Past

• High-Density Low-Power Nonvolatile 3D Vertical Charge-Trap Synapse Array and Architecture Developments for On-Chip Learning  

Ministry of Science and ICT, 2023 - 2025

(플래시 메모리 기반 SNN H/W Flatform 설계, 온칩 학습 등)

• Emerging Non-Volatile Memories and their Applications  

Samsung Electronics, 2020 - 2025

(TCAM/STT-MRAM/ReRAM core, Peri circuit 설계 등)

• Development of Evaluation Technology in 3D IC (2016~2020)

• 10/2016-09/2020, Standards in 3D IC (MKE)

- 3D IC test standards

- 3D IC fabrication standard (alignment of back-to-face stacked dies)

• Standards in Healthcare Sensor (2016~2019)

• Serial Interface (2012~2014)

• Resistive Random Access Memory (2010~2016)

• Touch Screen Driver IC (2010~2012)

• Energy Harvesting for Solar Cell (2009~2012)

• Embedded EEPROM for passive RFID tag (2007~2010)