Market research future published a raw research report on Global Electrostatic Discharge Packaging Market that contains the information from 2017 to 2023. The Electrostatic Discharge Packaging is expected to grow with the CAGR of approximately 8.2% from 2017 to 2023.

Taste the market data and market information presented through more than 85 market data tables and figures spread in 118 numbers of pages of the project report. Avail the in-depth table of content TOC & market synopsis on “Global Electrostatic Discharge Packaging Market Information from 2017 to 2023"

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The emergence of electrostatic discharge packaging has helped the original equipment manufacturers to operate with much more flexibility in terms of dispersed production facilities. ESD is characterized by better resistance to accumulation of static, shielding against electric field and insulation from transfer of electronic charge. The emerging trend of the development of smart cities across the globe is expected to augment the growth of electrostatic discharge packaging market.

The report has analyzed the market based on the three segments, namely product, end-users and region. On the basis of product, the market is segmented as bags, trays, boxes & containers, ESD foams and others. In which, boxes & containers segment is expected to dominate the market due to better security and transportation of the product.

Based on end-users, the market is bifurcated as communication network infrastructure, consumer electronics, computer peripherals, automotive industry and others. Among these, communication network infrastructure is expected to dominate the market during the forecast period. During 2016, the communication network infrastructure dominated the ESD packaging market and accounted for a major part of the overall market share. This growth of the segment can be attributed to the development of communication network infrastructure industry, especially in developing countries, such as India and Brazil. Also, the high deployment of wireless networks such as Wi-Fi and 3G or 4G will further boost the growth of the market segment.

The consumer electronics mainly includes smartphones, PCs, audio & video systems. All such systems are equipped with sophisticated and high-performance printed circuit boards and semiconductors for efficient working. The increased penetration of such devices combined with the rapid adoption of 3G and 4G networks, is driving the growth of electrostatic discharge packaging market.

The end-user segment is also anticipated to be majorly driven by the increasing demand for electronic gadgets such as tablets, notebooks etc. Also, the launch of lightweight ultrabooks is expected to boost the growth of the market segment.

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We recognize the key players in the global electrostatic discharge packaging market as Teknis Limited (U.K.), Tandem Equipment Sales, Inc. (U.S.), Summit Packaging Solutions (U.S.), Stephen Gould Corp. (U.S.), Statico (U.S.), Elcom UK Ltd (U.K.), Protektive Pak (U.S.), GWP Group Limited (U.K.) and Desco Industries Inc. (U.S.).

This research report has provides the insights, on various levels of analyses such industry analysis, market share analysis leading market players and their profiles. This report also helps in studying the target segments by providing views on emerging & high-growth segments and market conclusion. Together the market data comprise and discuss with the basic assessments on the competitive scenarios & strategies, of the global electrostatic discharge packaging market, including the high-growth regions, countries and their political, economic and technological environments. Furthermore the project report also provides the views over the historical market values as well as, pricing and cost analysis of the same.

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