We focus on micro/nano mechanics regarding bonding & reliability solutions for electronic devices including advanced semiconductor packages and display components.
On-going research work and funded projects are related to:
1) Advanced Semiconductor Packaging: Cu Hybrid Bonding, Fine-pitch Soldering
2) Thermo-Mechanical Reliability and Properties of Electronic Packages
3) Novel Bonding Technologies Including Lasers and Microwaves
4) Deformation Analysis Using Digital Image Correlation (3D / Microscale)
Keywords: 반도체 패키징, 신규 접합 기술, 신뢰성, 열기계적물성, 디지털이미지상관법
* To be updated