(2025.10) Understanding Thermally Induced Failures in Packaging Interconnects via Micro-scale Deformation Analysis
(2025.09) Topic: DIC-Based Analysis on Warpage and Thermo-Mechanical Reliability of Semiconductor Packages
(2025.07) APRIL gathered in Busan for a joint workshop w/ SKKU, KAIST, GIST, SNU, GKNU, HYU. Eunhye delivered an oral talk on board-level reliability(BRL) analysis for semiconductor package by micro-DIC method.
(2025.07) April participated in ICEM21, held by EuraSEM. Jeehoo and Eunhye presented two oral talks on SMT soldering process and laser-assisted plastic welding technologies, respectively.
(2025.06) Dr. Lee participated in IEEE IITC 2025, which was held in Korea for the first time. Delightful wine gathering with prof. Soohyun Kim, Dr. Chris Wilson, and Dr. Mansour Moinpour!
(2025.05) Dr. Lee presented an oral talk in a focus-session of Hybrid bonding technologies for advanced 3D packages. Photo of the Key-Tech Project Team.
(2025.04) Dr. Lee presented an oral talk in the special session (Applications of digital image correlation) and recieved the KSME outstanding paper award. Conglatulations!
(2025.04) APRIL @ KMEPS 2025 (Our first full group photo). Dr. Lee delivered an oral presentation and recieved the KMEPS early career researcher award. Conglatulations!
(2025.03) APRIL @ TMS 2025! We presented two papers in the electronic packaging session.
(2025.03) Hyunwoo Nam has joined our group in a master's course. Welcome!
w/ Dept. Mechanical Engineering, Suwon University (Prof. Tae-Yeob Kang)
(2025.03) Eunhye Lee has joined our group in a doctoral course. Welcome!
w/ Dept. Electrical Engineering, Korea Univ (Prof. Byeong-Kwon Ju)
(2024.11) Seongkyu received the Best Paper Award!
(2024.10) Minhyuck presented a poster at the micro-nano joining session and received the Excellent Poster Award!
(2024.09) Jeehoo Na has joined our group in a doctoral course. Welcome!
w/ Dept. Mechanical Engineering, SKKU (Prof. Dongwoo Lee)
(2024.03) Minjeong and Jeehoo contributed two oral presentations at the session of electronic packaging materials. Lunch time of Dr. Lee , Prof. Sim, Prof. Lee, Dr. Bae, and Mr. Lim.
(2024.01) Jeehoo delivered an oral presentation during the session of advanced semiconductor packaging.
(2024.03) Seongkyu Choi has joined our group in a master's course. Welcome!
w/ Dept. Intelligence Robot Engineering, SKKU (Prof. Eun-Ho Lee)
(2023.10) Three poster presentations were made by our lab.
(2023.07) Dr. Lee presented an oral talk at ICEM20. Photo of Mr. Song, Dr. Lee, Dr. Kim, and Dr. Oh at the Palace of Freixo overlooking the Douro River.
(2023 March) An invited talk was delivered by Dr. Lee at the session of electronic packaging technologies.
(2023.03) Eunhye Lee has joined our group in a master's course. Welcome!
w/ Dept. Electrical Engineering, Korea Univ (Prof. Byeong-Kwon Ju)
(2023.03) Minhyuck Lee has joined our group in a master's course. Welcome!
w/ Dept. Mechanical Engineering, Inha Univ (Prof. Sang-Eui Lee)
(2022.10) Minjeong delivered an oral presentation during the session on carbon nanomaterials.
(2022.09) Jeehoo Na has joined our group in a master's course. Welcome!
w/ Dept. Mechanical Engineering, SKKU (Prof. Dongwoo Lee)
(2021.03) Myung-Jun Ko has joined our group in a master's course. Welcome!
w/ Dept. Materials Science Engineering, Andong National Univ (Prof. Young-Bae Park)
(2020.09) Minjeong Sohn has joined our group in a master's course as the first graduate student. Welcome!
w/ Dept. Electrical Engineering, Korea Univ (Prof. Byeong-Kwon Ju)
(2020.02) Dr. Lee delivered an invited talk at the Korean Conference on Semiconductors.