-039)

330. 李正德、陳信文與楊志超，1999，"純鋁、Al-3wt％Mg及Al-7wt％Si合金之細晶研究"，1999中國化工學會年會化學工程技術研討會專輯， pp. 269-272.

331. 陳心怡、陳信文與王進龍，1999，"鍺-銻-硒-錫硫屬玻璃性質之研究"，1999中國化工學會年會化學工程技術研討會專輯， pp. 5-8. (88-CS-D-007-010)

332. 黃清育與陳信文，1999，"銦/鎳與銦-錫/鎳反應偶的界面反應"，1999中國化工學會年會輸送現象與其應用專題研討會專輯， pp. 115-118. (NSC89-2214-E-007-006)

333. S.-W. Chen and Y.-W. Yen, 1999, “Phase Diagram Calculation and Its Applications”, Invited speech, Presented at Workshop on Computational Materials Science, National Center for High-Performance Computing, Hsin-Chu, Taiwan, ROC.

334. Y.-W. Yen and S.-W. Chen, 1999, “Interfacial Reactions in the Ag-Sn/Cu Couples”, Invited speech, Presented at the 128th TMS Annual Meeting, San Diego, California, USA. (NSC87-2214-E-007-021).

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1998

335. 陳志銘與陳信文，1998，"電遷移效應對質傳現象之影響"，1998輸送現象與其應用專題研討會專輯， pp. 183-186. (NSC87-2214-E007-021)

336. 顏怡文與陳信文，1998，"銀–錫合金與銅基材的界面反應"，中國材料科學學會1998年度年會論文集(第H冊)， pp. 63-66. (NSC86-2745-E007-005R)

337. 陳建豪、陳信文與王進龍，1998，"As-Te/Zn及As-Si-Te/Zn的界面反應"，中國材料科學學會1998年度年會論文集(第H冊)， pp.49-52. (CS87-0210-D-007-002)

338. 陳志銘與陳信文，1998，"電流對錫/銀界面反應的影響"，中國材料科學學會1998年度年會論文集(第H冊)， pp.7-10. (NSC87-2214-E007-021)

339. S.-W. Chen, C.-M. Chen, and W.-C. Liu, 1998, "The Electric Current Effects Upon the Sn\Cu and Sn\Ni Interfacial Reactions", Presented at the 127th TMS Annual Meeting, San Antonio, Texas, USA. (NSC87-2214-E-007-021).

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1997

340. 顏怡文與陳信文，1997，"熔融銀–錫銲料與銅基材的界面反應"，1997輸送現象與其應用專題研討會專輯， pp. 427-432. (NSC86-2745-E007-005R)

341. 陳志銘、劉文銓與陳信文，1997，"電流對錫/鎳界面反應的影響"，1997輸送現象與其應用專題研討會專輯， pp. 195-200. (NSC87-2214-E007-021)

342. 陳建豪、陳信文與王進龍，1997，"As-82.1wt%Te/Zn的界面反應"，1997輸送現象與其應用專題研討會專輯， pp.171-175.

343. 戴逸明、陳信文與王進龍，1997，"高玻璃轉化點砷-矽-碲硫屬玻璃研究"，中國材料科學學會1997年度年會論文集(第F冊)， pp.83-86.

344. 陳信文、鄭世璋與林旻弘，1997，“鋁基複合材料的固化特性”, 中國材料科學學會1997年度年會論文集(第A冊)， pp.49-52. (NSC86-2216-E-007-025)

345. S.-W. Chen, 1997, "Determination of Solidification Curves of Alloys", Invited speech, Presented at the Australasia Pacific Forum on Intelligent Processing & Manufacturing of Materials, July 14-17, 1997, Proceedings of the IPMM'97, eds., T. Chandra, S. R. Leclair, J. A. Meech, B. Verma, M. Smith, and, B. Balachandran, pp. 1164-1170, Watson Ferguson & Co., Brisbane.

346. S.-W. Chen and M.-H. Lin, 1997, “Interfacial reactions in the As-Se/Zn couples”, Presented at the 126th TMS Annual Meeting, Orlando, Florida, USA. (NSC 85-2815-C007-01-028E).

