JouRnal Papers

[ IN PREPARATION ]

[--] M. Sohn, S. Choi, J. J. Vlassak, T.-I. Lee*, “Deciphering Thermo-Mechanical Deformation Mechanisms in Semiconductor Package Interconnects via Microscale Digital Image Correlation", Under Review.

[--] Y.-S. Kim†, M. Sohn†, T.-I. Lee*, B.-K. Ju*, “Top-Side Extraction and Finite-NA Angular Output in Ultra-Small Blue GaN Micro-LEDs: P-GaN/AlGaN-EBL Phase Tuning and Radius Effects", Under Review.

[--] N. Jeong, T.-I. Lee*, "Revealing Shear-Driven Local Plasticity in Polyimide Film", Submitted.

[--] J. Na†, S. Yoon†, N. Kim, M. J. Kim*, T.-I. Lee*, "In-situ chemical reduction of Cu oxide during Cu–Cu bonding using reductive organic vapor", Submitted.

[--] N. Kim†, J. Na†, ... T.-I. Lee*, "Investigation on glucose vapor-assisted Cu-Cu bonding process".

[--] H.-Y. Yu, B. Kim, Y.R. Kim, S.-I. Kim, T.-I. Lee, M.-G. Lee, D. Kim*, "Enhanced thermal stability of direct cooling heatsink bonding for power electronics using instantaneous laser soldering: Experimental, FEM, and CFD investigation".

[--] E. Lee, ..., J. Choi, D. Yoon, T.-I. Lee*, "Integrated Structural Assessment of High Bandwidth Memories with Microscale Thermal Stress Evaluation".

[--] K. Choi†, M. Sohn†, ..., T.-I. Lee*, Y. H. Jung*, "Thermo-mechanical reliability of nano-composite elastomers by controlled particle dispersion for stretchable sensor".

[--] Y. Kim, H.-Y. Yu, S. Choi, E. Jo, B. Kim, J. Baik, J. Park, S. Yoo, T.-I. Lee*, D. Kim*, "Laser soldering vs. mass reflow soldering on the Al/Cu FPCB lap joints with SAC305 and Sn-Bi-Ag alloy solders".

[--] S. Choi, H. Nam, ..., E.-H. Lee, T.-I. Lee*, "DIC-FEM correlated analysis on warpage and interconnect strain for board-level packages".

[ PUBLISHED ] 54 peer-reviewed journal papers (46 SCI papers and 8 KCI papers)

Citation 2050+ / h-index 22 (google scholar)

†: first authors / *: corresponding author

[54] C.-Y. Gu, M. H. Choi, M. S. Ju, D. Kim, S. W. Ma, T.-I. Lee*, T.-S. Kim*, "Nonlinear Warpage Modeling of Dielectric-Controlled Carrier Wafers", International Journal of Mechanical Sciences, 314, 111361, 2026.

[53] J. Na, Y. Kim, J. Im, B. Kang, D. C. Jung, D. Kim*, T.-I. Lee*, "Capillary-Driven Solder Climbing on Au-Finished SMT Components with Vertical Micro-Grooved Surface During Reflow", Journal of Materials Research and Technology, 40, 6315-6327, 2026.

[52] J.-H. Park†, E. Lee†, I.-D Kim†, H. Jung, J. Kim, J. Cho, J.-H. Kim, T.-I. Lee*, S.-K. Kang*, E.-H. Lee*, "A review of the thermo-mechanical analysis framework for microelectronics packaging: mechanics, material property determination, and structural considerations", Materials Science in Semiconductor Processing, 205, 110321, 2026.

[51] Y. Kim, T.-I. Lee*, D. Kim*, "Contrasting effects of silver hillocks and copper diffusion on Ag sinter bonding in direct-cooled SiC power semiconductor module", Materials Science in Semiconductor Processing, 208, 110513, 2026.

