Solder Property Simulation Toolkit-Wettability (SPryT-W)

Modeling solder wetting angle reflowed on a substrate at a given temperature.

Github: https://github.com/LIULABNCKU19/SPryT-W

If you use this software in your research, please cite: B.-X. Lee, and Y.-C. Liu*, "Modeling wetting angle of solder on substrate using machine learning approach", Science and Technology of Welding and Joining, 30(2) 129–138 (2025)