CEDA is proud to co-organize International Symposium on 3D IC and Heterogeneous Integration.

The registration link https://3dichi.hkust.edu.hk/

12 world-renowned speakers will deliver lectures covering the following topics:

Session A: System Architecture & Design in the Era of 3D IC

Session B: 3D IC & M3D

Session C: System-in-Package & Heterogeneous Integration