[50] M. Kim†, M. Sohn†, T.-I. Lee*, J. S. Kang*, "Low Thermal Conductivity and High Electrical Conductivity in PEDOT:PSS/DMSO Composite with Hollow Glass Microspheres", ACS Applied Polymer Materials, 8(3), 2350-2360, 2026.

[49] B. Kim, H.-Y. Yu, B.-K. Ju, Y.-H. Ko, S. Yoo, T.-I. Lee*, D. Kim*, "Improved thermal management and manufacturing flexibility in power module heatsinks through rapid large-area laser soldering and maximized convective heat transfer", Case Studies in Thermal Engineering, 77, 107618, 2026.

[48] (KCI) S. Lee, E. Lee, B. Kim, T.-I. Lee, M.-S. Kim*, "Fabrication of Ag Nanowire Transparent Electrode with High Figure of Merit via Microwave Irradiation", Journal of the Microelectronics & Packaging Society, 32(4), 99-107, 2025.

[47] E. Lee, J. Na, B.-K. Ju, T.-I. Lee*, "Absorber-Free Laser Welding of Transparent Thermoplastic Films via Expanded Beam for Flexible Displays", ACS Applied Materials & Interfaces, 17(48), 65757, 2025.

[46] M. Lee, J. Seo, J. Baek, S.-E. Lee, T.-I. Lee*, "Deformation-Informed Design of Dual-Cure Adhesives for Camera Modules Using Microscale Digital Image Correlation", Materials & Design, 260, 115030, 2025.

[45] M.-J. Ko†, E. Lee†, K. An, Y.-B. Park, T.-I. Lee*, "Laser-assisted bonding of flexible substrates and electrodes using carbon nanotubes", ACS Applied Polymer Materials, 7(12), 8093-8100, 2025.

[44] T.-I. Lee†*, J. H. Kim†, E. S. Oh, and T.-S. Kim*, "Direct tensile testing of free-standing ultrathin polymer films on liquid surface at high temperature", Small Methods, 9(4), 2401291, 2025.

[43] J. Na, E. Lee, K.-H. Park, D. Lee, T.-I. Lee*, "Glycerol vapor assisted Cu direct bonding: Implications for 3D semiconductor packaging", Advanced Materials Technologies, 10(5), 2401184, 2025.

[42] M. Sohn†, Y.-S. Kim†, J. Na, M.-S. Kim, B.-K. Ju*, T.-I. Lee*, "Microwave bonding of thin polymer substrates using carbon nanotubes for flexible interconnections", ACS Applied Nano Materials, 7(14), 16534-16541, 2024.

[41] T.-I. Lee†, J. H. Kim†, D. J. Kim, and T.-S. Kim*, "Evaluating Free Thermal Expansion and Glass Transition of Ultrathin Polymer Films on Heated Liquid", ACS Applied Materials & Interfaces, 16(23), 30336-30343, 2024.

[40] J.-M. Jeong†, M. Sohn†, J. Bang, T.-I. Lee*, M.-S. Kim*, "Fast, facile and thermal damage free nano-welding of Ag nanowire for flexible transparent conductive film by pressure-assisted microwave irradiation", Scientific Reports, 13, 14354, 2023.

[39] (KCI) B. Kang, J. Na, M. J. Ko, M. Sohn, Y.-H. Ko, T.-I. Lee*, "Scarf welding of thin substrates and evaluation of the tensile properties", Journal of the Microelectronics & Packaging Society, 30(3), 1-6, 2023. (Outstanding Paper Award)

[38] (KCI) J. Bang, S.-I. Kim, Y.-C. Kim, D.-Y. Yu, D. Kim, T.-I. Lee, M.-S. Kim, J. Park, "Battery module bonding technology for electric vehicles", Journal of the Microelectronics & Packaging Society, 30(2), 33-42, 2023.

