Welcome to Projects Exploring Electric Current-Induced Effects 

Electric current is found to form voids and hillocks, as well as the polarity effect. It is also found to induce the alloy supersaturation effect, the non-polarity effect, lattice deformation, electrorecrystallization, and grain rotation. These interesting phenomena inevitably has increased the charisma of electric current in the application of altering material microstructures. This project is dedicated to understand the fundamental of physical metallurgy under electric current and therefore extend these knowledge in the real application.

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1. Y.-C. Liu, K.-H. Lin,  S.-J. Chiu, J.-J. Lee, Y.-G. Lin and S.-K. Lin,  "Critical lattice strain for electromigration - revisiting the Blech critical product",  Materials Characterization, 228, 115384 (2025). (IF = 4.8, Rank: 2/38 = 5.26% in MATERIALS SCIENCE, CHARACTERIZATION & TESTING). <Journal Pub>.

2. A. Dash, Y.-C. Liu, H. Yoshida, R. Mücke, G. Gerstein, S. Herbst, F. Nürnberger, H. J. Maier, H. N. Han, S.-k Lin, and O. Guillon, "Electroplasticity of Metals and Ceramics: Current Status", Annual Review of Materials Research, 55 (2025) (IF = 13.972, Rank: 27/345 = 7.82% in MATERIALS SCIENCE, MULTIDISCIPLINARY). <Journal Pub>

3. Y.-C. Liu, S.-K. Lin, and S.-J. Chiu, “On the Schmid's Law for the electric current-induced deformation: An in situ EBSD study”, International Journal of Mechanical Sciences, 168, 105295  (2020) (#IF = 4.631, Rank:14/136 = 10% in MECHANICS -- SCIE). <Journal Pub>

4. Y.-C. Liu, Y.-S. Yu, S.-J. Chiu, and S.-K. Lin, “Electromigration effect upon single- and two-phase Ag-Cu alloy strips: an in situ study”, Scripta Materialia, 173, 134-138 (2019) (IF = 5.079, Rank:6/79 = 8% in METALLURGY & METALLURGICAL ENGINEERING -- SCIE). <Journal Pub>

5. Y.-C. Liu,  and  S.-K. Lin, “A Critical Review on the Electromigration Effect, the Electroplastic Effect, and Perspectives on Effect of Electric Current upon Alloy Phase Stability”, JOM, 71(9), 3094-3106 (2019) P.1-13 (IF=2.029, Rank: 23/79 = 29% in METALLURGY & METALLURGICAL ENGINEERING -- SCIE). <Journal Pub>

6. Y.-C. Liu, B. Afflerbach, R. Jacobs, S.-K. Lin and D. Morgan, “Exploring effective charge in electromigration using machine learning”, MRS Communications, 1-9 (2019) (Special Issue Research Letter: Artificial Intelligence [by invitation only]) (IF = 1.997, Rank: 197/314 = 63% in MATERIALS SCIENCE, MULTIDISCIPLINARY -- SCIE). <Journal Pub> <Selected as the Worth Reading Literature by Citrine Informatics>

7. S.-K. Lin, Y.-C. Liu, S.-J. Chiu, Y.-T. Liu, and H.-Y. Lee, "The electromigration effect revisited: non-uniform local tensile stress-driven diffusion", Scientific Reports 7, 3082 (2017) (IF = 4.122, Rank: 12/64 = 19% in MULTIDISCIPLINARY SCIENCES -- SCIE). <Journal Pub>

8. S.-K. Lin, C.-K. Yeh, W. Xie, Y.-C. Liu, and M. Yoshimura, "Ab initio-aided CALPHAD thermodynamic modeling of the Sn-Pb binary system under current stressing", Scientific Reports 3, 2731 (2013) (IF = 5.078, Rank: 5/55 = 9% in MULTIDISCIPLINARY SCIENCES -- SCIE). <Journal Pub>