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1996

347. 顏怡文與陳信文，1996，"以化學氣相沉積-循環式流體化床反應器進行氧化鋁粉粒表面鍍鎳與鍍銅"，1996輸送現象與其應用專題研討會專輯， pp. 191-196. (NSC85-2214-E-007-023)

348. 鄭世璋與陳信文，1996，“鋁合金的固化特性”, 中國材料科學學會1996年度年會論文集(第一冊)， pp. 439-440. (NSC85-2216-E-007-042)

349. S.-J. Jeng and S.-W. Chen, 1996, "Determination of the Solidification Characteristics of the A356.2 Aluminum Alloy", Presented at The Fifth International Conference on Aluminium Alloys, Grenoble, France. Proceedings of The Fifth International Conference on Aluminium Alloys, Materials Science Forum, Volumes 217-222, Part 1,eds., Driver, Dubost, Durand, Fougeres, Guyot, Sainfort, and Suery, pp. 283-288, Transtec Pub., Switzerland. (NSC85-2216-E-007-042)

350. S.-D. Ho, S.-W. Chen and J.-L. Wang, 1996, "The As-Se Chalcogenide Glass", APCChE '96, Proceedings of The 7th Congress of the Asian Pacific Confederation of Chemical Engineers, Vol. 3, pp. 1030-1034.

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1995

351. 蘇立和與陳信文，1995， "電子構裝中界面反應的輸送現象"， 1995年輸送現象與其應用研討會專輯，台北市臺灣大學， pp. 287-291。 (NSC83)

352. C.-C. Chen, S.-W. Chen and Yee-wen Yen, 1995, "Titanium Deposition on the Alumina Particles by Using CVD-FBR Technology", Presented at the 1995 AIChE Annual Meeting, Miami, FL, USA. AIChE Symposium Series Vol. 92 (313),Progress in Fluidization and Fluid Particle Systems, ed. D. King, AIChE, New York, pp. 96-99. (NSC84-2214-E-007-019)

353. 蘇立和、顏怡文、羅惠慈與陳信文1995， "錫與銦和銅基材的界面反應",中國材料科學學會84年度年會，台中市中興大學，中國材料科學學會84年度年會論文集(下)， pp. 306-307。 (NSC83-0115-C007-01-006E)

354. 羅惠慈與陳信文，1995， "鎳基材與熔融銅銀合金的界面反應", 中國材料科學學會84年度年會，台中市中興大學，中國材料科學學會84年度年會論文集(上)，pp. 54-55。 (NSC82-0405-E-007-285)

355. S.-J. Jeng, S.-W. Chen, and C.-C. Huang, 1995, "Determination of the Solidification Curve of the 7075 Aluminum Alloy by Using DTA and Mathematical Modeling", Presented at the 124th TMS Annual Meeting, Las Vegas, NV, USA.Light Weight Alloys for Aerospace Applications III, eds., E. W. Lee, N. J. Kim, K. V. Jata, and W. E. Frazier, TMS, Warrendale, PA, pp. 219-216. (NSC84-2216-E-007-027)

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1994

356. C.-C. Chen and S.-W. Chen, 1994, "Surface Treatments of Particles by Using the Fluidized Bed Technology", Proceedings of Taipei-Kyushu Joint Symposium on Chemical Engineering & Symposium on Transport Phenomena and Applications, Taipei, pp.175-178. (NSC 83-0402-E-007-018)

357. S.-W. Chen and H.T. Luo, 1994, "Reactions of the (Ag,Cu) Braze with the Ni Substrate in the Microelectronic Joining Processes", Presented at the 123th TMS Annual Meeting, San Francisco, USA.

358. 陳信文，1994, "使用差比式熱分析儀(DTA)及數學模型來測定7000系列鋁合金的固化曲線", 第一屆「鑄造與鋼鐵材料研究成果及應用技術」研討會，台南市成功大學。

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Before 1992

359. S.-W. Chen and Y.A. Chang, 1990, "Phase Equilibria and Solidification of Al-rich Al-Li-Cu Alloys", Presented at the 1990 MRS Spring Meeting, San Francisco, CA, USA. MRS Proceedings, Vol. 186, Alloy Phase Stability and Design, 1991, G.M. Stocks, D.P. Pope, and A.F. Giamei, eds., MRS, Pittsburgh, USA, pp.141-146.

360. S.-W. Chen, J.-C. Lin, Y.A. Chang and M.G. Chu, 1990, "Phase Equilibria and Solidification of Al-rich Al-Li-Cu Alloys", Presented at 119th TMS Annual Meeting, Anaheim, CA, USA. Light Metals 1990, C.M. Bickert, ed., TMS. Warrendale, PA, USA, pp. 985-988.

361. S.-W. Chen, Y.A. Chang and M.G. Chu, 1989, "Phase Equilibria and Solidification of Al-Li Alloys", Aluminum-Lithium Alloys, Proceedings of the Fifth International Al-Li Conference, T.H. Sanders, Jr. and E.A. Starke, Jr., eds., Materials and Component Engineering Publication Ltd., Birmingham, UK, pp. 585-594.