[37] D. J. Kim, B. Lee, T.-I. Lee, S. Noh, C. Choe, S. Park, M. S. Kim*, "Power cycling tests under driving ΔTj = 125 °C on the cu clip bonded EV power module", Microelectronics Reliability, 138, 114652 2022.

[36] B. J. Ahn, J. H. Kim, K. Cheon, T.-I. Lee, Y.-B. Park, J. Kim, Y.-H. Ko*, "Joint reliability of Al wire bonding on OSP and ENIG surface-finished substrates under complex stress induced with current and temperature", Journal of Materials Science: Materials in Electronics, 33, 21127, 2022.

[35] H. E. Lee, D. Lee, T.-I. Lee, J. H. Shin, G.-M. Choi, C. Kim, S. H. Lee, J. H. Lee, Y. H. Kim, S.-M. Kang, S. H. Park, I.-S. Kang, T.-S. Kim, B.-S. Bae*, K.-J. Lee*, "Siloxane hybrid material-encapsulated highly robust flexible μLEDs for biocompatible lighting applications", ACS Applied Materials & Interfaces, 14, 28258, 2022.

[34] (KCI) M.-J. Ko, M. Sohn, M.-S. Kim, G. Na, B.-K. Ju, Y.-B. Park, T.-I. Lee*, "Laser transmission welding of flexible substrates using carbon nanotubes and evaluation of mechanical properties", Journal of the Microelectronics & Packaging Society, 29(2), 113-119, 2022. (Outstanding Paper Award)

[33] W. Jo, T.-I. Lee, T.-S. Kim*, "Enlarged tensile strain at edge of flexible substrate due to anticlastic curvature", Microelectronic Reliability, 130, 114485, 2022.

[32] J. B. Ko, S. Lee, T.-I. Lee, S. Lee, J. Kim, H. Kim, T.-S. Kim, S.-H. K. Park*, "Ultrathin, flexible, and transparent oxide thin-film transistors by delamination and transfer methods for deformable displays", Advanced Materials Technologies, 6, 2100431, 2021.

[31] (KCI) M. Sohn, M.-S. Kim, B.-K. Ju*, T.-I. Lee*, "Room-temperature Bonding and Mechanical Characterization of Polymer Substrates using Microwave Heating of Carbon Nanotubes", Journal of the Microelectronics & Packaging Society, 28(2), 1-6, 2021.

[30] G. Jeong, D.-Y. Yu, S. Baek, J. Bang, T.-I. Lee, S.-B. Jung, J. Kim, Y.-H. Ko*, "Interfacial reactions and mechanical properties of Sn–58Bi solder joints with Ag nanoparticles using ultra-fast laser bonding". Materials, 14, 335, 2021.

[29] (KCI) W. Seo, T.-I. Lee, Y.-H. Kim, S. Yoo*, "Brittle fracture behavior of ENIG/Sn-Ag-Cu solder joint with pH of Ni-P electroless plating solution", Journal of the Microelectronics & Packaging Society, 27(3), 29-34, 2020.

[28] H.-I. Jang, H.-S. Yoon, T.-I. Lee, S. Lee, T.-S. Kim, J. Shim*, J. H. Park*, "Creation of curved nanostructures using soft-materials-derived lithography", Nanomaterials, 10, 2414, 2020.

[27] S. Kwon, T.-I. Lee, H.-J. Lee*, S. Yoo*, "Improved sinterability of micro-scale copper paste with a reducing agent", Materials Letters, 269, 127656, 2020.

[26] S.-Y. Jung, T.-I. Lee, M. Cho, T.-S. Kim, and K.-W. Paik*, "A Study on the flexible chip on fabric (COFa) assemblies using anisotropic conductive films (ACFs) and metal-laminated fabric substrates", IEEE Transactions on Components, Packaging and Manufacturing Technology, 10(3), 1109, 2020.

[25] S.-Y. Jung, S. J. Oh, T.-I. Lee, T.-S. Kim, K.-W. Paik*, “A study on the fabric substrates with fine-pitch laminated Cu metal patterns using B-stage adhesive films”, IEEE Transactions on Components, Packaging and Manufacturing Technology, 10(1), 176-183, 2020.

