Conferences (International)

Invited 

• Sang Won Yoon, "Considerations for Packaging Solutions for Current Automotive Power Modules,"  22nd International Symposium on Microelectronics and Packaging joined with the 18th International Conference Reliability and Stress-Related Phenomena in Nanoelectronics (ISMP-IRSP 2024), Nov. 2024

• Sang Won Yoon, "Packaging Approaches for Wide Bandgap Power Semiconductors: Challenges and Efforts," 11th Asia-Pacific Workshop on Widegap Semiconductors (APWS 2024), Oct. 2024 (Invited Talk)

• Sang Won Yoon, "Packaging Solutions for Power Semiconductors: Power Modules and Their Applications", SiC Power Semiconductor Summit, Semicon Korea, Feb. 2024 (Invited Talk)

• Sang Won Yoon, "Design and Analysis Approaches of Power Modules used in Various Automotive Applications," International Welding & Joining Conference-Korea 2022 (IWJC-Korea 2022), Oct. 2022 (Invited Talk)

• Sang Won Yoon, "Power semiconductor packaging approaches - A way to a reliable power module system", 19th International Symposium on Microelectronics and Packaging (ISMP), Nov.  2021 (Invited Talk)

• Sang Won Yoon, "Approaches of Highly Reliable Package for High Power Electronic Devices", Asia-Pacific Workshop on Fundamentals and Applications of Advanced Semiconductor Devices (AWAD), Aug. 2021 (Invited Talk)

Presentations

• Jaejin Jeon, Kyung Tae Min, SangWon Yoon, "Reducing Parasitic Inductance Through Power Terminal Grouping in SiC Power Modules for EV Applications", 2025 ICSCRM, Busan, Korea, Sep 2025

• Bonghak Lee, Seokjin Shin, SangWon Yoon, "RC Snubber Co-Design of SiC Power Modules considering Impact on Transient Switching Characteristics", 2025 ICSCRM, Busan, Korea, Sep 2025

• A Yeong Choi and SangWon Yoon, "Electrical and Thermo-Mechanical Analysis of 650V GaN Power Modules with Symmetric and Unsymmetric Lateral Layout using Power Cycling FEA Simulation ", 2025 Asia-Pacific Workshop on Advanced Semiconductor Devices (AWAD2025),Nara, Japan, July, 2025 (Oral Presentation)

• Bong Hak Lee and SangWon Yoon, "Prelimiary Study on Simulation Challenges in Warpage Analysis from Wafer- to Panel Level Packaging Using the Equivalent CTE model ", 2025 Asia-Pacific Workshop on Advanced Semiconductor Devices (AWAD2025), Nara, Japan, July, 2025

• Eun Pyo Hong and SangWon Yoon, "Heat Dissipation Improvement Using Plugged Sidewall for 3-Dimensional (3D) Package of High-Stacked High Bandwidth Memory (HBM) ", 2025 Asia-Pacific Workshop on Advanced Semiconductor Devices (AWAD2025), Nara, Japan, July, 2025

• Sun Seong Kwon and SangWon Yoon, "Comparative Estimation for the transition from Thermocompression Bonding to Direct Metal Bonding of High Bandwidth Memory(HBM) based on 3D Finite Element Analysis Simulations ", 2025 Asia-Pacific Workshop on Advanced Semiconductor Devices (AWAD2025), Nara, Japan, July, 2025

• Sang Won Yoon, Jihwan Seong, Min-Ki Kim, "Experimental Validation of Parasitic Inductance Reduction by Me ander-shaped Cover-all Interconnection Design for 650V GaN e HEMT Power Modules" ,The Power Conversion and Intelligent Motion (PCIM Europe), Nuremberg, Germany, May 2025

• Hyunseup Jo and Sang Won Yoon, "Visual and Inertial Sensor Fusion Approach for Visual Inertial Odometry Used in Vehicle Localization," IEEE Sensors, 2024 (Oral Presentation)

• Jung Su Yoon and SangWon Yoon, "Dependency Analysis of Wargapge in Semiconductor Package by Epoxy Molding Compound Property with simulatnous consideration of Shrinkage and CTE Mismatch", 2024 Asia-Pacific Workshop on Advanced Semiconductor Devices (AWAD2024), July, 2024

• Jeong Hun Song and SangWon Yoon, "Thermal Dissipation Analysis of High Bandwidth Memory(HBM) using 3D Finite Element Analysis(FEA) simulations", 2024 Asia-Pacific Workshop on Advanced Semiconductor Devices (AWAD2024), July, 2024

• Ji Yong So and SangWon Yoon, "Heat Dissipation Performance Dependency on Thermal Interface Material used in Indirect Double-Sided Cooling Power Modules," 2024 Asia-Pacific Workshop on Advanced Semiconductor Devices (AWAD2024), July, 2024 (Oral Presentation)

• Kyung Tae Min and SangWon Yoon, "Approach to Reduce Parasitic Inductance in Automotive Power Modules Considering Selected Parallelization of Power Terminals," International Electric Vehicle Symposium and Exhibition (EVS37)", April, 2024 (Oral Presentation)

