Events

International Symposium on 3D IC and Heterogeneous Integration

Date: Apr 26, 2022

Venue: The Hong Kong University of Science and Technology (HKUST)

Date: December 11, 2018

Venue: The University of Hong Kong

Date: July 08, 2018

Venue: The Hong Kong Polytechnic University

Date: April 02, 2018

Venue: Tsinghua University, Beijing

Date: July 28, 2017

Venue: The Chinese University of Hong Kong

Date: August 29, 2015

Venue: Hong Kong Polytechnic University

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