[24] T.-I. Lee, W. Jo, W. Kim, J.-H. Kim, K.-W. Paik, and T.-S. Kim*, "Direct visualization of cross-sectional strain distribution in flexible devices", ACS Applied Materials & Interfaces, 11, 13416-13422, 2019.

[23] S. Kim, M. Amjadi, T.-I. Lee, Y. Jeong, D. Kwon, M. S. Kim, K. Kim, T.-S. Kim, Y. S. Oh*, I. Park*, “Wearable, ultrawide-range, and bending-insensitive pressure sensor based on carbon nanotube network-coated porous elastomer sponges for human interface and healthcare devices”, ACS Applied Materials & Interfaces, 11, 23639-23648, 2019.

[22] J.-H. Kim, K.-L. Jang, K. Ahn, T. Yoon, T.-I. Lee, and T.-S. Kim*, "Thermal expansion behavior of thin films expanding freely on water surface", Scientific Reports, 9, 7071, 2019.

[21] M. B. Khan, D. H. Kim, J. H. Han, H. Saif, H. Lee, Y. Lee, M. Kim, E. Jang, S. K. Hong, D. J. Joe, T.-I. Lee, T.-S. Kim, K. J. Lee*, Y. Lee*, "Performance improvement of flexible piezoelectric energy harvester for irregular human motion with energy extraction enhancement circuit", Nano Energy, 58, 211-219, 2019.

[20] H. E. Lee†, D. Lee†, T.-I. Lee, J. H. Shin, G.-M. Choi, C. Kim, S. H. Lee, J. H. Lee, Y. H. Kim, S.-M. Kang, S. H. Park, I.-S. Kang, T.-S. Kim, B.-S. Bae*, and K. J. Lee*, “Wireless powered wearable micro light-emitting diodes”, Nano Energy, 55, 454-462, 2018.

[19] J. Seo, C. Kim, B.S. Ma, T.-I. Lee, J. H. Bong, J.-G. Oh, B. J. Cho and T.-S. Kim*, "Direct graphene transfer and its application to transfer printing using mechanically controlled, large area graphene/copper freestanding layer", Advanced Functional Materials, 28, 1707102, 2018.

[18] Y. Kim, Y. Kim, T.-I. Lee, T.-S. Kim, S. Ryu*, “An extended analytic model for the elastic properties of platelet-staggered composites and its application to 3D printed structures”, Composite Structures, 189, 27-36, 2018.

[17] T.-I. Lee, C. Kim, J.-B. Pyo, M. S. Kim*, and T.-S. Kim*, "Effect of anisotropic thermo-elastic properties of woven-fabric laminates on diagonal warpage of thin package substrates", Composite Structures, 176, 973-981, 2017.

[16] J.-H. Kim†, T.-I. Lee†, T.-S. Kim, K.-W. Paik*, "The effect of anisotropic conductive films adhesion on the bending reliability of chip-in-flex packages for wearable electronics applications", IEEE Transactions on Components, Packaging and Manufacturing Technology, 7, 1583, 2017.

[15] C. Kim, T.-I. Lee, M. S. Kim*, T.-S. Kim*, “Mechanism of warpage orientation rotation due to viscoelastic polymer substrates during thermal processing”, Microelectronics Reliability, 73, 136-145, 2017.

[14] J.-W. Seo†, M. Joo†, J. Ahn, T.-I. Lee, T.-S. Kim, S. G. Im*, and J.-Y. Lee*, “Facilitated embedding of silver nanowires into conformally-coated iCVD polymer films deposited on cloths for robust wearable electronics”, Nanoscale, 9, 3399-3407, 2017.

[13] T.-I. Lee, C. Kim, M. S. Kim*, and T.-S. Kim*, "Flexural and tensile moduli of flexible FR4 substrates", Polymer Testing, 53, 70-76, 2016.

