FACILITY

Cleanroom

Flip Chip Bonder & Die Attacher

Vacuum Laminator

Vacuum Molding

Laser Direct Imaging System

Thinky Vacuum Mixer

Dispensor

Reflow Oven System

Ion Sputter Coater

UV system

Horizontal Grinding Machine

Lapping Machine

Stellar 4000 Bondtester

Ultrasonic  Cleaner

Mini-SEM

Digital Scope

Micro Scope

Digital Image Correlation ARAMIS 

Moldex3D IC Packaging

Abaqus

CST Studio Suite

Comsol Multiphysics

ANSYS