Semiconductor package Module EE Technology (SMEET)

Sustainable Mobility EE Technology (SMEET)

Introduction of SMEET Lab.

서울대 반도체공동연구소 반도체 패키징 센터 소식

Application to study @ SMEET Lab.

We are looking for students who are interested in and passionate about semiconductor packaging.
We welcome students from a variety of backgrounds, including (but not limited to):

- Electrical engineering (전자공학,전기공학,IT 등)

- Mechanical engineering (기계공학,자동차공학, 조선해양공학 등)

- Material and Chemical Engineering (재료공학, 화학공학 등)

How to apply to study @ SMEET Lab.

News

2025. 08 One paper is accepted to IEEE Transactions on Components, Packaging and Manufacturing Technology

2025. 08 One paper is accepted to Journal of Materials Research and Technology

2025. 05 One Korea Patent Application is filed

2025. 04 Two Korea Patent Applications are filed

2025. 01 One paper is accepted to IEEE Transactions on Components, Packaging and Manufacturing Technology

2024. 12 Three papers are published at Journal of Semiconductor Technology and Science

2024. 12 One paper is accepted to IEEE Transactions on Components, Packaging and Manufacturing

2024. 08 SMEET Lab starts one new project with Hyundai Motor Company, Samsung Electronics, and Semipowerex.

2024. 06 SMEET Lab starts one new project with Samsung Electronics. (Power semiconductor)

2024. 05 Prof. Yoon will begin to serve as an associate editor for IEEE Open Journal of Power Electronics.

2024. 05 One paper is accepted to IEEE Sensors Journal

2024. 04-05 SMEET Lab starts two new projects with Samsung Electronics. (NAND cluster, Wafer-level packaging)

2024. 05 One paper is published at IEEE Transactions on Industrial Electronics.

2024. 04 One paper is published at IEEE Journal of Emerging and Selected Topics in Power Electronics.

2023. 09 SMEET lab @ Seoul National University.