[12] T.-I. Lee, M. S. Kim*, and T.-S. Kim*, "Contact-free thermal expansion measurement of very soft elastomers using digital image correlation", Polymer Testing, 51, 181-189, 2016.

[11] T.-W. Kim, T.-I. Lee, Y. Pan, W. Kim, T.-S. Kim, and K.-W. Paik*, “Effect of nanofiber orientation on nanofiber solder anisotropic conductive films (ACFs) joint properties and bending reliability of flex-on-flex (FOF) assembly”, IEEE Transactions on Components, Packaging and Manufacturing Technology, 6, 1317-1329, 2016.

[10] J. Ahn†, J.-W. Seo†, T.-I. Lee, D. Kwon, I. Park, T.-S. Kim, and J.-Y. Lee*, “Extremely robust and patternable electrodes for copy-paper-based electronics”, ACS Applied Materials & Interfaces, 8, 19031-19037, 2016.

[09] J.-H. Kim†, T.-I. Lee†, J.-W. Shin, T.-S. Kim, K.-W. Paik*, "Bending properties of anisotropic conductive films assembled chip-in-flex packages for wearable electronics applications", IEEE Transactions on Components, Packaging and Manufacturing Technology, 6, 208-215, 2016.

[08] Y.-L. Kim†, T.-I. Lee†, J.-H. Kim, W. Kim, T.-S. Kim, K.-W. Paik*, "Effects of the mechanical properties of polymer resin and the conductive ball types of anisotropic conductive films on the bending properties of chip-in-flex package", IEEE Transactions on Components, Packaging and Manufacturing Technology, 6, 200-207, 2016.

[07] (KCI) T.-I. Lee, C. Kim, M. S. Kim*, and T.-S. Kim*, "Measurement of flexural modulus of lamination layers on flexible substrates", Journal of the Microelectronics & Packaging Society, 23(3), 63-67, 2016.

[06] (KCI) C. Kim, T.-I. Lee, and T.-S. Kim*, “Measurement technologies of mechanical properties of polymers used for flexible and stretchable electronic packaging”, Journal of the Microelectronics & Packaging Society, 23(2), 19-28, 2016.

[05] D. Kwon, T.-I. Lee, J. Shim, S. Ryu, M. S. Kim, S. Kim, T.-S. Kim, I. Park*, “Highly sensitive, flexible and wearable pressure sensor based on a giant piezocapacitive effect of three-dimensional microporous elastomeric dielectric layer”, ACS Applied Materials & Interfaces, 8, 16922-16931, 2016.

[04] J.-B. Pyo, T.-I. Lee, C. Kim, M. S. Kim*, and T.-S. Kim*, “Prediction of time-dependent swelling of flexible polymer substrates using hygro-mechanical finite element simulations”, Soft Matter, 12, 4135-4141, 2016.

[03] S.-H. Kim, H. R. Lee, S. J. Yu, M.-E. Han, D. Y. Lee, S. Y. Kim, H.-J. Ahn, M.-J. Han, T.-I. Lee, T.-S. Kim, S. K. Kwon*, S.-G. Im*, N. S. Hwang*, “Hydrogel-laden paper scaffold system for origami-based tissue engineering”, Proceedings of the National Academy of Sciences (PNAS), 112 (50) 15426-15431, 2015.

[02] Y.-H. Lee, Y. Kim, T.-I. Lee, I. Lee, J. Shin, H. S. Lee, T.-S. Kim, and J. W. Choi*, “Anomalous stretchable conductivity using an engineered tricot weave”, ACS Nano, 9, 12214–12223, 2015.

[01] C. Kim, T.-I. Lee, M. S. Kim*, and T.-S. Kim*, “Warpage analysis of electroplated Cu films on fiber-reinforced polymer packaging substrates”, Polymers, 7, 985-1004, 2015.

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