Conference: IMPACT 2026 (Taipei, Taiwan)

(2026.10) We participated in the International Microsystems, Packaging, Assembly and Circuits Technology (IMPACT) conference held in Taiwan with five contributing papers. Well done!

Hangout in Songdo (2026.09)

(2026.09) Happy Chuseok holiday & Byeonhyeon's birthday!

Workshop at Busan

(2026.07) We gathered in Busan for a joint workshop w/ SKKU, KAIST, GIST, SNU, GKNU, HYU. Eunhye delivered an oral talk on micro-DIC metrology development for SiP structures.

Conference: KSPE 2026 (정밀공학회, 제주)

(2026.05) We participated in a focus-session of hybrid bonding technologies for advanced 3D packages and presented an oral talk at at KSPE 2026 in Jeju island. Photo of the Key-Tech Project Team.

Conference: ICEP 2026 (Hiroshima, Japan)

(2026.04) We participated in the International Conference on Electronics Packaging (ICEP) 2026 held in Japan, with three oral presentations. We also had a delightful dinner gathering with Dr. Dongjin Kim and his research group.

Conference: KMEPS 2026 (마이크로전자패키징학회, 송도)

(2026.04) We delivered three oral presentations. Congrats to Jeehoo and Hyunwoo on their Outstanding Presentation Awards! A big thank you to KMEPS for the great gathering and the lucky draw prize as well.

K-CHIPS Workshop

(2026.03) We successfully hosted the K-CHIPS workshop at KITECH, bringing together participants from SEOULTECH, SKKU, KAIST, GKNU, Sejong Univ., and SK hynix.

Seminar: Haedong Lecture (해동렉쳐, 서울대학교)

(2026.02) Dr. Lee delivered a HAEDONG LECTURE at SNU.

Conference: KCS 2026 (반도체학술대회, 정선)

(2026.01) We presented three papers at KCS 2026, including an invited talk by Dr. Lee. We enjoyed some recreation and skiing time together!

New Year Party

(2026.01) We gathered for a New Year celebration. Wishing everyone good luck, and a very happy birthday to Dr. Lee!

Conference: IMPACT 2025 (Taipei, Taiwan)

(2025.10) We presented three papers including an invited talk by Dr. Lee titled 'Understanding thermally induced failures in packaging interconnects via micro-scale deformation analysis.' Photos of Dr. Lee, Seongkyu, and Nahye. 

Workshop at Busan

(2025.07) We gathered in Busan for a joint workshop w/ SKKU, KAIST, GIST, SNU, GKNU, HYU. Eunhye delivered an oral talk on board-level reliability (BRL) analysis on semiconductor package by micro-DIC.

Conference: ICEM21 (Bologna, Italy)

(2025.07) We participated in ICEM21, held by EuraSEM. Jeehoo and Eunhye presented two oral talks on SMT soldering process and laser-assisted plastic welding technologies, respectively.

Conference: IEEE IITC 2025 (Busan, Korea)

(2025.06) Dr. Lee participated in IEEE IITC 2025, which was held in Korea for the first time. Delightful wine gathering with prof. Soohyun Kim, Dr. Chris Wilson, and Dr. Mansour Moinpour!

Workshop at Busan! (2024.07) 

Conference: ISMP 2023 (Busan, Korea)

(2023.10) Three poster presentations were made by our lab. Photo of Minhyuck, Jeehoo, Dr. Lee, Eunhye, and Sumin.

Conference: ICEM20 (Porto, Portugal)

(2023.07) Dr. Lee presented an oral talk at ICEM20. Photo of Mr. Song, Dr. Lee, Dr. Kim, and Dr. Oh at the Palace of Freixo overlooking the Douro River.

Conference: TMS 2023 (San Diego, USA)

(2023.03) An invited talk was delivered by Dr. Lee at the session of electronic packaging technologies.

Conference: ECS 2022 (Atlanta, USA)

(2022.10) Minjeong delivered her first oral presentation at an international conference in the session on carbon nanomaterials.