1. Dixit, P., Miao, J., “A Method of Electro-Depositing a Conductive Material in at-least One Through-Hole Via a Semiconductor Substrate”, US Patent 7,850,836 (2010). 

1. Ramver Singh and Pradeep Dixit, "Electrochemical micromachining: Fundamentals and advancements", Comprehensive Materials Processing, 2nd edition, Elsevier Publication  (2024)

2. Dileep Kumar Mishra, Julfekar Arab, and Pradeep Dixit, Chapter 13 : Electrochemical Discharge Machining, pp. 343-384, Advanced Machining Science, 1st edition, CRC Press (2022).

3. Pradeep Dixit, Harindra Kumar Kannojia, Kimmo Hentinen, "Through-substrate vias based three-dimensional interconnection technology", Chapter 34, "Handbook of Silicon Based MEMS Materials and Technologies", 3rd Edition, Elsevier Publication (2020). 

4. Dixit, P., Hentinen K., “Via-Technologies for MEMS”, Handbook of Silicon Based MEMS Materials and Technologies, Elsevier Publications (2015).

Journal Publications (Please click on the weblink to download the paper):

1. Karan Pawar, Pradeep Dixit, "Synergistic Enhancement of Electroless Film Adhesion on Glass via Graphene-Oxide Functionalization and Surface Roughening", Materials Letters, Vol. XX, pp.  (2025). (Accepted for publication)

2. Anurag Shanu, Pradeep Dixit, "Investigation of Debris Removal Mechanism in Ultrasonic-assisted Electrochemical Discharge Machining", Journal of the Electrochemical Society,  Vol. 172 (6), pp. 063505 (2025) DOI 10.1149/1945-7111/ade293

3. Ronaldo Naodeo Singh, Pradeep Dixit, "Geometrical Shape Analysis of Through-hole Formation in Tungsten by Electrochemical Jet Drilling" , Materials and Manufacturing Processes, Vol. 40 (11), pp. 1473-1486 (2025) DOI:  https://doi.org/10.1080/10426914.2025.2522126

4. Ramver Singh, Pradeep Dixit, Akshay Dvivedi, "Achieving high machining speed and sustainability in micro-EDM using a two-phase three component dielectric", Journal of the Manufacturing Processes, Vol. 139, pp. 50-66 (2025), https://doi.org/10.1016/j.jmapro.2025.02.027

5. Anurag Shanu, Ramver Singh, Pradeep Dixit, "Synergistic roles of steady dwell tool feeding and ultrasonic vibrations in electrochemical discharge machining of alumina", Materials and Manufacturing Processes, Vol. 40(1), pp. (2025) . https://doi.org/10.1080/10426914.2024.2406775

6. Harsh Pandey, Karan Pawar, Pradeep Dixit, "Fabrication of through alumina vias (TAV) by ultrasonic micromachining for advanced packaging applications", Materials Science in Semiconductor Processing, Vol. 185, pp. 108923 (2024), DOI: https://doi.org/10.1016/j.mssp.2024.108923

7. Pravin Kumar, N. K. Jain, Pradeep Dixit, "Modelling of powder catchment efficiency in micro‑plasma transferred arc metal additive manufacturing process", Progress in Additive Manufacturing, (2024), DOI: https://doi.org/10.1007/s40964-024-00742-6.

8. Harsh Pandey, Karan Pawar, Pradeep Dixit, "Localized surface roughening to improve adhesion of electroless seed layer in Through-glass Vias", Materials Science in Semiconductor Processing, Vol. 183, pp. 108757 (2024), DOI: https://doi.org/10.1016/j.mssp.2024.108757

9. Karan Pawar, Harsh Pandey, Pradeep Dixit, "Continuous Electroless Seed Layer Deposition in Through-Glass-Vias by Ultrasonic Agitation", IEEE Transactions on Components, Packaging and Manufacturing Technology, DOI: 10.1109/TCPMT.2024.3419836

10. Harsh Pandey, Abhinav Apurva, Pradeep Dixit, "Investigations into velocity decay, initial tool-workpiece gap, and material removal behaviour in ultrasonic micromachining", Journal of Manufacturing Processes, Vol. 124,  Pages: 52-67 (2024)  DOI: https://doi.org/10.1016/j.jmapro.2024.05.080 

