1. T.-H. Huang, C.-Y. Yeh, C.-H. Yang, Y.-C. Liu and S.-K. Lin, "Sonochemical synthesis of sub-micron Ga-based particles for Cu-to-Cu interconnection", ACS Applied Electronic Materials (Accepted) (2025). (IF = 4.4, Rank: 81/353 = 22.9% in ENGINEERING, ELECTRICAL & ELECTRONIC)

2. Y.-C. Liu, K.-H. Lin,  S.-J. Chiu, J.-J. Lee, Y.-G. Lin and S.-K. Lin,  "Critical lattice strain for electromigration - revisiting the Blech critical product",  Materials Characterization, 228, 115384 (2025). (IF = 4.8, Rank: 2/38 = 5.26% in MATERIALS SCIENCE, CHARACTERIZATION & TESTING). <Journal Pub>.

3. W.-Y. Chen, Y.-C. Liu*, F.-C. Hsu, and H.-T. Lee, "Effect of Micro-Shot Peening on the Surface Integrity of High-Speed Steel", Surface Engineering, 41 (4),  471-478 (2025) (IF = 3.169, Rank: 8/21=38.1% in MATERIALS SCIENCE, COATINGS & FILMS). <Journal Pub>.

4. A. Dash, Y.-C. Liu, H. Yoshida, R. Mücke, G. Gerstein, S. Herbst, F. Nürnberger, H. J. Maier, H. N. Han, S.-k Lin, and O. Guillon, "Electroplasticity of Metals and Ceramics: Current Status", Annual Review of Materials Research, 55 (2025) (IF = 13.972, Rank: 27/345 = 7.82% in MATERIALS SCIENCE, MULTIDISCIPLINARY). <Journal Pub>

5. T.-S. Su, T.-Y. Lin, B.-X. Lee, C.-A. Lin, Y.-C. Liu, S.-k. Lin, and Y.-Z. Chen, "Texturing and interfacial engineering strategies for regulating Zn deposition by in-situ grown ZnTe on Zn anode toward long lifespan Aquous zinc ion batteries", Journal of Power Sources, 643, 1, 237000 (2025) (IF = 9.794, Rank: 4/30 = 13.3% in ELECTROCHEMISTRY). <Journal Pub>

6. T.-Y. Lin, B.-X. Lee, L.-C. Lo, G.-M. Chen, I.-M. Chen, H.-I Tsai, Y.-C. Liu, Y.-W. Tsai, K.-C. Chu, M.-T. Tang, B.-H. Lin, and Y.-Z. Chen, "Suppressing intergranular corrosion and uniformizing Zn deposition for highly reversible anode toward high Zn utilization rate aqueous Zn ion battery", Journal of Energy Storage, 118, 116266 (2025) (IF = 9.8, Rank: 26/182 = 14.3% in ENERGY & FUELS). <Journal Pub>

7. B.-X. Lee, and Y.-C. Liu*, "Modeling wetting angle of solder on substrate using machine learning approach", Science and Technology of Welding and Joining, 30(2) 129–138 (2025) (IF = 4.114, Rank:14/79 = 17% in METALLURGY & METALLURGICAL ENGINEERING). <Journal Pub>

8. C.-H. Yang, Y.-C. Liu, H. Nishikawa, and S.-k. Lin, "Reducing anisotropy of rhombohedral Bi-rich phase for high-performance Ag-alloyed Sn–Bi low-temperature solders", Journal of Materials Research and Technology, 30, 16-24 (2024) (IF = 6.2, Rank: 6/90 = 6.67% in METALLURGY & METALLURGICAL ENGINEERING -- SCIE). <Journal Pub>

9. Y.-C. Liu*, D. Morgan, T. Yamamoto and G. R. Odette, "Characterizing the flux effect on the irradiation embrittlement of reactor pressure vessel steels using machine learning", Acta Materialia, 256, 119144 (2023) (IF = 9.209, Rank: 3/79 = 3.16% in METALLURGY & METALLURGICAL ENGINEERING -- SCIE). <Journal Pub>

