Congratulations to CHIMES student Alexander Graening who was a recipient of the TECHCON 2025 Top 10 Best Student Presenter Award!
Alexander attends the University of California, Los Angeles and is advised by Professor Puneet Gupta.
CHIMES PI Zhiting Tian (Cornell) was selected to receive the DARPA Director's Fellowship. Tian will receive an additional $500,000 to continue her ongoing DARPA research on Transient Nanoscale Temperature Mapping of Active RF Devices.
Students and PIs met with representatives from the SRC, DARPA, and industry liaisons for the center's third annual review August 26-27. With 140+ attendees, the event served to display the center's research and progress, with technical presentations, student lightning talks and poster sessions, as well as software and hardware demos.
Congratulations to Professor Krishnendu Chakrabarty (Arizona State) and Professor Shimeng Yu (Georgia Tech), on being selected to receive 2025 SRC Awards.
Chakrabarty was awarded the Innovation Award and Yu was the recipient of the Rama Divakaruni Technical Excellence Award.
Congratulations to Arizona State CHIMES students Dhruv Thapar and Partho Bhoumik, advised by Professor Krishnendu Chakrabarty, on being selected for the 2025 Qualcomm Innovation Fellowship for their research on test for fanout wafer-level packaging!
CHIMES PhD student Ramin Rahimzadeh Khorasani (Penn State), advised by Professor Madhavan Swaminathan, received the Best Presentation Award at APEC 2025!
Congratulations to CHIMES PI Dr. Steven George (University of Colorado Boulder) on being selected for the DPS Nishizawa Award by the 2024 International Symposium on Dry Process! The DPS Nishizawa Award is the highest honor awarded by the DPS for his “Outstanding contributions to the understanding of surface chemistry at the atomic level and the development of new applications for atomic layer processes.”
CHIMES Director Madhavan Swaminathan discusses the Center's progress over its first year.
CHIMES supported and participated in the 2nd Semiconductor Technologies and Photonics workshop held at Penn State University, June 2-3, 2025. This workshop brought together leaders from industry and academia.
Penn State engineers Madhavan Swaminathan and Daniel Lopez explain in a Q&A the importance of advanced chip packaging to the U.S. semiconductor industry and how Penn State-led initiatives help turn innovations in the lab into reliable domestic production.
When President Joe Biden signed the CHIPS (Creating Helpful Incentives to Produce Semiconductors) and Science Act on Aug. 9, 2022, to accelerate U.S. manufacturing of semiconductors, Penn State took action. The University created the Mid-Atlantic Semiconductor Hub (MASH) with other academic partners, industry and state governments to lead and leverage the cumulative expertise in this area.