11. Karan Pawar, Pradeep Dixit, "Facilitating electroless metalization of blind holes in glass substrates by electrochemical discharge-assisted surface roughening", Materials Letters, Vol. 358, pp. 135853 (2024). https://doi.org/10.1016/j.matlet.2023.135853

12. Anurag Shanu, Priyaranjan Sharma, Pradeep Dixit, "Micromachining of alumina ceramic for microsystems applications: a systematic review, challenges and future opportunities", Materials and Manufacturing Processes, Vol. 39(7), pp. 892-924 (2024) . https://doi.org/10.1080/10426914.2023.2290244 

13. Pravin Kumar, Bhavesh Chaudhary, N. K. Jain , Mahesh Patel, Pradeep Dixit, "Investigation on tribo-characteristics of electrochemical jet machined part manufactured by Laser powder bed fusion", Tribology International, Vol. 188 (2023).

14. Julfekar Arab, Pradeep Dixit, "Gas bubbles entrapment mechanism in the Electrochemical Discharge Machining involving multi-tip array electrodes", Journal of Manufacturing Processes, Vol. 99, pp. 38-52 (2023). https://doi.org/10.1016/j.jmapro.2023.05.038

15. Pravin Kumar, Pradeep Dixit, Bhavesh Chaudhary, N. K. Jain, "Surface finishing of an additively manufactured part using electrochemical jet machining", Materials Today Communications, Vol. 35, pp. 105581 (2023) DOI :https://doi.org/10.1016/j.mtcomm.2023.105581 

16. Dileep Kumar Mishra, Pradeep Dixit, "Fabrication of 3D microstructures in glass by direct writing Electrochemical Discharge Machining", Materials and Manufacturing Processes, Vol. 38(8), pp. 999-1008 (2023) . https://doi.org/10.1080/10426914.2022.2146718 

17. Karan Pawar, Pradeep Dixit, "A critical review of copper electroless deposition on glass substrates for microsystems packaging applications", Surface Engineering, Vol.  38, pp. 576-617 (2022). https://doi.org/10.1080/02670844.2022.2142002

18. Harsh Pandey, Tarlochan Singh, Pradeep Dixit, "Formation of high aspect ratio through-glass vias by the combination of Ultrasonic micromachining and copper electroplating", Journal of Manufacturing Processes, Vol. 82,  Pages: 569-584 (2022)  DOI: https://doi.org/10.1016/j.jmapro.2022.08.030 

19. Karan Pawar, Harsha S, Pradeep Dixit, "Investigation of Cu-Sn-Cu Transient Liquid Phase bonding for microsystems packaging", Materials and Manufacturing Processes, Vol. 37 (2022) (Accepted for Publication) 

20. Awatef Khlifi, Aftab Ahmed, Brahim Mezghani, Rajul Patkar, Pradeep Dixit, Fares Tounsi, Maryam Shojaei Baghini, "Theoretical and numerical investigation of a new 3-axis SU-8 MEMS piezoresistive accelerometer", Microelectronics Journal, Vol. 128, pp. 105552 (2022) (https://doi.org/10.1016/j.mejo.2022.105552)

21. Julfekar Arab, Pradeep Dixit, "Formation of macro-sized through-holes in glass using notch-shaped tubular electrodes in electrochemical discharge machining", Journal of Manufacturing Processes, Vol. 78, pp. 92-106 (2022). https://doi.org/10.1016/j.jmapro.2022.03.052

22. Vishnukant Bajpai, Harsh Pandey, Tarlochan Singh, Pradeep Dixit, "Ultrasonic-assisted surface roughening of glass substrate to improve adhesion of electroless nickel seed layer in microsystems packaging ", Materials Letters, Vol.  316, pp. 132033 (2022) 

23. Tarlochan Singh, Julfekar Arab, Pradeep Dixit, "A review on microhole formation in glass-based substrates by Electrochemical discharge drilling for MEMS applications", Machining Science and Technology, Vol.  26, pp. 276-337 (2022), DOI: 10.1080/10910344.2022.2044857