10. M.-H. Tsai, T.-Y. Lin, T.-S. Su, G.-M. Chen, Y.-C. Liu, and Y.-Z. Chen, "Regulating Zn deposition via Zincophilic 2D-Cu2Te as the Current Collector to Suppress Dendrite Formation toward High Performance Aqueous Zinc-Ion Batteries", Batteries & Supercaps, e202300107 (2023) (IF = 7.093, Rank: 7/29 = 24.1 % in ELECTROCHEMISTRY). <Journal Pub>

11. T. Banda, Y.-C. Liu*, A. A. Farid, and C.-S. Lim, "A machine learning model for flank wear prediction in face milling of Inconel 718", International Journal of Advanced Manufacturing Technology, 126, 935-945 (2023) (IF = 3.1, Rank: 33/89 = 37 % in AUTOMATION & CONTROL SYSTEMS). <Journal Pub>

12. 紀喆允、郭力維、劉禹辰、吳明修、胡永毅、許文東, "數值模擬與機器學習技術應用於材料開發",《工業材料雜誌》434期 (2023). <Journal Pub>

13. S.-Y. Yen, Y.-C. Liu, S.-h. Chu, C.-w. Chang, S.-k. Lin, and M.-H. Tsai, "B2-strengthened Al-Co-Cr-Fe-Ni high entropy alloy with high ductility", Materials Letters, 325, 132828 (2022) (IF = 3.574, Rank: 57/161 = 35% in Physics, Applied). <Journal Pub>

14. C.-H. Yang, Y.-C. Liu, S.-k. Lin, Y. Hirata and H. Nishikawa, "High-strength Sn-Bi-based low-temperature solders with high toughness designed via high-throughput thermodynamic modeling", Science and Technology of Welding and Joining, (2022) (IF = 4.114, Rank:14/79 = 17% in METALLURGY & METALLURGICAL ENGINEERING). <Journal Pub>

15. W.-Y. Huang, Y.-C. Liu, S.-k. Lin, and W.-H. Chen, “Computational thermodynamics-assisted design of nitrate-based phase change materials for waste heat recovery”, International Journal of Energy Research, 2022; 1- 10 (2022) (IF = 4.2, Rank:1/41 = 2.4% in Nuclear Science & Technology). <Journal Pub>

16. Y.-C. Liu, H. Wu, T. Mayeshiba, B. Afflerbach, R. Jacobs, J. Perry, J. George, J. Cordell, J. Xia, H. Yuan, A. Lorenson, H. Wu, M. Parker, F. Doshi, A. Politowicz, L. Xiao, D. Morgan, P. Wells, N. Almirall, T. Yamamoto and G. R. Odette, “Machine Learning Predictions of Irradiation Embrittlement in Reactor Pressure Vessel Steels”, npj Computational Materials, 8, 85 (2022) (IF = 12.241, Rank:30/334 = 8.98% in MATERIALS SCIENCE, MULTIDISCIPLINARY). <Journal Pub>

17. Y.-C. Liu, T.-Y. Liu, T.-H. Huang, K.-C. Chiu, S.-k. Lin, "Exploring dielectric constant and dissipation factor of LTCC using machine learning", Materials, 14(19), 5784 (2021) (Special Issue: Simulation and Reliability Assessment of Advanced Packaging) (IF = 3.748, Rank: 18/79 = 23% in METALLURGY & METALLURGICAL ENGINEERING). <Journal Pub>

18. Y.-C. Liu, S.-Y. Yen, S.-H. Chu, S.-k. Lin, and M.-H. Tsai, "Mechanical and thermodynamic data-driven design of Al-Co-Cr-Fe-Ni multi-principal element alloys", Materials Today Communications, Vol. 26, 102096, (2021) (IF=3.662, Rank: 180/345 = 52% in MATERIALS SCIENCE, MULTIDISCIPLINARY). <Journal Pub>

19. Y.-C. Liu, S.-K. Lin, and S.-J. Chiu, “On the Schmid's Law for the electric current-induced deformation: An in situ EBSD study”, International Journal of Mechanical Sciences, 168, 105295  (2020) (IF = 5.329, Rank:12/135 = 9% in MECHANICS -- SCIE). <Journal Pub>

