PUBLICATIONS

Journals

31. 정진용, 서윤범, 김성진, 김봉중, "유리 인터포저 기반 2.5D NPU-HBM 이종 집적 패키지의 warpage 특성 분석", 대한기계학회 논문집 B 권, Accepted

30. 이동현, 정철우, 최준, 김봉중, "열화상-RGB 카메라 융합 기반 실시간 객체 인식 시스템", 대한기계학회 논문집 A 권, Accepted

29. [Invited] M. Lee*, S. Jeong*, B. Kim*, "Metasurfaces for Biomedical Applications: Materials Design, Optical Engineering, and System Integration", Biomedical Engineering Letters, Accepted

28. M. S. Jeon*, J. Yi*, S. Hong*, J. Lee*, H. Jang, B. Kim, H. Lee, C. H. Lee*, D. R. Kim*, "All-dry self-adhesive soft electrodes with subsurface pores for long-term skin recording", Small, 21 (49), e07416 (2025) [Link]

27. S. Park, H. Lee, J. Yoo, H. Song, S. Kim, S. Lim, M. Park, B. Kim, K. Heo, P. D. Ye*, H. Bae*, "Enhanced electrical performances with HZO/β-Ga2O3 3D FinFET toward highly perceptual synaptic device application", Materials Science in Semiconductor Processing, 201, 110104 (2026)  [Link]

26. J. Y. Jung*, Y. Seo, S. J. Kim, B. Kim*, "Effect of Chip Array Configuration on Warpage Behavior in Glass Substrate-Based Multi-Chip Packages with Molded Underfill Process", Journal of the Microelectronics and Packaging Society, 32 (2), 72-82 (2025) [Link]

25. M. Park*, J. Yoo, H. Lee, H. Song, S. Kim, S. Lim, S. Park, J. H. Jeong, B. Kim, K. Lee, Y. K. Lee, K. Heo, J. Kwon*, H. Bae*, "Rapid Thermal Annealing under O2 Ambient to Recover the Deterioration by Gamma-Ray Irradiation in a-IGZO TFTs", Electronic Materials Letters, 21 (1), 111–118 (2025) [Link]

24. 정진용, 한주성, 이한철, 박영석, 임태경, 김봉중, "다중 주파수 진동 에너지 집속을 위한 H형 공진기 메타물질", 대한기계학회 논문집 A 권, 48(12), 815-822. [Link] 

23. D. Jang, S. Kang, J. Kim, H. Kim, S. Lee, B. Kim*, "Development and Characterization of a Flexible Soundproofing Metapanel for Noise Reduction", Applied Sciences, 14 (19), 8833 (2024) [Link]

22. J. Hwang*, Y. Zhang*, B. Kim*, J. Jeong, J. Yi, D. R. Kim, Y. L. Kim, A. Urbas, G. Ariyawansa, B. Xu*, Z. Ku*, C. H. Lee*, "Wafer-scale replication of plasmonic nanostructures via microbubbles for nanophotonics", Advanced Science, 11 (40), 2404870 (2024) [Link] 

21. S. Kim*, J. Yoo, H. Song, H. Lee, S. Lim, M. Park, S. Park, C. Kim, T. Kim, B. Kim*, H. Bae* "Characterization of Bulk Trap Density Using Fully I-V-Based Optoelectronic Differential Ideality Factor in Multi-Layer MoS2 FET", Journal of Physics D: Applied Physics, 57 (48), 1-7 (2024) [Link]

20. W.H. Kim*, B. Kim, H. Chi*, J.S. Hyun*, "Novel approach for fast structured light framework using deep learning", Image and Vision Computing, 150 (105204), 1-15 (2024) [Link]

19. J. Lee*, J, Oh*, H. Chi*, M. Lee, J. Hwang, S. Jeong, S.W. Kang, H. Jee, H. Bae, J.S Hyun, J. Kim*, and B. Kim*, "Deep Learning-Assisted Design of Bilayer Nanowire Gratings for High-Performance MWIR Polarizers", Advanced Materials Technologies, 9 (19), 2302176  (2024) [Link]