24. Vishnukant Bajpai, Dileep Kumar Mishra, Pradeep Dixit, "Fabrication of Through-glass Vias (TGV) based 3D microstructures  in Glass Substrate by a lithography-free process for MEMS applications", Applied Surface Science, Vol. 582, pp. 152494 (2022) DOI:https://doi.org/10.1016/j.apsusc.2022.152494

25. Tarlochan Singh, Dileep Kumar Mishra, Pradeep Dixit, "Effect of pulse frequency and duty cycle on electrochemical dissolution behavior of multi-tip array tool electrode for reusability in the ECDM process", Journal of Applied Electrochemistry, Vol. 52, pp. 667–682 (2022) DOI:https://doi.org/10.1007/s10800-021-01662-x

26. Priyaranjan Sharma, Pradeep Dixit, "Investigation of Tool wear in alumina micromachining by multi-tip ECDM", Materials and Manufacturing Processes, Vol. 37, pp. 342–348 (2022) DOI: https://doi.org/10.1080/10426914.2021.2006218 

27. Dileep Kumar Mishra, Tarlochan Singh, Pradeep Dixit, "Cathode shape prediction for uniform electrochemical dissolution of array tools for ECDM applications", Materials and Manufacturing Processes, Vol. 37, Issue: 12, pp. 1463–1473  (2022) DOI: https://doi.org/10.1080/10426914.2021.2001520

28. Harindra Kumar Kannojia, Aboobackkar Sidhique, Ambika Shanker Shukla, Jaisingh Pednekar, Shalabh Gupta, Pradeep Dixit, "Design and Fabrication of Through-Glass Vias (TGV) based 3D Spiral Inductors in Fused Silica Substrate", Microsystem Technologies Vol. 28, pp. 955–964 (2022) DOI: https://doi.org/10.1007/s00542-021-05244-x

29. Dileep Kumar Mishra, Pradeep Dixit, "Experimental investigation into tool wear behaviour of line-array tool electrode during the electrochemical discharge micromilling process", Journal of Manufacturing Processes, Vol.  72 (12), pp.  93-104 (2021)

30. Priyaranjan Sharma, Julfekar Arab, Pradeep Dixit, "Through-holes micromachining of alumina using a combined pulse-feed approach in ECDM", Materials and Manufacturing Processes, Vol. 36, Pages 1501-1512 (2021)

31. Tarlochan Singh, Akshay Dvivedi, Anurag Shanu, Pradeep Dixit, "Experimental Investigations of Energy Channelization Behavior in Ultrasonic Assisted Electrochemical Discharge Machining", Journal of Materials Processing Technology, Vol. 293, pp. 117083 (2021)

32. Harindra Kumar Kannojia, and Pradeep Dixit, "A comprehensive review of intermetallic compound growth and void formation in electrodeposited Cu-Sn Layers for microsystems packaging",  Journal of Materials Science: Materials in Electronics, 32,  (2021). 

33. Julfekar Arab, Karan Pawar, Pradeep Dixit, "Effect of tool-electrode material in through-hole formation using ECDM process ", Materials and Manufacturing Processes, Vol. 36, 1019-1027 (2021). https://doi.org/10.1080/10426914.2021

34. Julfekar Arab, Dileep Kumar Mishra, Pradeep Dixit, "Measurement and analysis of the geometric characteristics of microholes and tool wear for varying tool-workpiece gaps in electrochemical discharge drilling ", Measurement, Vol. 168, pp. 108463  (2021) 

35. Julfekar Arab, Pradeep Dixit, "Influence of tool electrode feed rate in the electrochemical discharge drilling of a glass substrate", Materials and Manufacturing Processes, Vol. 35, 1749-1760 (2020) 

36. Priyaranjan Sharma, Dileep Kumar Mishra, Pradeep Dixit, "Experimental investigations into alumina ceramic micromachining by electrochemical discharge machining process", Procedia Manufacturing, 48, Pages 244-250 (2020). 

37. Awatef Khlifi, Aftab Ahmed, Shardul Pandit, Brahim Mezghani, Rajul Patkar, Pradeep Dixit, Maryam Shojaei Baghini, "Experimental and Theoretical Dynamic Investigation of MEMS Polymer Mass-Spring Systems", IEEE Sensors, Vol. 20, Issue 14 (2020). 