20. T.-L. Yang, Y.-C. Liu, C.-H. Yang, Y.-K. Kao, and S.-K. Lin, “Formation of diffusion barrier-like intermetallic compound to suppress the formation of micro-voids at the Sn-0.7Cu/Cu interface by optimal Ga additions”, JOM, (2020) (IF = 2.471, Rank: 17/90 = 19% in METALLURGY & METALLURGICAL ENGINEERING -- SCIE). <Journal Pub>  

21. Y.-C. Liu, S.-K. Lin, H. Zhang, C. Chen, S. Nagao, and K. Suganuma, "Reactive wafer bonding with nanoscale Ag/Cu multilayers”, Scripta Materialia, 184, 1-5 (2020) (IF = 5.611, Rank: 5/80 = 6% in METALLURGY & METALLURGICAL ENGINEERING -- SCIE). <Journal Pub> 

22. G.-L. Ou, Y.-C. Liu, S.-Y. Yen, H.-Y. Wang,  Y.-H. Su, M.-J Lu, and S.-K. Lin, "Reactivity and thermo-physical properties of MnO-modified CaO-Al2O3-based mold fluxes for advanced high-strength steels", Journal of Materials Research and Technology, (2020) (IF=5.039, Rank: 9/80 = 11% in METALLURGY & METALLURGICAL ENGINEERING -- SCIE). <Journal Pub>  

23. 劉禹辰、楊智涵、顏紹宇、林士剛, "計算相圖(CALPHAD)在材料製程上的應用", Chemical Engineering (The Taiwan I. Ch. E.) Vol.67, No. 6, DEC. 2020. <Journal Pub>  (獲110年台灣化學工程協會化工傑作獎) 

24. Y.-C. Liu, B. Afflerbach, R. Jacobs, S.-K. Lin and D. Morgan, “Exploring effective charge in electromigration using machine learning”, MRS Communications, 1-9 (2019) (Special Issue Research Letter: Artificial Intelligence [by invitation only]) (IF = 1.997, Rank: 197/314 = 63% in MATERIALS SCIENCE, MULTIDISCIPLINARY -- SCIE). <Journal Pub> <Selected as the Worth Reading Literature by Citrine Informatics>

25. Y.-C. Liu, Y.-S. Yu, S.-J. Chiu, and S.-K. Lin, “Electromigration effect upon single- and two-phase Ag-Cu alloy strips: an in situ study”, Scripta Materialia, 173, 134-138 (2019) (IF = 5.079, Rank:6/79 = 8% in METALLURGY & METALLURGICAL ENGINEERING -- SCIE). <Journal Pub>

26. Y.-C. Liu,  and  S.-K. Lin, “A Critical Review on the Electromigration Effect, the Electroplastic Effect, and Perspectives on Effect of Electric Current upon Alloy Phase Stability”, JOM, 71(9), 3094-3106 (2019) P.1-13 (IF=2.029, Rank: 23/79 = 29% in METALLURGY & METALLURGICAL ENGINEERING -- SCIE). <Journal Pub>

27. J.-S. Huang, C.-L. Huang, Y.-C. Liu, S.-K. Lin, T.-S. Chan and H.-W. Tu, "Ab-initio-aided sensitizer design for Mn4+-activated Mg2TiO4 as an ultra-bright fluoride-free red emitting phosphor", Chemistry of Materials 30 (5), 1769-1775 (2018) (IF = 10.159, Rank: 22/293 = 8% in MATERIALS SCIENCE, MULTIDISCIPLINARY -- SCIE). <Journal Pub> 

28. S.-K. Lin, Y.-C. Liu, S.-J. Chiu, Y.-T. Liu, and H.-Y. Lee, "The electromigration effect revisited: non-uniform local tensile stress-driven diffusion", Scientific Reports 7, 3082 (2017) (IF = 4.122, Rank: 12/64 = 19% in MULTIDISCIPLINARY SCIENCES -- SCIE). <Journal Pub>

29. S.-K. Lin, M.-J. Wang, C.-Y. Yeh, H.-M. Chang, Y.-C. Liu, “High-strength and thermal stable Cu-to-Cu joint fabricated with transient molten Ga and Ni under-bump-metallurgy”, Journal of Alloys and Compounds, 702, 561–567 (2017) (IF= 3.779, Rank: 4/75 = 5% in METALLURGY & METALLURGICAL ENGINEERING -- SCIE). <Journal Pub>

