A Comparative Analysis of Methods for Moisture Removal from Printed Circuit

The aim of the project is to investigate and compare the efficacy of different moisture removal techniques in Printed Circuit Boards (PCBs) to mitigate moisture-induced failures. Moisture within PCBs can cause significant issues like delamination, cracking, and electrical failures, compromising the reliability and functionality of electronic devices. The experiment examines traditional baking methods, against innovative air-drying techniques using super polymer desiccants. The experimental setup categorizes PCB materials into two groups based on their pretreatment conditions, employing a quadrant graph approach to visualize the impact of varying environmental conditions on moisture removal effectiveness. Through a comprehensive experiment and analysis, the results illustrate that the air-drying methods using super polymers are more effective than baking methods in both different pretreatment conditions. Our research underscores the critical role of effective moisture removal techniques in enhancing PCB reliability and contributes to advancing PCB manufacturing and maintenance protocols. The results are useful for printed circuit boards related industries which they facilitate to choose the most effective and less damaging method for their products.