consumable details

Note

This list is current as of August 2025.

For an updated list of chemicals, gases, and accurate sense of the associated hazards, please refer to the WPC activities for the MSL.

DIW

Type E-3 or Photovoltaic: High Purity Class Water, between 14-18 MOhm-cm resistivity incoming to lab

Facilities Managed Inputs

Clean Dry Air (CDA) - ~85 psi, requires POU oil filters

General Use N2

High Purity N2 (process and chamber)

Oxygen (process and chamber)

House Vacuum

Low Conductivity Water (LCW) also used for low load cooling

Process Chemicals

Acetone

Aluminum etch (phosphoric, acetic, nitric acid mix)

Ammonium Fluoride (NH4F)

Ammonium Hydroxide - NH4OH

AZ3312 - i-line/g-line Crossover Positive Photoresist

AZ400K - Photoresist Developer

Ammonium Hydroxide - NH4OH

Buffered oxide etch (ammonium fluoride, hydrofluoric acid mix)

Freckle etch (phosphoric, acetic, nitric, fluoroboric acid mix)

Hexamethyldisilazane - HMDS - Electronics Grade, ≥99%

Hydrochloric Acid - HCl

Hydrofluoric Acid - HF

Hydrogen Peroxide - H2O2

Methanol

n-Butyl Acetate

Nitric acid - HNO3

Phosphoric acid - H3PO4

PRS-3000 - Photoresist Stripping

Sulfuric acid - H2SO4

Transene ALPAD Etch 639 (acetic acid, ammonium fluoride, propylene glycol, <1% hydrofluoric acid)

Non-Process Chemicals

HF Acid Neutralizer (Aqua, proprietary neutralizer)

Isopropyl Alcohol - IPA

Kolorsafe General Acid Neutralizer (Triethanolamine, Diethanolamine)

Reactive Process Gases

Carbon Tetrafluoride - CF4 - Semiconductor Grade 5.0

Forming Gas - H2 3.9%, Balance N2

Hydrogen - H2

Nitrous Oxide - N2O - Semiconductor 4.8 Grade, 99.998%

Octafluorocyclobutane - C4F8 - Semiconductor Grade 4.5

Silane - SiH4

Silane/Phosphine - SiH4

Trifluoromethane - CHF3

Non-Reactive Process Gases

Argon - Ar - Research Grade, 99.9999%

Helium - He - Ultra High Purity, 99.999%

Sputter Targets

Al/Si 99/1 wt%

ITO

ZrO2

Page updated

Report abuse