30. S.-K. Lin, S. Nagao, E. Yokoi, C. Oh, H. Zhang, Y.-C. Liu, S.-g. Lin & K. Suganuma, “Nano-volcanic Eruption of Silver”, Scientific Reports 6, 34769 (2016) (IF = 4.259, Rank: 10/64 = 16% in MULTIDISCIPLINARY SCIENCES -- SCIE). <Journal Pub>

31. S.-K. Lin, H.-M. Chang, C.-L. Cho, Y.-C. Liu and Y.-K. Kuo, "Formation of solid-solution Cu-to-Cu joints using Ga solder and Pt under bump metallurgy for three-dimensional integrated circuits", Electronic Materials Letters, 11, 687-694 (2015) (IF =2.057, Rank: 103/271 = 50% in MATERIALS SCIENCE, MULTIDISCIPLINARY -- SCIE). <Journal Pub>

32. S.-K. Lin, C.-K. Yeh, W. Xie, Y.-C. Liu, and M. Yoshimura, "Ab initio-aided CALPHAD thermodynamic modeling of the Sn-Pb binary system under current stressing", Scientific Reports 3, 2731 (2013) (IF = 5.078, Rank: 5/55 = 9% in MULTIDISCIPLINARY SCIENCES -- SCIE). <Journal Pub>

1. 林士剛、劉禹辰、林冠斈、陳昱清。載具結構材料強化系統及包含其的載具。中華民國專利號I742930。經濟部智慧財產局。（2021/10/11）

2. 林士剛、劉禹辰、林冠斈、陳昱清。⾞両構造材料強化システム及びそれを含む⾞両。日本特願2020-211516。日本特許廳。（令和 4年 2月17日）

3. 林士剛、劉禹辰、林冠斈、陳昱清。VEHICLE STRUCTURE MATERIAL STRENGTHENING SYSTEM AND VEHICLE CONTAINING SAME。US11639145B2。(2023-05-02)

4. 林士刚、刘禹辰、陈昱清、林冠斈。载具结构材料强化系统及包含其的载具。 6282188。(2023-08-29)

5. 林士剛、黃婉渝、劉禹辰。用於熱交換器及廢熱回收系統的相變材料。中華民國專利號I847307。經濟部智慧財產局。（2024/07/01）

6. 陳世偉、蕭嘉賢、林士剛、劉禹辰。用於臨場分析的氫氣加熱系統及其操作方法。中華民國專利號I878172B。經濟部智慧財產局。（2025/03/21）

International Conference

1. Y.-C. Liu, "How to model solder wettability by using artificial intelligence", Surface Mount Technology Association (SMTA) International Conference, Chicago, USA. (22nd October 2025) (Invited talk.)

2. Y.-C. Liu, "How to Modulate Material Property via Machine Learning approach: Electronic Packaging Applications", The 7th International Symposium on Visualization in Joining & Welding Science through Advanced Measurements and Simulation (Visual-JW), Osaka, Japan. (1st October 2025) (Invited talk.)

3. Y.-C. Liu, "Introduction to LIU LAB @ NCKU, How to use machine learning method to design materials?", Talk to Prof. Hiroshi Nishikawa's group, The University of Osaka, Osaka, Japan. (30th September 2025) (Invited talk.)

4. Y.-C. Liu, "Material Property Modulation via Machine Learning Method: Electronic Packaging Applications", Institute of Science Tokyo-NCKU Technical Forum: Semiconductor Session, Tokyo, Japan. (3rd September 2025) (Invited talk.)

5. Y.-C. Liu, "Design Low Temperature Solder Using Machine Learning Approach", Talk to Prof. Peter K. Liaw's group, University of Tennessee, Tennessee, USA. (19th February 2025) (Invited talk.)

6. Y.-C. Liu, "Design Low Temperature Solder Using Machine Learning Approach", International Forum in the MRS-Taiwan Annual Meeting 2024, Taichung, Taiwan. (16th November 2024) (Invited talk.)

7. Y.-C. Liu, “Electronic Material Properties Exploration Using Machine Learning", IEEE EPS Japan Chapter, Online meeting. (1st December 2023) (Invited talk.)