• Hobeom Han, Sang Won Yoon, "Comprehensive LiDAR Sensor Noise Model and Application to Texture and Object Classification Using Custom Deep Learning," IEEE Sensors Conference, Oct.-Nov. 2023

• Hyunjun Cha, Yegyun Oh, Hobeom Han, Sang Won Yoon, "Plural Kalman Filter-Based Algorithm for Suppressing Strong Magnetic Disturbance in Automotive Steering Angle Sensors," IEEE Sensors Conference, Oct.-Nov. 2023

• Jaemyung Lim and Sang Won Yoon, "Thermal Modeling for Chiplet Package," International Symposium on Microelectronics and Packaging (ISMP), Nov.  2023 (Oral presentation)

• Sang Won Yoon, J. Lim, J. Jeon, J. Seong, H. Han, S. M. Cho, "Multi-Physics Analysis considering Electrical and Thermal Properties of  Power Module used in Automotive and Industrial Applications," International Symposium on Microelectronics and Packaging (ISMP), Nov.  2023 (Oral presentation)

• Seokjin Shin and Sang Won Yoon, "Simulation and Experiment Investigation of Overshoot Voltage and Settling Time in RC Snubber Integrated Silicon Carbide Power Module," Asia-Pacific Workshop on Advanced Semiconductor Devices (AWAD 2023), Yokohama, Japan, July, 2023

• SeungHyun Won and Sang Won Yoon,  "Thermal Performance Analysis of Vertically Stacked Structure in Double-Sided Cooling SiC MOSFET Power Modules," Asia-Pacific Workshop on Advanced Semiconductor Devices (AWAD 2023), Yokohama, Japan, July, 2023

• Jaehyun Cho and Sang Won Yoon, "Comparative Analysis of Epoxy Molding Compound (EMC) Material Properties Used in Double-sided Cooling Power Module," 11th International Conference on Power Electronics (ICPE 2023-ECCE Asia), Jeju, Korea, May 2023 (Oral presentation)

• Min-Ki Kim, Sang Won Yoon, "Thermal Impedance Measurement Utilizing Optical Measurement and Thermal Impedance Model for Multichip SiC MOSFET Module with Anti-Parallel Diodes", accepted to The Power Conversion and Intelligent Motion (PCIM Europe), May 2021 (Oral presentation)

• Jihwan Seong, Min Ki Kim, Sang Won Yoon, "Analysis of new interconnection covering top metallization layer for 650V GaN e-HEMT power modules", accepted to The Power Conversion and Intelligent Motion (PCIM Europe), Nuremberg, Germany, July 2020 (Oral presentation)

• Hobeom Han, Hyeongkyu Jang, Sang Won Yoon, "Driver Head Posture Monitoring Using MEMS Magnetometer and Neural Network for Long-Distance Driving Fatigue Analysis", IEEE SENSORS 2019, Montreal, Canada, Oct., 2019

• Jangmuk Lim, Jihwan Seong, Sang Won Yoon, You Suk Kim, Hun-chang Lim and Won Sik Hong, "Industrial 650V 4-Pack Super-Junction MOSFET Module using Transfer Molding Process", IEEE Energy Conversion Conference & Congress (ECCE), Baltimore, MD, Sep. 2019

• Sang Won Yoon, Sangyoo Lee,"Simulation Analysis of Selective Cooling for Correcting Unbalanced Temperature of Multiple Power Dies in SiC Power Modules" ,The Power Conversion and Intelligent Motion (PCIM Europe), Nuremberg, Germany, May 2019

• Jihwan Seong, Sang Won Yoon, Jangmuk Lim, Min Ki Kim, Jaejin Jeon, Semin Park, Hyunkyu Choi, Yucheol Park, Pilkyoung Oh, Sang Min Kim and Taesuk Kwon, "Integrated motor-inverter power module for electric compressor (e-Compressor) in 48V mild hybrid vehicle", IEEE Energy Conversion Congress and Exposition (ECCE), Portland, OR, USA, Sep. 2018

• Jihwan Seong, Sang Won Yoon, Min Ki Kim, Jangmuk Lim, Hobeom Han, S. Park, H. Choi, Y. Park, P. Oh, S. Kim, T. Kwon, "Novel approach of integrated motor-inverter power module for 48V Mild Hybrid Starter and Generator (MHSG)", The Power Conversion and Intelligent Motion (PCIM Europe), Nuremberg, Germany, Jun. 2018 (Oral presentation) 

• Min Ki Kim and Sang Won Yoon, "Miniaturized Design of a Piezoelectric Thermal Sensor Optimized for the Integration to Wide Bandgap Power Modules Operating at High Temperatures", The Applied Power Electronics Conference and Exposition (APEC), Tampa, FL, USA, March 2017

• Sang Won Yoon, Jaewook Lee, "Approach to Design Electromagnetic Energy Harvester integrated with Back-iron Materials", 12th World Congress on Computational Mechanics (WCCM XII) and 6th Asia-Pacific Congress on Computational Mechanics (APCOM VI), Seoul, Korea, July 2016 (Oral presentation) 

