Faculty

Prof. Riadul Islam

Riadul Islam is currently a tenure-track Assistant Professor at the University of Maryland Baltimore County (UMBC) Computer Science and Electrical Engineering Department. Before joining UMBC, he was with the University of Michigan (UM), Dearborn from 2017 to 2019. In his Ph.D. dissertation work at UCSC, Dr. Riadul has designed the first current-pulsed flip-flop/register that resulted first ever one-to-many current-mode clock distribution networks for high-performance microprocessors. From 2007 to 2009, he worked as a full-time faculty in the Department of Electrical and Electronic Engineering of the University of Asia Pacific, Dhaka, Bangladesh. He is a Senior member of the IEEE, IEEE Circuits, Systems (CAS) society, and member of ACM. He is an editorial board member of Semiconductor Science and Information Devices Journal. Here is Riadul's updated (CV) (Last updated July 2024).

Education:

Ph.D. in CE: University of California Santa Cruz, CA, USA

M.A.Sc. in ECE: Concordia University, Montreal, Quebec, Canada

B.Sc. in EEE: Bangladesh University of Engineering & Technology (BUET), Dhaka, Bangladesh

professional activities & Service:

Professional Service:

2023 IEEE Senior Member Application Review Panel, Virtual.
2023 NSF Convergence Accelerator, Directorate for Technology, Innovation and Partnerships Panelist.

Conference Organizing Committee:

Technical Program Committee (TPC) member of the IEEE 37 th Symposium On Integrated Circuits And Systems Design (SBCCI 2024), Joao Pessoa, Paraiba, Brazil.
Technical Program Committee (TPC) member of the IEEE/ACM 43 rd International Conference on Computer-Aided Design (ICCAD 2024), New Jersey, USA.
Technical Program Committee (TPC) member of the 34 th ACM Great Lakes Symposium on VLSI (GLSVLSI 2024), Tampa Bay Area, FL, USA.
Program Committee (PC) member of the 19 th International Conference On PhD Research in Microelectronics and Electronics (PRIME 2024), Larnaca, Cyprus.
Technical Review Committee member (RCM) of the IEEE 75 th IEEE International Symposium on Circuits and Systems (ISCAS 2024), Singapore.
Technical Program Committee (TPC) member of the IEEE 42 nd International Conference on Consumer Electronics (ICCE 2024), Las Vegas, Nevada, USA.
Program Committee (PC) member of the IEEE/ACM International Conference on Computer-Aided Design (ICCAD 2023), San Francisco, California, USA.
Technical Program Committee (TPC) member of the ACM Great Lakes Symposium on VLSI (GLSVLSI 2023), Knoxville, TN, USA.
Session Chair: Testing, Reliability and Fault Tolerance, ACM 32 nd Great Lakes Symposium on VLSI (GLSVLSI 2022), Irvine, CA, USA.
Program Committee (PC) member of the IEEE/ACM International Conference on Computer-Aided Design (ICCAD 2022), San Diego, California, USA.
Technical Program Committee (TPC) member of the IEEE Computer Society Annual Symposium on VLSI (ISVLSI 2022), Aliathon Resort, Pafos, Cyprus.
Technical Program Committee (TPC) member of the ACM Great Lakes Symposium on VLSI (GLSVLSI 2022), Orange County, CA, USA.
Technical Program Committee (TPC) member of the IEEE IEEE International Conference on Consumer Electronics (ICCE 2021), Las Vegas, Nevada, USA.
Technical Program Committee (TPC) member of the IEEE Computer Society Annual Symposium on VLSI (ISVLSI 2021), Online.
Program Committee (PC) member of the ACM Great Lakes Symposium on VLSI (GLSVLSI 2022, GLSVLSI 2021), Online.
Session Chair: Network-on-Chip Designs and On-Chip Communication, ACM Great Lakes Symposium on VLSI (GLSVLSI 2020), Beijing, China.
Technical Program Committee (TPC) member of the IEEE/ACM Design Automation Conference (DAC 2020), LBR Session, San Francisco, CA, USA.
Technical Program Committee (TPC) member of the IEEE Region 10 Symposium (TENSYMP 2020), Dhaka, Bangladesh.
Program Committee (PC) member of the ACM 30 th Great Lakes Symposium on VLSI (GLSVLSI 2020), Beijing, China.

Editorial Board Member:

(2022-present), Associate Editor, Springer Circuits, Systems and Signal Processing Journal.
(2022), Topic Lead Editor, Frontiers in Communications and Networks Journal.
(2019-present), Associate Editor, Semiconductor Science and Information Devices Journal.

Peer Reviewing:

(2023-present) Springer Nature Scientific Reports.
(2022-present) IEEE Transactions on Intelligent Transportation Systems (T-ITS).
(2022-present) IEEE Transactions on Industrial Informatics.
(2022-present) IEEE Access.
(2023-present) Springer Nature Journal of Cryptographic Engineering.
(2022--present) Frontiers In Communications And Networks.
(2022-present) MDPI Mathematics.
(2022--present) MDPI Healthcare.
(2022-present) MDPI Applied Sciences
(2022-present) MDPI Entropy.
(2022-present) MDPI Metrology.
(2022-present) AIMS Mathematical Bioscience and Engineering.
(2022-present) MDPI Applied Sciences.
(2021-present) IEEE Transactions on Neural Networks and Learning Systems.
(2021-present) IEEE Transactions on Green Communications and Networking.
(2021-present) MDPI Electronics.
(2021-present) Springer Artificial Intelligence Review.
(2021-present) IEEE Journal on Selected Areas in Communications (J-SAC).
(2020-present) IEEE/ACM Great Lakes Symposium on VLSI (GLSVLSI).
(2019-present) IEEE Transactions on Power Electronics.
(2018-present) Springer Analog Integrated Circuits & Signal Processing (ALOG).
(2018-present) Springer Nature Journal of Electronic Testing (JETTA).
(2018-present) IEEE Transactions on Device and Materials Reliability.
(2016-present) IET Electronics Letters.
(2016-present) Wiley International Journal of Circuit Theory and Applications (IJCTA).
(2015-present) IEEE International Symposium on Circuits and Systems (ISCAS).
(2015-present) IEEE International Midwest Symposium on Circuits and Systems (MWSCAS).
(2015-present) Elsevier Microelectronics.
(2014-present) IEEE/ACM International Conference on Computer-Aided Design (ICCAD).
(2014-present) IEEE Transactions on Circuits and Systems I (TCAS).
(2014-present) IEEE Transactions on Very Large Scale Integration (TVLSI).
(2014-present) IEEE/ACM Design Automation Conference (DAC).

Google Sites

Report abuse