156B Week 9

Overview of Status of Analysis, Design, Fabrication, Tests, etc.

Accomplishments from Previous Week

• CAD and completed design for electrical isolation runways are completed and ready to be sent to the sponsor - Leigh / Harald

• EAGLE/CAD of updated PCB incorporating D. Neuzil comments shown below - Leigh/Harald

• FEA done on different tunes of the flex join to try to optimize the joint theoretically - Trent

• Full design procedure and BOM for the Aluminum panel created and ready to be sent to sponsor - Jesse

Goals for Next Week (list names after each item). Use specific and measurable objectives.

Sponsor Comments from Last Meeting and Actions Taken to Address these Comments (indicate date of comments and if via email or in person)

Instructor Comments from Last Meeting and Actions Taken to Address these Comments (indicate date of comments and if via email or in person)

• • From Dr T.

    • Reference surface finishing in final report and in finalized version of design presentation, even though it will not be included in delivered prototype.

    • Include reference to Die-Casting in final report for sponser w.r.t. mass-manufacturing

    • Speak to sand-casting company about what tempering they are capable of for 7075 Al, as it may affect the fatigue life of the part

    • Design or consider the implementation of a tapered beam for the flexible joint to maximize deflection while minimizing applied stress on the locking mechanism.

    • Include vibrational analysis sensitivity for damping ratio used in final report and in final presentation

  • From Darren D.

    • PG 6 of final presentation, include the loading/acceleration data reference for launch vehicles to back up 13G claim for max accelerations

    • PG12 of final presentation, include CAD of the flexure joint with proper definitions/leaders to demonstrate the dimensions (LxWxH etc)

Comments from Other Students in the Class (indicate date of comments and if via email or in person)

• • N/A

Comments from External Sources

• • From Dale Neuzil, Senior Systems Engineer at SANDAG, EE:

    • May need to create a twisted pair on the PCB for the data lines to reduce electrical interference and ensure data rate stability.

      • Can interleave the traces with vias and 45-degree crossings

    • Should also balance line lengths of all data, power connections onboard the PCB by running the shorter lengths along a longer path, for impedance matching

      • Should consult w/an RF engineer for this step, as there are other considerations to be made

    • Final Design might need SMT pads near pogos/fuzz buttons for a matching L-C network

    • Example image:

Risks and Areas of Concern

Resources or Information Required but not Available

Schedule

• • Describe upcoming milestone

  • Update Gantt chart.

Budget (list amount spent and amount remaining)

Progress on Report and Webpage