Research Objectives
Research Objectives
Embedded Files
Semiconductor Packaging (반도체 패키징)
Semiconductor Packaging (반도체 패키징)
Packaging for power semiconductors (Power module)
Packaging for AI processors and memories (Heterogeneous integration)
Mobility Electronics
Mobility Electronics
(모빌리티 전자부품)
(모빌리티 전자부품)
Sensor modeling and Virtual-domain simulation
Signal processing, Sensor fusion, and Machine/Deep learning for Sensors
Component-level reliability for mobility
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