FACILITY

Cleanroom

Flip Chip Bonder & Die Attacher

Vacuum Laminator

Vacuum MUF

Plasma

Reflow Oven System

Ion Sputter Coater

UV system

Horizontal Grinding Machine

Lapping Machine

Stellar 4000 Bondtester

Ultrasonic  Cleaner

Mini-SEM

Digital Scope

Micro Scope

Digital Image Correlation ARAMIS 

Moldex3D IC Packaging

Abaqus

CST Studio Suite

Comsol Multiphysics