38. Aftab Ahmed, Awatef Khlifi, Shardul Pandit, Rajul Patkar, Anjali Joshi, Pradeep Dixit, Brahim Mezghani, Maryam Shojaei Baghini, "Design, fabrication, and characterization of SU-8/carbon black nanocomposite based polymer MEMS acceleration sensor", Microsystem Technologies (2020). 

39. Dileep Kumar Mishra, Karan Pawar, Pradeep Dixit, "Effect of tool electrode-workpiece gap in the microchannel formation by electrochemical discharge machining", ECS Journal of Solid State Science and Technology, Vol. 9(3):034011 (2020). 

40. Aman Kumar Verma, Dileep Kumar Mishra, Karan Pawar, Pradeep Dixit, "Investigations into Surface topography of glass microfeatures formed by pulsed Electrochemical discharge milling for microsystem applications", Microsystems Technology, Vol. 26, pp. 2105-2116 (2020). 

41. Julfekar Arab, Dileep Kumar Mishra, Pradeep Dixit, "Role of tool-substrate gap in the micro-holes formation by electrochemical discharge machining", Procedia Manufacturing, 48, Pages 492-497 (2020).  

42.   DK Mishra, J Arab, P Dixit, "Array Microchannels Formation in Glass Workpiece using Multi-Pass Electrochemical Discharge Milling Technique", Manufacturing Technology Today 19 (10), 44-48 (2020).          

43. Subrat Patro, Dileep Kumar Mishra, Julfekar Arab, Pradeep Dixit, "Numerical and experimental analysis of high aspect ratio micro-tool electrodes fabrication using controlled electrochemical machining", Journal of Applied Electrochemistry, 50, 169-184 (2020). 

44. Julfekar Arab, Dileep Kumar Mishra. Harindra Kumar Kannojia, Pratik Adhale, and Pradeep Dixit, “Fabrication of multiple through-hole array in non-conductive materials by Electrochemical Discharge Machining for RF MEMS Packaging”, Journal of Materials Processing Technology, 271, 542 (2019).                                         

45. Harindra Kumar Kannojia, Julfekar Arab, Bhaskar Jyoti Pegu, and Pradeep Dixit,” Fabrication and Characterization of Through-Glass Vias by the ECDM Process”. Journal of Electrochemical Society, 166, D531 (2019).  

46. Julfekar Arab, Harindra Kumar kannojia, and Pradeep Dixit, “Effect of tool electrode roughness on the geometric characteristics of through-holes formed by ECDM.”, Precision Engineering, 60, 437 (2019). 

47. Julfekar Arab, Dileep Kumar Mishra, Pratik Adhale, Pradeep Dixit," Micro array hole formation in glass using electro-chemical discharge machining", Procedia Manufacturing, 34, 349 (2019).               

48. Julfekar Arab, Harshit singh Chauhan, Chetan Agrawal, Pradeep Dixit, “Electrochemical discharge machining of soda lime glass for MEMS application”, International Journal of Precision Technology,8 (2-4), 220 (2019)

49. Dileep Kumar Mishra, Aman Kumar Verma, Julfekar Arab, Deepak Marla, and Pradeep Dixit. "Numerical and experimental investigations into microchannel formation in glass substrate using electrochemical discharge machining." Journal of Micromechanics and Microengineering 29(7) (2019): 075004.                     

50. Dileep Kumar Mishra, Julfekar Arab, Yashwant Magar, and Pradeep Dixit. "High Aspect Ratio Glass Micromachining by Multi-Pass Electrochemical Discharge Based Micromilling Technique." ECS Journal of Solid State Science and Technology 8(6) (2019): P322-P331. 

51. Harindra Kumar Kannojia, and Pradeep Dixit, “Experimental investigations in the intermetallic and microvoid formation in sub‑200 °C Cu–Sn bonding”, Journal of Materials Science: Materials in Electronics, 30, 19 (2019).  

52. Kamran Khan, Alwin Varghese, Pradeep Dixit, and Suhas S. Joshi. "Effect of Tool Path Complexity on Top Burrs in Micromilling." Procedia Manufacturing 34 (2019): 432-439.