8. Y.-C. Liu, A, Kohlik, and S.-K. Lin, "Machine Learning Models of Ultimate Tensile Strength and Elongation for Low-temperature Solder", 2023 The Minerals, Metals & Materials Society Annual meeting, San Diego, California, USA. (21st March 2023) (Invited talk.)

9. Y.-C. Liu, “Electronic packaging materials design using machine learning modeling”, The IMPACT 2021 conference, Taipei, Taiwan. (December 2021) (Invited talk.)

10. Y.-C. Liu, and S.-K. Lin, “Electric current-induced elastic/slip/twin deformation of Cu”, International Conference of PLASTICITY, DAMAGE & FRACTURE, InterContinental San Juan, Puerto Rico, USA. (January 2018) (Invited talk.)

Domestic talk

1. H.-W. Kao, and Y.-C. Liu, "如何利用機器學習方法設計Sn-In-X低溫銲料應用於電子構裝", 中國機械學會第42屆全國學術研討會: 金屬接點材料與製程論壇, Hsin-chu, Taiwan (5th December 2025) (Invited talk.)

2. Y.-C. Liu, "沖壓模具產業AI人才培訓課程：AI演算法與應用概論", 金屬工業研究發展中心, Kaohsiung, Taiwan (18th September 2025) (Invited talk.)

3. Y.-C. Liu, "Electronic packaging material design under machine learning guidance", 國立中正大學前瞻製造系統碩/博士學位學程英文專題演講, Chiayi, Taiwan (23rd April 2025) (Invited talk.)

4. Y.-C. Liu, "Exploring material properties by using machine learning method", 國立台灣大學材料科學與工程學研究所113學年度專題演講, Taipei, Taiwan (9th December 2024) (Invited talk.)

5. Y.-C. Liu, "How to use the artificial intelligence method developing new materials", 國立成功大學材料科學及工程學系大學部專題演講, Tainan, Taiwan. (18th November 2024) (Invited talk.)

6. Y.-C. Liu, “利用人工智慧方法探索新材料及材料科學”, 逢甲大學材料科學及工程學系專題演講, Taichung, Taiwan. (20th December 2023) (Invited talk.)

7. Y.-C. Liu, “利用機器學習方法優化材料設計及其製程”, 中國機械工程學會第四十屆全國學術研討會工程論壇, Changhua, Taiwan. (1st December 2023) (Invited talk.)

8. Y.-C. Liu, “利用機器學習方法探索材料複雜特性”, Association of Computational Mechanics Taiwan (ACMT) 2023 Annual Meeting & The 14th Workshop on Boundary Element Methods in Taiwan, Keelung, Taiwan. (29th October 2023) (Invited talk.)

9. Y.-C. Liu, “以機器學習方法探討中子輻射導致鋼鐵延性脆性轉換溫度效應”, Association of Computational Mechanics Taiwan (ACMT) 2023 Annual Meeting & The 14th Workshop on Boundary Element Methods in Taiwan, Keelung, Taiwan. (29th October 2023) (Invited talk.)

10. Y.-C. Liu, "MAST-ML tool (Training course: how to use gel hardness prediction model？)", private company, (July 2023) (Invited talk.)

11. Y.-C. Liu, “應用人工智慧演算方法於新材料設計”, 國立成功大學材料科學及工程學系大學部專題演講, Tainan, Taiwan. (28th November 2022) (Invited talk.)

12. Y.-C. Liu, “Machine learning application in modeling materials property”, The MRS-Taiwan Annual Meeting 2022, MiaoLi, Taiwan. (19th November 2022) (Invited talk.)

13. Y.-C. Liu, "Machine learning applications in materials development", private company, (23rd March 2022) (Invited talk.)

14. Y.-C. Liu, “機器學習方法應用於材料科學特性預測”, 2021 Computational Thermodynamics Workshop, Tainan, Taiwan. (January 2021) (Invited talk.) 

15. S.-K. Lin, Y.-C. Liu, K.-H. Lin, Y.-C Chen, and S.-J. Chiu, “Electric current effect on the materials stability of pure aluminum and 7075 aluminum alloy: an in situ study”, The 26st NSRRC Users' Meeting & Workshops, Hsinchu, Taiwan. (November 2020) (Invited talk.)