Etch Process
- Development of TSV (Through Silicon Via) process based on hybrid type plasma source (PEALD & RIE)
Pulsed Plasma sources
- Pulsed CCP(Capacitively Coupled Plasma), Pulsed ICP(Inductively Coupled Plasma) sources
High Yield, Low damage plasma sputtering process
- DC, RF magnetron sputtering process based on target surface modification
Microwave Plasma Source
- Nitride thin film deposition process based on MWP
- Surface Wave Plasma sources
- Novel microwave plasma source based on metamaterial structure
- Slot antenna design
- Low damage PEALD/PEALE sources based on MWP
- Long Linear microwave plasma sources
Plasma simulation
- Plasma fluid simulation (include heat transfer, fluid flow model, etc)
- Plasma surface interaction
- Plasma bulk chemistry