53. Harindra Kumar Kannojia, and Pradeep Dixit, "Effect of surface roughness on void formation and intermetallic growth in electrodeposited Cu-Sn stacks" Materials letters, 257, (2019).    

54. Harindra Kumar Kannojia, Surender kumar Sharma, and Pradeep Dixit, “Void Formation and Intermetallic Growth in Pulse Electrodeposited Cu-Sn Layers for MEMS Packaging”, Journal of Electronic Materials, 47, 7386 (2018).  

55. Lin, N., Miao, J., Dixit, P., "Void formation over limiting current density and impurity analysis of TSV fabricated by constant-current pulse-reverse modulation", Microelectronics Reliability 53 (12), pp. 1943-1953 (2013).

56. Dixit, P., Vähänen, S., Salonen, J., Monnoyer, P., "Effect of process gases on fabricating tapered through-silicon vias by continuous SF6/O2/Ar plasma etching", ECS Journal of Solid State Science and Technology 1 (3), pp. P107-P116 (2012).

57. Dixit, P., Vehmas, T., Vähänen, S., Monnoyer, P., Henttinen, K., "Fabrication and electrical characterization of high aspect ratio poly-silicon filled through-silicon vias", Journal of Micromechanics and Microengineering 22 (5), 055021 (2012).

58. Dixit, P., Salonen, J., Pohjonen, H., Monnoyer, P., "The application of dry photoresists in fabricating cost-effective tapered through-silicon vias and redistribution lines in a single step", Journal of Micromechanics and Microengineering 21 (2), 025020 (2011).

59. Lin, N., Miao, J., Dixit, P., "Mechanical and microstructural characterization of through-silicon via fabricated with constant current pulse-reverse modulation", Journal of the Electrochemical Society 157 (6), pp. D323-D327 (2010).

60. Lin, N., Wang, H., Dixit, P., Zhang, S., Miao, J., "Investigation of carbon nanotube growth on multimetal layers for advanced interconnect applications in microelectronic devices", Journal of the Electrochemical Society 156 (3), pp. K23-K27 (2009).

61. S Arora, CS Lim, JY Foo, MK Sakharkar, P Dixit, AQ Liu, JM Miao, "Microchip system for monitoring microbial physiological behaviour under drug influences", Proceedings of the Institution of Mechanical Engineers, Part H: Journal of Engineering in Medicine, 223(6) 777-786 (2009)

62. Xu, L., Xu, D., Tu, K.N., Dixit, P., Pang, J.H.L., Miao, J., "Structure and migration of (112) step on (111) twin boundaries in nanocrystalline copper", Journal of Applied Physics 104 (11), 113717 (2008).

63. Dixit, P., Yaofeng, S., Miao, J., Chatterjee, R., Tummala, R.R., "Numerical and experimental investigation of thermomechanical deformation in high-aspect-ratio electroplated through-silicon vias", Journal of the Electrochemical Society 155 (12), pp. H981-H986 (2008).

64. Dixit, P., Chen, X., Miao, J., Preisser, R., "Effect of improved wettability of silicon-based materials with electrolyte for void free copper deposition in high aspect ratio through-vias", Thin Solid Films 516 (16), pp. 5194-5200 (2008).

65. Dixit, P., Lin, N., Miao, J., Wong, W.K., Choon, T.K., "Silicon nanopillars based 3D stacked microchannel heat sinks concept for enhanced heat dissipation applications in MEMS packaging", Sensors and Actuators A: Physical 141 (2), pp. 685-694 (2008).

66. Dixit, P., Miao, J., "High aspect ratio vertical through-vias for 3D MEMS packaging applications by optimized three-step deep RIE", Journal of the Electrochemical Society 155 (2), pp. H85-H91 (2008).

67. Dixit, P., Chen, X., Miao, J., Divakaran, S., Preisser, R., "Study of surface treatment processes for improvement in the wettability of silicon-based materials used in high aspect ratio through-via copper electroplating"., Applied Surface Science 253 (21), pp. 8637-8646 (2007).