• Hobeom Han and Sang Won Yoon, "Novel Multiple-Functional IMU-Based Wearable Air Mouse for the Simultaneous Operation with (Air) Keyboards", IEEE Sensors conference, Busan, Korea, November 2015 (Oral presentation) 

• Min Ki Kim and Sang Won Yoon, "Novel Built-in Sensor for In-situ Monitoring of Temperature and Thermal Stress in Power Modules", IEEE Energy Conversion Congress and Exposition (ECCE), Montreal, Canada, September 2015 (Oral presentation) 

• Min Ki Kim and Sang Won Yoon, "Analysis of power module reliability exposed to real operation conditions observed in electrified vehicles", International Electric Vehicle Symposium and Exhibition (EVS28), May 2015

• Sang Won Yoon K. Shiozaki, T. Kato, "Double-Sided Nickel-Tin Transient Liquid Phase Bonding for Double-Sided Cooling", The Applied Power Electronics Conference and Exposition (APEC 2014), Fort Worth, TX, March 2014 (Oral presentation) 

• T. Nomura, C-.M. Wang, K. Seto, Sang Won Yoon, “Planar Inductor with Quasi-Distributed Gap Core and Busbar Based Planr Windings”, IEEE Energy Conversion Congress and Exposition (ECCE), Denver, CO, September, 2013

• T. Nomura, Sang Won Yoon, J. Lee, E.M. Dede, “Level set based Topology Optimization of Directly Bonded Copper Substrates targeting Thermal Stress Minimization on Die-Substrate Bonding Line”, World Congress on Structural and Multidisciplinary Optimization (WCSMO), Orlando, FL, May, 2013 (Oral presentation)

• J. Lee and Sang Won Yoon, “Topology Optimization of Magnetic Vibration Energy Harvesters”, World Congress on Structural and Multidisciplinary Optimization (WCSMO), Orlando, FL, May, 2013 (Oral presentation)

• Sang Won Yoon, “Advanced Packaging Technology for High Temperature Operational Electrified Vehicles”, iMAPS Advanced Technology Workshop on Automotive Microelectronics and Packaging, Dearborn, MI, May, 2012 (Invited Talk)

• Sang Won Yoon, M. Glover, H. A. Mantooth, K. Shiozaki, "Highly Reliable Double-sided Bonding used in Double-sided Cooling for High Temperature Power Electronics”, iMPAS High Temperature Electronics (HiTEC 2012), Albuquerque, NM, May, 2012 (Oral presentation)

• Sang Won Yoon, S. Yasuda, M. Glover, K. Shiozaki, “Highly Reliable Nickel-Tin Transient Liquid Phase Bonding Technology for High Temperature Operational Power Electronics in Electrified Vehicles”, The Applied Power Electronics Conference and Exposition (APEC 2012), Orlando, FL, Feb. 2012 (Oral presentation)

• Sang Won Yoon, S. Yasuda, K. Shiozaki, “Ni/Sn Transient Liquid Phase Bonding Technology for High Temperature Operational Vehicle Application”, Electronics Packaging Symposium, Binghamton, NY, USA, Oct. 2011 (Invited Talk)

• Sang Won Yoon, S. Lee, N. C. Perkins, K. Najafi, "Novel Shock Protection Technologies for MEMS using Nonlinear Springs", Korean MEMS Conference, Jeju island, Korea, pp. 135-6, April, 2008 (Oral presentation)

• Sang Won Yoon, S. Lee, N. C. Perkins, K. Najafi, "Vibration Sensitivity of MEMS Tuning Fork Gyroscopes", IEEE Sensors Conference, Atlanta, USA, pp. 115-9, Oct. 2007 (Oral presentation)

• Sang Won Yoon, S. Lee, N C. Perkins, and K. Najafi, "Shock Protection Using Soft Coatings As Shock Stops". A Solid State Sensors, Actuators and Microsystems Workshop (Hilton Head), Hilton Head, USA, pp. 396-9, June 2006 

• Sang Won Yoon, N. Yazdi, J. Chae, N. C. Perkins, and K. Najafi, "Shock Protection using Integrated Nonlinear Spring Shock Stops", IEEE International Conference on Micro Electro Mechanical Systems (MEMS), pp. 702-5Istanbul, Trurkey, Jan. 2006  

• Sang Won Yoon, N. Yazdi, N. C. Perkins, and K. Najafi, "Novel Integrated Shock Protection for MEMS", IEEE International Conference on Actuators and Microsystems Solid-State Sensors (Transducers), Seoul, Korea, pp. 396-400, June 2005 (Oral presentation)

• S.-H. Lee, J. Chae, Sangwon Yoon, N. Yazdi, and K. Najafi, "Low-power Thermal Isolation for Environmentally Resistant Microinstruments", IEEE International Conference on Micro Electro Mechanical Systems (MEMS), Miami, USA, pp. 532-5, Jan. 2005

• K. King, Sang Won Yoon, N. C. Perkins, and K. Najafi, "The Dynamics of the Golf Swing as Measured by Strapdown Inertial Sensors", International Conference on the Engineering of Sport, UC Davis, USA, pp. 276–282, Sept. 2004 (Oral presentation)