dwl66+

Two Writeheads (WH) Available

2mm

10mm

Resolution

300nm minimum feature size, 2mm WH, UV 375nm laser

1μm minimum feature size, 10mm WH, UV 375nm laser

≥ 0.5μm lines and spaces, 2mm WH, UV 375nm laser

≥ 1.5μm lines and spaces, 10mm WH, UV 375nm laser

Global 2nd Layer alignment over 100 mm × 100 mm

≤ 500nm

Local 2nd Layer alignment over 5 mm × 5 mm

≤ 250nm

Depth of Focus

± 0.25µm for 2mm WH

± 2.5µm for 10mm WH

Two Autofocus Modes

Optical

Pneumatic

Beam Diameter

0.6µm for 2mm WH

1.2µm for 10mmWH

Partial Coherence

Variable, 0.37 to 0.86

Numerical Aperture (NA)

0.9 for 2mm WH

0.45 for 10mm WH

Uniformity

±0.25µm across 150mm substrate

Particulate Class

ISO6

Wafer Sizes

from 5mm x 5mm to 228.6mm x 228.6mm in size (writing area limited to 200mm x 200mm)

and from 0.1mm to 12mm thick

Best for

R&D, rapid design iteration, low volume production

Mask creation

Grayscale rastering projects

Limitations

Layer to layer alignment can be poor, especially for larger substrates

Limited wafer level uniformity

Material Restrictions

All substrates must conform to contamination policy found in the MSL Outside Use Policy

The tool will be outfitted with "dirty" tooling such that outside substrates can be run on the tool

However, other processing (coating, develop, etc) will be restricted due to contamination concerns

Photoresist must be compatible with the UV range (375nm)

Closest Alternatives

Aligner