Prof. yuan-Fu Yang

Education

• Ph.D in College of Electrical Engineering and Computer Science, National Tsing Hua University

• Academic Expertise

  • Machine Learning, Deep Learning, Computer Vision, Generative AI, 3D Reconsturction, Large Multimodal Model

Awards

• 2023 TSMC ESG Competition Best Award

• 2023 CVPR (Vancouver) TechArt Piece Selected for Exhibition

• 2022 TSMC Collaboration for Internal Control Excellence Symposium First Award

• 2021 Linz Electronic Arts Festival (Austria) TechArt Piece Selected for Exhibition.

• 2021 National Tsing Hua University International Paper Best Award

• 2020 SEMI Advanced Semiconductor Manufacturing Conference Best Paper Award

• 2020 TSMC Machine Learning Competition First Runner-up

• 2018 TSMC Kaggle Competition First Award

• 2011, 2015, 2016 TSMC CIT Competition Frist Award

• 2011, 2016 TSMC Annual First Award

Activities

• 2017 - 2023: Quality & Reliability, TSMC

• Member of CIT Competition Juror

• 2022 - now: Reviewer

• Computer Vision and Pattern Recognition Conference (CVPR)

• International Conference on Computer Vision (ICCV)

• IEEE Transactions on Neural Networks and Learning Systems (TNNLS)

• IEEE Transactions on Instrumentation and Measurement (TIM)

Publications

• "QRF: Implicit Neural Representations with Quantum Radiance Fields", arXiv preprint arXiv:2211.03418.

• "SARS-COV-2 Painting Creation by Generative Model", The IEEE / CVF Computer Vision and Pattern Recognition Conference (CVPR 2023) Demo.

• "Semiconductor Defect Detection by Hybrid Classical-Quantum Deep Learning", The IEEE / CVF Computer Vision and Pattern Recognition Conference (CVPR 2022).

• "Hybrid Quantum-Classical Machine Learning for Lithography Hotspot Detection", 2022 Semi Advanced Semiconductor Manufacturing Conference (ASMC 2022).

• "Semiconductor Defect Pattern Classification by Self-Proliferation-and-Attention Neural Network", IEEE Transactions on Semiconductor Manufacturing (TSM 2021).

• "Medium. Permeation", TechArt Work, Ars Electronica Festival (2021).

• "A Novel Deep Learning Architecture for Global Defect Classification: Self-Proliferating Neural Network (SPNet)", 2021 Semi Advanced Semiconductor Manufacturing Conference (ASMC 2021).

• "Double Feature Extraction Method for Wafer Map Classification based on Convolution Neural Network", 2020 Semi Advanced Semiconductor Manufacturing Conference (ASMC 2020).

• "A Deep Learning Model for Identification of Defect Patterns in Semiconductor Wafer Map", 2019 Semi Advanced Semiconductor Manufacturing Conference (ASMC 2019).

• "The Economics of Preventive Maintenance – A Grouping Genetic Algorithm Approach", 2006 36th International Conference on Computers and Industrial Engineering (ICCIE 2006).