Ph.D . Admission (AY 2024-25): 

The ECMF group is looking to hire a PhD student in one of the SERB-funded research projects. 

Title: Through-alumina Vias (TAV) based 2.5 D electronic packaging technology for harsh environments

Education background: ME/MTech (Mechanical / Electronics Engg). Hands-on experience in Micromachining (USM, ECM, EDM) and silicon microfabrication will be useful. 

The applicant should have all the eligibility criteria for admission to the PhD program at IIT Bombay. 

Please contact Prof. Pradeep Dixit (Email: pradeep.dixit@iitb.ac.in) to learn more about the project scope, objectives, and deliverables. 

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Our group is always looking for motivated students who are interested in pursuing research in the micromachining area, which can be applied in the interconnection and packaging of MEMS-based sensors. The group research focuses on developing micromachining in difficult-to-machine hard materials such as SiC, Alumina, fused silica, quartz, SiC, Sodalime glass for applications in MEMS, Electronic packaging, and microfluidics-related applications. 

If you have a passion for research and are qualified for/in the DST-INSPIRE fellowship, GATE with a good score or NET exam, please send your resume to Prof Pradeep Dixit at pradeep.dixit@iitb.ac.in. 

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Notice: 

1.  Postdoctoral researcher : 

** Semiconductor Packaging / Advanced Interconnects **

We have an opening for a Post-doctoral researcher in the Electroless plating/Semiconductor Packaging / Advanced Interconnects area.  

Those who have earned their PhD degrees in Microelectronics/Mechanical with a focus on Semiconductor packaging/ Adbvanced Interconnects / Numerical simulations in micromachining are strongly encouraged to send their resume and 3 journal publications.  

The upper age for general category applicants is 32 years (relaxed for category applicants as per the government rules), and should have 3 publications in peer-reviewed journals.

2.  Graduate research students (Priority):  

For the upcoming Ph.D. admissions (July 2024), our group is looking forward to having 2 researchers who will be working in the following areas. 

1. Development of 3D Interconnects for semiconductor packaging 

2. Development of Copper-sintering for high power/EV electronics 

The applicant should have B.Tech. (with valid gate score)/ MTech. degree in Mechanical Engineering.  

A prior experience in MEMS / non-conventional machining/ methods (ECM/EDM/USM etc) and basic knowledge of finite element analysis will be helpful.  

If you like to know more about this project and work in this domain. Please feel free to contact me immediately.  

Applicants are also encouraged to go through prior publications here from our group  . 

3. Final year MTech projects:

Those students who are interested in carrying out their final year project in IIT Bombay, please first contact your respective professors in own institutes. Upon mutual agreement, the students can use the research facility at IIT Bombay and stay upto 1 year. 

More details of official procedure can be found here:

  http://www.iitb.ac.in/academichome/ProcedurefordoingProject201705June.pdf 

4. Summer Internship:

Open positions for summer internship is always open.  The preferred time duration is 4-6 months. Please not that no accommodation  will be provided to the summer interns/. If you are interested in the summer internship at IITB, please follow this link https://www.ircc.iitb.ac.in/fellowship/ 

Details of PhD and M-Tech admission criteria at IIT Bombay: 

http://www.iitb.ac.in/newacadhome/toadmission.jsp