NEWS & Gallery

k-chips WOrkshop

(2026.03) We successfully hosted the K-CHIPS workshop at KITECH, bringing together participants from SEOULTECH, SKKU, KAIST, GKNU, Sejong Univ., and SK hynix.

Seminar: haedong lecture (해동렉쳐)

(2026.02) Dr. Lee delivered a seminar presentation at HAEDONG LECTURE.

Conference: kcs2026 (반도체학술대회, 정선)

(2026.01) APRIL presented three papers at KCS 2026. We enjoyed some recreation and skiing time together!

New year party

(2026.01) APRIL gathered for a New Year celebration. Wishing everyone good luck, and a very happy birthday to Dr. Lee!

Conference: ISMP 2025 (Daegu, korea)

(2025.11) Seongkyu received the Young Scientist Award!

Conference: KISM 2025 (busan, korea)

(2025.11) Dr. Lee presented an invited talk in the advanced packaging technology session.

Conference: iMPACT2025 (taipei, taiwan)

(2025.10) APRIL presented three papers including an invited talk by Dr. Lee titled 'Understanding thermally induced failures in packaging interconnects via micro-scale deformation analysis.' Photos of Dr. Lee, Seongkyu, and Nahye.

FAREWELl & Birthday party for minhyuck

(2025.09) Minhyuck joined StatsChipPac Korea after completing his MS degree with our group. Wishing him all the best for his future!

(2025.09) Nakyung Jeong has joined our group in a master's course. Welcome!

w/ Dept. Mechanical Engineering, SKKU (Prof. Dongwoo Lee)

Seminar at ksme (대한기계학회 신뢰성부문 - 반도체 산학연 협동 세미나)

(2025.09) Dr. Lee presented a seminar talk titled 'DIC-Based Analysis on Warpage and Thermo-Mechanical Reliability of Semiconductor Packages'.

Workshop at busan

(2025.07) APRIL gathered in Busan for a joint workshop w/ SKKU, KAIST, GIST, SNU, GKNU, HYU. Eunhye delivered an oral talk on board-level reliability (BRL) analysis on semiconductor package by micro-DIC.

Conference: icem21 (Bologna, Italy)

(2025.07) April participated in ICEM21, held by EuraSEM. Jeehoo and Eunhye presented two oral talks on SMT soldering process and laser-assisted plastic welding technologies, respectively.

Conference: IEEE IITC 2025 (BUSAN, Korea)

(2025.06) Dr. Lee participated in IEEE IITC 2025, which was held in Korea for the first time. Delightful wine gathering with prof. Soohyun Kim, Dr. Chris Wilson, and Dr. Mansour Moinpour!

Hangout in SONGDO (2025.05)

Conference: KSPE 2025 (정밀공학회, 제주)

(2025.05) Dr. Lee presented an oral talk in a focus-session of Hybrid bonding technologies for advanced 3D packages. Photo of the Key-Tech Project Team.

Conference: KSME 2025 (기계학회 신뢰성부문, 경주)

(2025.04) Dr. Lee presented an oral talk in the special session (Applications of digital image correlation) and recieved the KSME outstanding paper award. Conglatulations!

Conference: KMEPS 2025 (마이크로전자및패키징학회, 송도)

(2025.04) APRIL @ KMEPS 2025 (Our first full group photo). Dr. Lee delivered an oral presentation and recieved the KMEPS early career researcher award. Conglatulations!

Conference: TMS 2025 (LAs vegas, USA)

(2025.03) APRIL @ TMS 2025! We presented two papers in the electronic packaging session.

(2025.03) Hyunwoo Nam has joined our group in a master's course. Welcome!

w/ Dept. Mechanical Engineering, Suwon University (Prof. Tae-Yeob Kang)

(2025.03) Eunhye Lee has joined our group in a doctoral course. Welcome!

w/ Dept. Electrical Engineering, Korea Univ (Prof. Byeong-Kwon Ju)

Conference: ISMP-IRSP 2024 (Busan, korea)

(2024.11) Seongkyu received the Best Paper Award!

Conference: BDB MNJ (hangzhou, china)

(2024.10) Minhyuck presented a poster at the micro-nano joining session and received the Excellent Poster Award!

(2024.09) Jeehoo Na has joined our group in a doctoral course. Welcome!

w/ Dept. Mechanical Engineering, SKKU (Prof. Dongwoo Lee)

Workshop at Busan! (2024.07)

Hangout in SONGDO (2024.06)

Happy teachers' Day!

(2024.05) A surprise cake from the students for Dr. Lee. Much appreciated!

Conference: TMS 2024 (Orlando, USA)

(2024.03) Minjeong and Jeehoo contributed two oral presentations at the session of electronic packaging materials. Lunch time of Dr. Lee , Prof. Sim, Prof. Lee, Dr. Bae, and Mr. Lim.

Conference: KCS 2024 (한국반도체학술대회, 경주)

(2024.01) Jeehoo delivered an oral presentation during the session of advanced semiconductor packaging.

(2024.03) Seongkyu Choi has joined our group in a master's course. Welcome!

w/ Dept. Intelligence Robot Engineering, SKKU (Prof. Eun-Ho Lee)

Conference: ISMP 2023 (BUsan, Korea)

(2023.10) Three poster presentations were made by our lab. Photo of Minhyuck, Jeehoo, Dr. Lee, Eunhye, and Sumin.

Conference: ICEM20 (Porto, Portugal)

(2023.07) Dr. Lee presented an oral talk at ICEM20. Photo of Mr. Song, Dr. Lee, Dr. Kim, and Dr. Oh at the Palace of Freixo overlooking the Douro River.

(2023.03) Eunhye Lee has joined our group in a master's course. Welcome!

w/ Dept. Electrical Engineering, Korea Univ (Prof. Byeong-Kwon Ju)

(2023.03) Minhyuck Lee has joined our group in a master's course. Welcome!

w/ Dept. Mechanical Engineering, Inha Univ (Prof. Sang-Eui Lee)

Conference: TMS 2023 (San diego, USA)

(2023.03) An invited talk was delivered by Dr. Lee at the session of electronic packaging technologies.

Award

(2023.01) Dr. Lee received the KMEPS Publication Award. A photo with President Sayoon Kang.

Conference: ECS 2022 (ATLAnta, USA)

(2022.10) Minjeong delivered an oral presentation during the session on carbon nanomaterials.

meeting with prof. kunsik an

(2021.07) A delightful visit to our lab - looking forward to seeing you again!

(2022.09) Jeehoo Na has joined our group in a master's course. Welcome!

w/ Dept. Mechanical Engineering, SKKU (Prof. Dongwoo Lee)

(2021.03) Myung-Jun Ko has joined our group in a master's course. Welcome!

w/ Dept. Materials Science Engineering, Andong National Univ (Prof. Young-Bae Park)

(2020.09) Minjeong Sohn has joined our group in a master's course as the first graduate student. Welcome!

w/ Dept. Electrical Engineering, Korea Univ (Prof. Byeong-Kwon Ju)

Conference: KCS 2020 (한국반도체학술대회, 정선)

(2020.02) Dr. Lee delivered an invited talk at the Korean Conference on Semiconductors.

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