1) Title : Void formation and IMC growth in electrodeposited Cu-Sn layers

Funding Agency : Industrial Research & Consultancy Centre (IRCC), IIT Bombay Seed Grant

Status : Completed

2) Title : Low-cost Manufacturing Technique for Fabricating Through-Substrate Vias based 3D Micro-structures used in MEMS Applications (Co-Inv: Prof SS Joshi)

Funding Agency : Ministry of Human Resource Development (MHRD) and Department of Scientific and Industrial Research (DSIR)

Status : Completed

3) Title : Development of hermetic encapsulation techniques for wafer level packaging of MEMS sensors

Funding Agency : Department of Science and Technology (DST)

Status : Completed