18. M. Lee*, Z Ku*, S. Jeong, J. Hwang, J. Lee, J. Kim, S.W. Kang, A. Urbas, H. Bae*, B. Kim*, "Simulational investigation of self-aligned bilayer linear grating enabling highly enhanced responsivity of MWIR InAs/GaSb type-II superlattice (T2SL) photodetector", Scientific Reports, 14 (2050), 1-11 (2024) [Link] 

17. L. Park, E. Kim, Y. Jeon, J. Lee, J. Yi, J. Jeong, B. Kim, D. Kim*, H. Kong*, C. H. Lee*, “Transparent Intracellular Sensing Platform with Si Needles for Simultaneous Live Imaging, ACS nano, 17 (24), 25014–25026 (2023) [Link] 

16. J. Zhang*, K. Kim*, H. J. Kim*, D. M. Schneider, W. Park, S. Lee, Y. Dai, B. Kim, H. Moon, J. V. Shah, K. Harris, B. Collar, K. Liu, P. Irazoqui, H. Lee, S. Park*, P. Kollbaum*, B. Boudouris*, C. H. Lee*, Smart soft contact lenses for continuous 24-hour monitoring of intraocular pressure in glaucoma care, Nature Communications, 13 (1), 1-15 (2022) [Link] 

15. Y. Hwang*, M. Kim*, Z. Ze, B. Kim, T. Chang, T. Fan, M. Ibrahim, J. Song, S. Suresh, C. H. Lee*, N. Cho*, Plant-based substrate materials for flexible green electronics,  Advanced Materials Technologies, 202200446 (2022) [Link] 

14. W. Park*, V. P. Nguyen*, Y. Jeon*, B. Kim, Y. Li, J. Yi, H. Kim, D. R. Kim*, Y. M. Paulus*, C. H. Lee*, Biodegradable silicon nanoneedles for ocular drug delivery, Science Advances, 8 (13), eabn1772 (2022) [Link] 

13. T. Chang*, S. Akin*, M. Kim, L. Murray, B. Kim, S. Cho, S. Hur, S. Teke, L. Couetil*, M. B. Jun*, C. H. Lee*, Programmable Dual Regime Spray for Large‐Scale and Custom‐Designed Electronic Textiles, Advanced Materials, 34 (9), 2108021 (2022) [Link] 

12. B. Kim*, A. H. Soepriatna*, W. Park, H. Moon, A. Cox, J. Zhao, N. S. Gupta, C. H. Park, K. Kim, Y. Jeon, H. Jang, D. R. Kim, H. Lee, K.-S. Lee*, C. J. Goergen*, C. H. Lee*, Rapid Custom Prototyping of Soft Poroelastic Biosensor for Simultaneous Epicardial Recording and Imaging, Nature Communications, 12 (1), 1-14 (2021) [Link] 

11. B. Kim*, J. Hwang*, J. Yi, D. Kim, A. Urbas, Z. Ku*, C. H. Lee*, Replicable Quasi-Three-Dimensional Nanoantennas for Infrared Bandpass Filtering, ACS Applied Materials & Interfaces, 13 (20), 24024–24031 (2021) [Link] 

10. K. Kim*, H. Kim*, H. Zhang*, W. Park, D. Meyer, M. Kim, B. Kim, H. Park, B. Xu*, P. Kollbaum*, B. Boudouris*, C. H. Lee*, All-printed corneal electrodes on soft contact lenses for noninvasive recording of human electroretinogram, Nature Communications, 12 (1), 1-11 (2021) [Link] 

