Welcome to Alloy Design Project

Alloys are commonly used in daily life. We use experimental and modeling approaches to design new alloys for specific applications. Our designed alloys include low-temperature solder, high-temperature solder, aluminum alloy, ironmaking process, zinc-based alloys, etc.

Related papers:

Interconnection material design

1. T.-H. Huang, C.-Y. Yeh, C.-H. Yang, Y.-C. Liu and S.-K. Lin, "Sonochemical synthesis of sub-micron Ga-based particles for Cu-to-Cu interconnection", ACS Applied Electronic Materials, 7 (19), 8969-8977 (2025). (IF = 4.4, Rank: 81/353 = 22.9% in ENGINEERING, ELECTRICAL & ELECTRONIC). <Journal Pub>.

2. C.-H. Yang, Y.-C. Liu, H. Nishikawa, and S.-k. Lin, "Reducing anisotropy of rhombohedral Bi-rich phase for high-performance Ag-alloyed Sn–Bi low-temperature solders", Journal of Materials Research and Technology, 30, 16-24 (2024) (#IF = 6.4, Rank: 6/79 = 7.6% in METALLURGY & METALLURGICAL ENGINEERING -- SCIE). <Journal Pub>

3. C.-H. Yang, Y.-C. Liu, S.-k. Lin, Y. Hirata and H. Nishikawa, "High-strength Sn-Bi-based low-temperature solders with high toughness designed via high-throughput thermodynamic modeling", Science and Technology of Welding and Joining, (2022) (#IF = 4.114, Rank:14/79 = 17% in METALLURGY & METALLURGICAL ENGINEERING). <Journal Pub>

4. Y.-C. Liu, S.-K. Lin, H. Zhang, C. Chen, S. Nagao, and K. Suganuma, "Reactive wafer bonding with nanoscale Ag/Cu multilayers”, Scripta Materialia, 184, 1-5 (2020) (IF = 5.611, Rank: 5/80 = 6% in METALLURGY & METALLURGICAL ENGINEERING -- SCIE). <Journal Pub> 

5. S.-K. Lin, S. Nagao, E. Yokoi, C. Oh, H. Zhang, Y.-C. Liu, S.-g. Lin & K. Suganuma, “Nano-volcanic Eruption of Silver”, Scientific Reports 6, 34769 (2016) (IF = 4.259, Rank: 10/64 = 16% in MULTIDISCIPLINARY SCIENCES -- SCIE). <Journal Pub>

6. T.-L. Yang, Y.-C. Liu, C.-H. Yang, Y.-K. Kao, and S.-K. Lin, “Formation of diffusion barrier-like intermetallic compound to suppress the formation of micro-voids at the Sn-0.7Cu/Cu interface by optimal Ga additions”, JOM, (2020) (IF = 2.471, Rank: 17/90 = 19% in METALLURGY & METALLURGICAL ENGINEERING -- SCIE). <Journal Pub>  

7. S.-K. Lin, M.-J. Wang, C.-Y. Yeh, H.-M. Chang, Y.-C. Liu, “High-strength and thermal stable Cu-to-Cu joint fabricated with transient molten Ga and Ni under-bump-metallurgy”, Journal of Alloys and Compounds, 702, 561–567 (2017) (IF= 3.779, Rank: 4/75 = 5% in METALLURGY & METALLURGICAL ENGINEERING -- SCIE). <Journal Pub>

8. S.-K. Lin, H.-M. Chang, C.-L. Cho, Y.-C. Liu and Y.-K. Kuo, "Formation of solid-solution Cu-to-Cu joints using Ga solder and Pt under bump metallurgy for three-dimensional integrated circuits", Electronic Materials Letters, 11, 687-694 (2015) (IF =2.057, Rank: 103/271 = 50% in MATERIALS SCIENCE, MULTIDISCIPLINARY -- SCIE). <Journal Pub>

Zn-ion battery anode material design

1. T.-S. Su, T.-Y. Lin, B.-X. Lee, C.-A. Lin, Y.-C. Liu, S.-k. Lin, and Y.-Z. Chen, "Texturing and interfacial engineering strategies for regulating Zn deposition by in-situ grown ZnTe on Zn anode toward long lifespan Aquous zinc ion batteries", Journal of Power Sources, 643, 1, 237000 (2025) (IF = 9.794, Rank: 4/30 = 13.3% in ELECTROCHEMISTRY). <Journal Pub>

2. T.-Y. Lin, B.-X. Lee, L.-C. Lo, G.-M. Chen, I.-M. Chen, H.-I Tsai, Y.-C. Liu, Y.-W. Tsai, K.-C. Chu, M.-T. Tang, B.-H. Lin, and Y.-Z. Chen, "Suppressing intergranular corrosion and uniformizing Zn deposition for highly reversible anode toward high Zn utilization rate aqueous Zn ion battery", Journal of Energy Storage, 118, 116266 (2025) (IF = 9.8, Rank: 26/182 = 14.3% in ENERGY & FUELS). <Journal Pub>

3. M.-H. Tsai, T.-Y. Lin, T.-S. Su, G.-M. Chen, Y.-C. Liu, and Y.-Z. Chen, "Regulating Zn deposition via Zincophilic 2D-Cu2Te as the Current Collector to Suppress Dendrite Formation toward High Performance Aqueous Zinc-Ion Batteries", Batteries & Supercaps, e202300107 (2023) (IF = 7.093, Rank: 7/29 = 24.1 % in ELECTROCHEMISTRY). <Journal Pub>

Surface modification & design

1. W.-Y. Chen, and Y.-C. Liu*, "Feasibility study of a surface texturing technique based on selective-area micro-particle bombardment", Tribology International, 221, 111996 (2026). (IF = 6.9, Rank: 9/182 = 4.9% in ENGINEERING, MECHANICAL). <Journal Pub>.

2. W.-Y. Chen, Y.-C. Liu*, F.-C. Hsu, and H.-T. Lee, "Effect of Micro-Shot Peening on the Surface Integrity of High-Speed Steel", Surface Engineering, 41 (4),  471-478 (2025) (IF = 3.169, Rank: 8/21 = 38.1% in MATERIALS SCIENCE, COATINGS & FILMS). <Journal Pub>.