International Conferences (Selected)
[18] E. Lee, J. Na, B.-K. Ju, T.-I. Lee*, “Low temperature and precision bonding technology using spread laser beam for thin lens package”, ICEM 2025, Bologna, Italy, 2025/07. (Oral)
[17] J. Na, E. Lee, Y. Kim, E. Jo, D. Kim, D. Lee, T.-I. Lee*, “Capillary driven solder climbing due to hairline surface texture for advanced package assembly”, ICEM 2025, Bologna, Italy, 2025/07. (Oral)
[16] E. Lee, J. Na, S. E. Han, T. Y. Lim, S. J. Lee, T.-I. Lee*, “Transparent, flexible bonding of polymer substrates using laser irradiation”, TMS 2025, Las Vegas, USA, 2025/03. (Oral)
[15] M. Lee, M. Sohn, S. Choi, N. Jeong, T.-I. Lee*, “Micro-scale digital image correlation for reliability characterization of epoxy/Al joint for high precision sensing camera assembly”, TMS 2025, Las Vegas, USA, 2025/03. (Poster)
[14] S. Choi, M. Lee, S.-E. Han, J. Kim, E.-H. Lee, T.-I. Lee*, “Microsecale failure prediction for thermal fatigue damge in fine pitch solder bump of flip chip package”, ISMP-IRSP 2024, Busan, Korea, 2024/11. (Poster)
[13] M. Lee, M.-J. Ko, N. Jeong, S.-E. Han, S.-E. Lee, T.-I. Lee*, “Visualizing Distribution of Thermal Strain at Epoxy Joints Through Direct Observation of Cross-Sections”, BDB MNJ 2024, Hangzhou, China, 2024/10. (Poster) - Excellent Poster Award
[12] J. Na, E. Lee, D. Lee, T.-I. Lee*, “Development of low-temperature Cu-to-Cu direct bonding technology using glycerol vapor for Cu surface antioxidant”, TMS 2024, Orlando, USA, 2024/03. (Oral)
[11] M. Sohn, M.-H. Lee, D. Yu, B.-K. Ju, T.-I. Lee*, “Thermal strain measurement of solder joint in electronic packages”, TMS 2024, Orlando, USA, 2024/03. (Oral)
[10] T.-I. Lee*, “Fabricating laser bonded joint of polymer substrates by using carbon-nanotube adhesion layer”, ICEM, Porto, Portugal, 2023/07. (Oral)
[9] T.-I. Lee*, “Flexible packaging by microwave bonding for flexible electronics”, TMS 2023, San Diego, USA, 2023/03. (INVITED, Oral)
[8] M. Sohn, B. J. Ahn, Y.-H. Ko, B. K. Ju, T.-I. Lee*, “Evaluating thermal strain of solder joint in electronic packages”, 2021 ISMP, Busan, Korea, 2021/11. (Poster)
[7] M. Sohn, M. S. Kim, B. K. Ju, T.-I. Lee*, “Microwave bonding of flexible substrates and its mechanical characterization", 2021 ISMP, Busan, Korea, 2021/11. (Oral) -Young Scientist Award
[6] T.-I. Lee, “Process development for internal strain evaluation in wearable devices”, ENGE2020, Jeju, Korea, 2020/11. (Poster)
[5] T.-I. Lee, W. Kim, W. Jo, J.-H. Kim, K.-W. Paik, and T.-S. Kim*, “Experimental verification of through-thickness strain distribution in flexible devices under bending”, ICEM 2018, Brussel, Belgium, 2018/07. (Oral)
[4] T.-I. Lee, C. Kim, J.-B. Pyo, M. S. Kim, and T.-S. Kim, “Effect of anisotropic mechanical properties of woven composite substrates on warpage orientation of printed circuit boards”, ICEP 2017, Yamagata, Japan, 2017/04. (Poster)
[3] T.-I. Lee, C. Kim, M. S. Kim, and T.-S. Kim, "Measuring coefficient of thermal expansion of silicone elastomers in a very wide range of modulus by digital image correlation", 2016 MRS Spring Meeting & Exhibit, Phoenix, USA, 2016/03. (Oral)
[2] T.-I. Lee, C. Kim, M. S. Kim, and T.-S. Kim, "A non-contact method to measure thermal expansion coefficient of PDMS for soft electronics", ISMP 2015, Ilsan, Korea, 2015/10. (Oral)
[1] T.-I. Lee, C. Kim, M. S. Kim and T.-S. Kim, “Flexural modulus measurement and warpage analysis of multilayers on polymer composite substrates for flexible electronics”, ENGE2014 Meeting, Jeju, Korea, 2014/11. (Oral)
Domestic Conferences (Selected)
[12] M. Lee, M. Sohn, S.-E. Lee, T.-I. Lee*, “Thermal strain measurement of heterogeneous interfaces in electronic packages”, KMEPS Spring Conference, Gwangju, Korea, 2024/04. (Poster)
[11] E. Lee, J. Na, S. Lee, B.-K. Ju, T.-I. Lee*, “Adhesive-free bonding of flexible substrates by using laser heating”, KMEPS Spring Conference, Gwangju, Korea, 2024/04. (Poster)
[10] J. Na, M. Ko, M. Sohn, B. Kang, D. Lee, T.-I. Lee*, “Development of local heating film edge bonding technology by microwave irradiation”, KMEPS Spring Conference, Gwangju, Korea, 2024/04. (Poster)
[9] T.-I. Lee*, “Deformation evaluation of micro-LED joint with hybrid epoxy and solder films”, 2023 Fall Meeting: The Korean Welding and Joining Society, 2023/10. (Oral)
