Past Student Design Competitions

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ASME K-16 has hosted student design competitions leveraging additive manufacturing since 2018! Check out the details below.

Quick Access to Past Event Info

ITherm 2025 Competition

ITherm 2024 Competition

ITherm 2023 Competition

ITherm 2022 Competition

ITherm 2021 Competition

ITherm 2020 Competition

ITherm 2019 Competition

InterPACK 2018 Competition

ITherm 2025 Competition

As part of this design challenge, students were asked to design, build, and validate a copper cold plate made with Additive Manufacturing techniques graciously made available to us by Fabric8Labs. After reviewing the guidelines [PowerPoint Slides], students prepared white papers that justified their design. The top white papers and designs were be selected to be printed. Those cold plates will then be sent for testing at Intel in order to determine the top designs with finalist. These top teams presented at ITherm 2025 (in Dallas, TX from May 27 – 30, 2025) where they defended their design in front of industry leaders. From those oral presentations, the champion [Team MSAM-MDAM] was crowned!

Competition Website: https://www.ieee-itherm.net/cold-plate-competition-2025/

Finalists:

MSAM MDAM [First Place]

Joseph Nonso Orakwe (University of Waterloo) and Alex Inoma (University of Alberta)

Advisors: Osezua Obehi Ibhadode and Ehsan Toyserkani

White Paper

Chilly Platter [Second Place]

Yue Heng Tan, University of Bristol
Adam Blackwood, University of Sheffield
Nimrit Kanwal, University of Nottingham
Derin Catstaban, University of Birmingham
Isaac Waters, Loughborough University

White Paper

Aero Product [Finalist]

Congrui Ma, Junren Mao, Hongzhuo Zhu, and Jikun Qian

University of Nottingham – China]

White Paper

CUHK MAE [Finalist]

Xiaotong Wang and Zijun Gao

The Chinese University of Hong Kong

White Paper

Organizers:

Amy Marconnet (Purdue University) [LinkedIn]
Lang Yuan (Intel) [LinkedIn]
Tiwei Wei (Purdue University/UCLA) [LinkedIn]
Sameer Rao (University of Utah) [LinkedIn]
Han Hu (University of Arkansas) [LinkedIn]
Chirag Kharangate (Case Western Reserve University) [LinkedIn]

Sponsors:

Thanks to all the sponsors for the student desing competition!

Testing Sponsor

Competition Sponsor

Print Sponsor

Testing Sponsor

Competition Sponsor

ITherm 2024 Competition

ITherm 2023 Competition

ITherm 2022 Competition

ITherm 2021 Competition

https://www.mech.utah.edu/u-me-team-wins-student-design-challenge/

ITherm 2020 Competition

ITherm 2019 Competition

InterPACK 2018 Competition

For this competition, students will design, analyze and optimize an additively manufactured heat sink to cool a constant heat flux power electronics module subject to forced convection.

Guidelines: PDF of Guidelines

Team Rankings:

First Place: War Eagle - Auburn (Karthekeyan Sridhar and Basil J. Paudel)
Second Place: X&R COOPERATION - Penn State (Xinyi Xiao and Byeong-Min Roh)
Third Place: Manifold Channel - Maryland (Xiang Zhang, Beihan Zhao, and Fabio Battaglia)
Fourth Place: Happy Valley - Penn State (David Saltzman)
Semi-Finalists:
- Imperial Hogs - University of Arkansas (Reece Whitt and Bakhtiyar Mohammad Nafis)
- MTL - University of Texas - Arlington (Darshan Babu Ravoori, Aditya Krishna Ganesh Ram, and Christian Lowery)
- PURDUE-SINK-ONA - Purdue University (David G. Cuadrado, Xinyuan Gu, Prachi Kale, Collier Miers, and Yexin Sun)
- Apis Helix - Oregon State University (Alec Norlund and Rachel McAfee)

Organizers:

Joshua Gess (Oregon State)
Amy Marconnet (Purdue University)
Ron Warzoha (US Naval Academy)
Ankur Jain (UT-Arlington)
Naveenan Thiagarajan (GE Global Research)
Rick Eiland (Dell)
Lauren Boteler (Army Research Lab)
Damena Agonafer (Washington University - St. Louis)
Travis Mayberry (Raytheon)

Sponsors:

GE
IEEE EPS

2018 Finalists at InterPACK

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