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Basic Description
Basic Description
OEM: KDF
Model: 603i Vertical Batch-Sputtering System
Category
Deposition / Sputter
Basic Function
Deposit thin films in a high vacuum environment
Highlights
Vacuum chamber is maintained by a cryo compressor which helps maintain an extremely high vacuum. Unique substrate sizes can be accommodated with pallet designs.
Theoretical Substrate Capacity (Per Pallet)
Theoretical Substrate Capacity (Per Pallet)
Technical Specs
Technical Specs
Three Water Cooled Targets
Aluminum/Silicon 99/1 wt%
Indium Tin Oxide (ITO)
Zirconium 99.2%
Process Gases
Ar
N2
Vacuum
Chamber ultimate ≤1 x 10-7 torr
Chamber leak rate, 20 minutes to 1 x 10-4 torr
High vacuum dome ultimate ≤1 x 10-7 torr
High vacuum dome leak rate, 15 minutes to 1 x 10-4 torr
Hardware
DC and RF solid state power supply sources
Integrated throttling SS VAT valve
MKS multi component gauges for integrated vacuum measurements
User Considerations
User Considerations
Best for
High purity deposition of target materials
Limitations
Requires a compatible pallet for substrate size. Pallet is 13" x 13"
Material Restrictions
Pallet used in DESI processing (6" wafers ) tool MUST be kept clean.
Therefore, all substrates must conform to contamination policy found in the MSL Outside Use Policy
Additional, segregated pallets for other substrates might be a way to address material contamination
Closest Alternatives
None in MSL
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