68. Dixit, P., Tan, C.W., Xu, L., Miao J., Backus, P., Preisser, R., "Fabrication and characterization of fine pitch on-chip copper interconnects for advanced wafer level packaging by a high aspect ratio through AZ9260 resist electroplating" Journal of Micromechanics and Microengineering 17 (5), 030, pp. 1078-1086 (2007).

69. Xu, L., Dixit, P., Miao, J., Tu, K.N., Preisser, R., "Through-wafer electroplated copper interconnect with ultrafine grains and high density of nanotwins", Applied Physics Letters 90 (3), 033111 (2007).

70. Dixit, P., Xu, L., Miao J., Pang JHL., Preisser, R., "Mechanical and microstructural characterization of high aspect ratio through-wafer electroplated copper interconnects" Journal of Micromechanics and Microengineering 17 (9), pp. 1749-1756 (2007).

71. Dixit, P., Miao, J., Preisser, R., "Fabrication of high aspect ratio 35 μm pitch through-wafer copper interconnects by electroplating for 3-D wafer stacking", Electrochemical and Solid-State Letters 9 (10), pp. G305-G308 (2006).

72. Dixit, P., Miao, J., "Effect of clamping ring materials and chuck temperature on the formation of silicon nanograss in deep RIE", Journal of the Electrochemical Society 153 (8), 066608JES, pp. G771-G777 (2006).

73. Dixit, P., Miao, J., "Aspect-ratio-dependent copper electrodeposition technique for very high aspect-ratio through-hole plating", Journal of the Electrochemical Society 153 (6), pp. G552-G559 (2006). (This paper is chosen for the Norman Hackerman award 2006 for being one of the two best papers published in the year of 2006 in Journal of the Electrochemical Society)

74. Dixit, P., Miao, J., "Effect of SF6 flow rate on the etched surface profile and bottom grass formation in deep reactive ion etching process", Journal of Physics: Conference Series 34 (1), pp. 577-582 (2006).

Conference Publications:

1. Harsh Pandey, Karan Pawar, Pradeep Dixit,  Adhesion improvement of the electroless film deposited on glass by the Ultrasonic micromachining process, 5th World Congress on Micro and Nano Manufacturing (WCMNM) 2022, Leuven, Belgium.

2. Awatef Khlifi, Aftab Ahmed, Shardul Pandit, Brahim Mezghani, Rajul Patkar, Pradeep Dixit, Maryam Shojaei Baghini, Frequency Analysis and Resonance Evaluation of Polymer 1-axis Piezoresistive Microaccelerometers, 17th IEEE International Multi-Conference on Systems, Signals & Devices (SSD) 2020 

3. Julfekar Arab, Dileep Kumar Mishra, Pradeep Dixit, "Role of tool-substrate gap in the micro-holes formation by electrochemical discharge machining." 48th SME North American Manufacturing Research Conference, NAMRC 48, Ohio, USA, June 22-24, (2020) .

4. Priyaranjan Sharma, Dileep Kumar Mishra, Pradeep Dixit, "Experimental investigations into alumina ceramic micromachining by electrochemical discharge machining process." 48th SME North American Manufacturing Research Conference, NAMRC 48, Ohio, USA, June 22-24, (2020) (Accepted).

5. Harindra Kumar Kannojia, Dileep Kumar Mishra, Julfekar Arab, Ritesh Kumar, Jaisingh Pednekar, "Fabrication and Characterization of Through-glass vias (TGV) based 3D Spiral and Toroidal Inductors by Cost-effective ECDM Process ",  70th Electronics Components and Technology Conference, Lake Buena Vista, Florida, USA, 26 - 29 May 2020 (Accepted).

6. Harindra Kumar Kannojia, and Pradeep Dixit, “Void formation and in low-temperature Cu-Sn stack for hermetic packaging”,  21st Electronics Packaging Technology Conference, EPTC 2019, Marina bay sands, Singapore, 4 - 6 December (2019).

7. Harindra Kumar Kannojia, Ritesh Kumar, Jaisingh Pednekar, and Pradeep Dixit, “Formation of through-wafer 3D interconnects in fused silica substrates by electr-chemical discharge machining”, 21st Electronics Packaging Technology Conference, EPTC 2019, Marina bay sands, Singapore, 4 - 6 December (2019).