[8] M. Sohn, K, Cheon, Y.-B. Park, Y.-H. Ko, B.-K. Ju, T.-I. Lee*, “Thermal strain analysis of solder joint in electronic packages using digital image correlation method”, KMEPS Spring conference, Suwon, Korea, 2022/04. (Oral)
[7] M. Sohn, M. S. Kim, B. K. Ju, T.-I. Lee*, "Bonding and interfacial analysis of flexible substrates by CNT microwave heating", The 29th Korean Conference on Semiconductors (KCS), Gangwon-do, Korea, 2022/01. (Oral)
[6] M. Sohn, M. S. Kim, B. K. Joo, T.-I. Lee*, “Microwave bonding of flexible substrates and its mechanical characterization", 2021 Spring Meeting: Korean Microelectronic and Packaging Society (KMEPS), Seoul, Korea, 2021/04. (Poster) - Best Poster Award
[5] T.-I. Lee, “Micro-scale deformation analysis at package interconnect for flexible applications”, 2020 Fall Meeting: Korean Microelectronic and Packaging Society (KMEPS), Incheon, Korea, 2020/11. (Poster)
[4] T.-I. Lee, W. Jo, W. Kim, J.-H. Kim, K.-W. Paik, and T.-S. Kim*, “Mechanical strain analysis for package interconnect using digital image correlation”, 2019 Fall Meeting: The Korean Welding and Joining Society, Daegu, Korea, 2019/11. (Oral)
[3] T.-I. Lee, W. Jo, W. Kim, J.-H. Kim, K.-W. Paik, and T.-S. Kim*, “Directly visualizing internal distribution of bending strain in flexible devices”, 2019 Spring Meeting: Korean Society for Precision Engineering, Jeju, Korea, 2019/05. (Oral)
[2] T.-I. Lee, W. Jo, W. Kim, J.-H. Kim, K.-W. Paik, and T.-S. Kim*, “Method development for cross-sectional strain analysis of flexible substrates under bending”, 2019 Spring Meeting: Korean Microelectronic and Packaging Society (KMEPS), Ansan, Korea, 2019/04. (Oral)
[1] T.-I. Lee, C. Kim, J.-B. Pyo, M. S. Kim, and T.-S. Kim, “Diagonal warpage of thin package substrates due to anisotropic thermo-elastic properties of woven-fabric composite substrates”, 2017 Spring Meeting: The Korean Society of Mechanical Engineers, Jeju, Korea, 2017/04. (Oral)
Patents
[11] (Filed) T.-I. Lee, E. Lee, T. Im, D. J. Kim, S. Yoo, Y.-H. Ko, “Shading and Adhesion Spacer Material for Compact Lens Module (박형 렌즈 모듈 차광 접합 소재)”, KR 10-2024-0176798, 2024/12/02.
[10] (Issued) T.-I. Lee, Y.-H. Ko, S. Yoo, M.-S. Kim, M. Sohn, “Deformation measuring Method of Thin Flexible Material (박막 유연기기 측면 변형률 측정방법)”, KR 10-2677684, 2024/6/19.
[9] (Issued) Y.-H. Ko, M. S. Kim, T.-I. Lee, D. Yu, “Thermo-compression bonding equipment (열가압 접합장치)”, KR 10-2513154, 2023/03/20.
[8] (Filed) T.-I. Lee, E. Lee, J. Na, M. Lee, M. S. Kim, “stick for electronic cigarette and manufacturing method thereof (전자담배 유전가열을 위한 가열체 제작 및 스틱 구조)”, KR 10-2023-0168215, 2023/11/28.
[7] (Filed) T.-I. Lee, S. Yoo, M. Lee, M. Ko, “Separating Device and Method for Display cover class (디스플레이 커버글래스 분리장치 및 방법)”, KR 10-2023-0162980, 2023/11/22.
[6] (Filed) T.-I. Lee, Y-.H. Ko, S. Yoo, M. J. Ko, J. Na, “Flexible substrate electrode bonding method using
carbon nano-material with laser and flexible substrate manufactured by the same (레이저를 이용한 탄소나노소재 유연기판 전극 접합방법 및 이를 통하여 제작된 유연기판 접합체)”, KR 10-2022-0164437, 2022/11/30.
[5] (Filed) T.-I. Lee, M.-S. Kim, Y.-H. Ko, M. J. Ko, M. Sohn, “Flexible substrate bonding method using carbon nano-material, flexible substrate assembly manufactured by the same and fixing jig for the same (레이저를 이용한 탄소나노소재 유연기판 접합방법 및 이를 통하여 제작된 유연기판접합체)”, KR 10-2022-0164437, 2022/11/30.
[4] (Filed) T.-I. Lee, J. H. Bang, D. Kim, M. J. Ko, B. S. Kang, “Flexible substrate bonding method using carbon nano-material, flexible substrate assembly manufactured by the same and fixing jig for the same (탄소나노소재를 이용한 유연기판 경사면 접합방법, 이를 통하여 제작된 유연기판 접합체 및 이를 위한 고정지그)”, KR 10-2022-0164437, 2022/11/30.
[3] (Issued) S. Yoo, T.-I. Lee, S. Kwon, “Copper paste composition for sinter joining and use of the same (소결접합용 구리 페이스트 조성물 및 이의 용도)”, KR 10-2020-0028463, 2020/03/06.
[2] (Issued) T.-S. Kim, T.-I. Lee, K.-L. Jang, “Apparatus for measuring thermo-mechanical properties of thin films and method thereof (박막의 열기계적 물성을 측정하기 위한 장치 및 그 방법)”, KR 10-1992438-0000, 2019/06/18.
[1] (Issued) M. S. Kim, T.-S. Kim, T.-I. Lee, “Apparatus for non-contact measurement of thermal expansion (열팽창계수 측정장치)”, KR 10-1717591-0000, 2017/03/13