9. H. Kim*, H. S. Lee*, Y. Jeon, W. Park, Y. Zhang, B. Kim, H. Jang, B. Xu, Y. Yeo*, D. R. Kim*, and C. H. Lee*, Bioresorbable, Miniaturized Porous Silicon Needles on Flexible Water-Soluble Backing for Unobtrusive, Sustained Delivery of Chemotherapy, ACS nano, 14 (6), 7227-7236 (2020) [Link] 

8. K. Kim*, B. Kim*, C. H. Lee*,  Printing Flexible and Hybrid Electronics for Human Body-Interfaced Monitoring Systems in Biomedical Applications, Advanced Materials,  32(15) 1902051 (2020) [Link] 

7. Y. Zhang*, B. Kim*, Y. Gao, D. Wie, C. H. Lee*, B. Xu*, Chemomechanics of Transfer Printing of Thin Films in a Liquid Environment, International journal of solids and structures, 180, 30-44 (2019) [Link] 

6. M. Kim*, C. Kantarcigil*, B. Kim, R. K. Baruah, S. Maity, Y. Park, K. Kim, S. Lee, J. B. Malandraki, S. Avlani, A. Smith, S. Sen, M. A. Alam, G. Malandraki*, C. H. Lee*, Flexible submental sensor patch with remote monitoring controls for management of oropharyngeal swallowing disorders, Science Advances, 5 (12), eaay3210 (2019) [Link] 

5. M. Kim*, R. Parasuraman*, L. Wang*, Y. Park, B. Kim, S. Lee, N. Lu*, B. Min*, C. H. Lee*, Soft-packaged sensory glove system for human-like natural interaction and control of prosthetic hands, NPG Asia Materials, 11 (1), 1-12 (2019) [Link] 

4. B. Kim*, J. Jeon*, Y. Zhang*, D. Wie, J. Hwang, S. J. Lee, D. E. Walker Jr., D. C. Abeysinghe, A. Urbas, B. Xu*, Z. Ku*, C. H. Lee*,  Defect-free assembly of three dimensional plasmonic nanoarrays with arbitrary substrate materials and structures, Nano Letters, 19 (8), 5796-5805 (2019) [Link] 

3. H. Kim*, M. Kim*, H. Jang*, B. Kim, D. Kim*, C. H. Lee*, Sensor-instrumented scaffold integrated with microporous sponge-like ultra-buoy for long-term 3D mapping of cellular behaviors and functions, ACS nano, 3 (7), 7898-7904 (2019) [Link] 

2. H. Kim*, H. Jang*, B. Kim*, M. Kim, D. Wie, H. Kim, D. Kim*, C. H. Lee*, Flexible elastomer patch with vertical silicon nanoneedles for intracellular and intratissue nanoinjection of biomolecules, Science Advances, 4 (11), eaau6972 (2018) [Link] 

1. D. Wie*, Y. Zhang*, M. Kim, B. Kim, S. Park, Y. Kim, P. Irazoqui, X. Zheng, B. Xu*, C. H. Lee*, Wafer-recyclable, environment-friendly transfer printing for large-scale thin film nanoelectronics, Proceedings of the National Academy of Sciences of the United States of America, 115 (31), E7236-E7244 (2018) [Link] 

Patents

C. H. Lee, B. Kim, J. Hwang, Z. Ku, A. Urbas, US Provisional Patent, Being Filed (69425).

C. H. Lee, B. Kim, C. Goergen, K. Lee, US Provisional Patent, 63/186,942 (69211).

C. H. Lee, B. Kim, Z. Ku, A. Urbas, US Utility Patent, 62/854,421 (68568).

C. H. Lee, B. Kim, Z. Ku, A. Urbas, Nanoassembly methods for producing quasi-three-dimensional nanoarrays, US Patent, US20210229987A1 (2021)

Book Chapter

B. Kim, J. Hwang, L. Park, and C. H. Lee, “Micro/nano-transfer printing techniques for optical applications”, Chapter 9 in a book entitled “Transfer Printing Technologies and Applications”, Elsevier, ISBN: 978-0-443-18845-9 (2024)