8. Dileep Kumar Mishra, Julfekar Arab, Karan Pawar, and Pradeep Dixit, "Fabrication of Deep Microfeatures in Glass Substrate using Electrochemical Discharge Machining for Biomedical and Microfluidic Applications," 21st Electronics Packaging Technology Conference, EPTC 2019, Marina bay sands, Singapore, 4 - 6 December (2019).

9. Aftab Ahmed; Shardul Pandit; Rajul Patkar; Pradeep Dixit; Maryam Shojaei Baghini; Awatef Khlifi; Fares Tounsi; Brahim Mezghani, "Induced-Stress Analysis of SU-8 Polymer Based Single Mass 3-Axis Piezoresistive MEMS Accelerometer", 16th IEEE International Multi-Conference on Systems, Signals & Devices (SSD) , Turkey, (2019) pp. 131-136.

10. Julfekar Arab, Dileep Kumar Mishra, Pratik Adhale, Pradeep Dixit," Micro array hole formation in glass using electro-chemical discharge machining", 47th NAMRC Conference, Pennsylvania, USA, (2019).

11. K Khan, A Varghese, P Dixit, SS Joshi, "Effect of Tool Path Complexity on Top Burrs in Micromilling", 47th NAMRC Conference, Pennsylvania, USA, (2019).

12. Awatef Khlifi; Brahim Mezghani; Fares Tounsi; Aftab Ahmed; Shardul Pandit; Rajul Patkar; Pradeep Dixit; Maryam Shojaei Baghini; , "Dynamic Behaviour and Piezoresistive Analysis of a Single Mass 3-Axis Polymer MEMS Accelerometer", 2019 IEEE International Conference on Design & Test of Integrated Micro & Nano-Systems (DTS), April , Tunisia (2018).

13. Julfekar Arab, Pratik Adhale, Harindra Kannojia, Pradeep Dixit,", Invited presentation, Glass Micromachining using Electrochemical Discharge for RF MEMS Packaging", Proceedings of 8th IEEE-INEC, Malaysia, January 2018.

14. M. Hadj Said, F. Tounsi, B. Mezghani, A. Ahmed, S. Pandit, R. Patkar, P. Dixit, M.S. Baghini, V.R. Rao, "Induced Stress Enhancement Using U-shaped Arms in a 3-axis Piezoresistive MEMS Accelerometer", 2018 15th IEEE International Multi-Conference on Systems, Signals & Devices (SSD) Pages 1481-1486 (2018)

15. Dileep Kumar Mishra, Aman Kumar Verma, Deepak Marla, Pradeep Dixit. “A finite volume based transient model of electrochemical discharge machining for glass micromachining”. Proceedings of the 7th International and 45th National Conference on Fluid Mechanics and Fluid Power (FMFP), IIT Bombay, India, 10th  - 12th  December 2018.

16. Aman Kumar Verma, Dileep Kumar Mishra, Julfekar Arab, Deepak Marla, and Pradeep Dixit, “Study on high speed milling of micro channels for micro-fluidic applications using electro chemical discharge machining,” Proceedings of the 7th International and 45th National Conference on Fluid Mechanics and Fluid Power (FMFP), IIT Bombay, India, 10th  - 12th  December 2018.

17. Julfekar Arab, Harshit singh Chauhan, Chetan Agrawal, Pradeep Dixit, "Experimental Investigation of Electrochemical Discharge Machining of non-conducting materials for MEMS Applications", Proceedings of 10th COPEN 2017(IIT Madras), pp.361-366.

18. Julfekar Arab, Harshit Chauhan, Pratik Adhale, Pradeep Dixit,"Fabrication of Microelectrode and its application to electrochemical discharge drilling(ECDD) of Soda lime glass", Proceedings of AMPT 2017(VIT University) 

19. Julfekar Arab, Harshit singh Chauhan, Chetan Agrawal, Pradeep Dixit, "Electrochemical Discharge Machining of Soda Lime glass using Micro-Turned tool and Needle tool", Proceedings of ICMTS-2017, (IIT Madras) pp.130-134

20. Chetan Agrawal, Harshit singh Chauhan, Julfekar Arab, Pradeep Dixit,"Multi-spark numerical simulation model for die sinking electrochemical discharge machining", Proceedings of ICMTS, IIT Madras, 2017,pp.157-161.

