We focus on micro/nano mechanics regarding bonding & reliability solutions for electronic devices including advanced semiconductor packages and display components.
On-going research work and funded projects are related to:
1) Advanced Semiconductor Packaging: Cu Hybrid Bonding, Fine-pitch Soldering
2) Thermo-Mechanical Reliability and Properties of Electronic Packages
3) Novel Bonding Technologies Including Lasers and Microwaves
4) Deformation Analysis Using Digital Image Correlation (3D / Microscale)
Keywords: 반도체 패키징, 접합 공정, 첨단제조, 열기계신뢰성, 디지털이미지상관법
* TO BE UPDATED
[Projects]
We are conducting 8+ funded projects related to the aforementioned topics.
[Collaborators]
KAIST, SKKU, Hanyang Univ., Korea Univ., Yonsei Univ., Ajou Univ., Harvard Univ., SeoulTech, TU Korea, ...
KITECH, ETRI, KIMM, KANC, ...
SK hynix, Samsung electronics, Samsung display, LG innotek, Daeduck Electronics, STATSChipPAC, Amkor, Hyundai Motors, ...