21. D Ruffieux, N Scolari, TC Le, PA Beuchat, A Jaakkola, T Pensala, J Dekker, P Dixit, CA Manier, K Zoschke, H Oppermann, "A compact, versatile, miniature timing microsystem using two co-integrated wafer-level packaged silicon resonators", IEEE European Frequency and Time Forum (EFTF), 435-438 (2014)

22. Dixit, P., Viljanen, H., Salonen, J., Molarius, J., Monnoyer, P. "Fabrication, electrical characterization and reliability study of partially electroplated tapered copper through-silicon vias", Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT 6706634, pp. 190-193 (2013).

23. Dixit, P., Vahanen, S., Salonen, J., Monnoyer, P., "Role of process gases in making tapered through-silicon vias for 3D MEMS packaging", Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT 6420230, pp. 35-38, (2012).

24. Liu, X., Chen, Q., Dixit, P., Tummala, R.R., Sitaraman, S.K., "Failure mechanisms and optimum design for electroplated copper Through-Silicon Vias (TSV)",  Proceedings of the 59th Electronic Components and Technology Conference 5074078, pp. 624-629, (2009).

25. S Arora, CS Lim, M Kakran, JYA Fool, MK Sakharkar, P Dixit, J Miao, "Investigating Combinatorial Drug Effects on Adhesion and Suspension Cell Types Using a Microfluidic-Based Sensor System", 13th International Conference on Biomedical Engineering, 817-820 (2009).

26. N Lin, P Dixit, J Sun, K Ma, J Miao, J Ma, "through-silicon-via (TSV) shunt-grounded conductor backed ring resonator", International Conference on Communications, Circuits and Systems, 784-787 (2009)

27. Xu, L., Dixit, P., Pang, J.H.L., Miao J., Tu, K.-N., Preisser, R., "Characterization of nano-grained high aspect ratio through-wafer copper interconnect column",  Proceedings of the 57th Electronic Components and Technology Conference, 4250164, pp. 2011-2016, (2007).

28. Dixit, P., Lin, N., Miao, J., Wong, W.K., Teo, K.C., "Concept and analytical analysis of silicon micro/nanopillars based 3-D stacked microchannel heat sink for advanced heat dissipation applications",  Proceedings of the 57th Electronic Components and Technology Conference 4250026, pp. 1149-1154, (2007).

29. Dixit, P., Miao, J., "Fabrication of high aspect ratio 35 μm pitch interconnects for next generation 3-D wafer level packaging by through-wafer copper electroplating",  Proceedings of the 56th IEEE Electronic Components and Technology Conference, 1645675, pp. 388-393, (2006).

30. Dixit, P., Xu, L., Miao, J., Backus, P., Preisser, R., "Mechanical and microstructure characterization of high aspect ratio electroplated through-wafer copper interconnects", Proceedings of the 8th IEEE Electronic Packaging Technology Conference, EPTC 4147215, pp. 29-34, (2006).

31. Dixit, P. Miao, J., "Application of Electroplating in the Fabrication of Copper Nano-interconnects for next generation Micro/Nanosystems Packaging", IEEE Conference on Emerging Technologies - Nanoelectronics, 10-13 Jan. 2006  : 51-55 (2006).

32. Dixit, P. Miao, J., "Application of Cu Electroplating in Through-wafer Interconnects for MEMS Packaging", Proceeding of Symposium F Nano-optics & Microsystems ICMAT 2005, pp. 103-106 (2005).

33. Banait N., Dixit P., Joshi S., Ramakrishnan N., "Analysis of Roundness Error in Micro-electrochemical Machining (Micro-ECM) Process", Proceedings of the International Conference On CAD/CAM, Robotics and Automation Industries (INCARF 03), New Delhi, India pp. 1-10 (2003).

34. Dixit P., Ramakrishnan N., and Joshi S.S., "Electrochemical Micro-machining: A Review", Proceedings of the 20th AIMTDR Conference on IT Based Manufacturing, BIT Ranchi, India pp. 230-235 (2002).