Students

CHIMES Students

We are updating our student information. Please check back later for the complete CHIMES student directory.

Penn State

Mahin Ahamed

Research: mmWave Integration

Advisor: Madhavan Swaminathan

Mohammad Al-Juwhari

Research: mmWave Integration

Advisor: Madhavan Swaminathan

Ruposri Bhattacharjee

Research: Theme 3
Embedded Power Delivery & Cooling Strategies

Advisor: Madhavan Swaminathan

Ramin Rahimzadeh Khorasani

Research: Theme III: Ultra-dense Heterogeneous Interconnects & Assembly

Task ID: 3136.012 Embedded Power Delivery & Cooling Strategies

Advisor: Madhavan Swaminathan

Eriksson Long

Research: Design and simulate mmWave structures for liquid crystal design for use in high-speed 6g applications

Advisor: Madhavan Swaminathan

Md. Rayid Hasan Mojumder

Research: Theme 3
mmWave Integration

Advisor: Madhavan Swaminathan

Asish Nayak

Research: Theme 3
Embedded Power Delivery & Cooling Strategies

Advisor: Madhavan Swaminathan

Shruti Shukla

Advisor: Madhavan Swaminathan

Arizona State University

Dhruv Thapar

Research: Theme I: System Driven Functional Integration and Aggregation

Task ID: Electrical Test and Security for Integrated M3D and HI Systems

Advisor: Krishnendu Chakrabarty

Eduardo Ortega

Research: Theme I: System Driven Functional Integration and Aggregation

Task ID: 3136.005 Electrical Test & Security

Advisor: Krishnendu Chakrabarty

Partho Bhoumik

Research: Theme I: System Driven Functional Integration and Aggregation

Task ID: 3136.005 Electrical Test and Security for Integrated M3D and HI Systems

Advisor: Krishnendu Chakrabarty

University of California, Davis

Shun-Hung Lee

Research: Photonics

Advisor: S. J. Ben Yoo

University of California, Los Angeles

Alexander Graening

Research:
Theme I: System Driven Functional Integration and Aggregation

Task ID: 3136.001 System-driven Benchmarking and Pathfinding for Monolithic 3D and Heterogeneous Integration

Advisor: Puneet Gupta

George Karfakis

Research: Theme 1
Thermal and hardware co-design in the GPU and AI accelerator space to maximize performance for future generations of 2.5D and 3D stacked chiplets

Advisor: Puneet Gupta

Zhichao Chen

Research:
Theme I: System Driven Functional Integration and Aggregation

Task ID: 3136.001 System-driven Benchmarking and Pathfinding for Monolithic 3D and Heterogeneous Integration

Advisor: Puneet Gupta

Dedeepyo Ray

Research: Theme I: System Driven Functional Integration & Aggregation

Task ID: 3136.001 System-driven Benchmarking and Pathfinding for Monolithic 3D and Heterogeneous Integration

Advisor: Puneet Gupta

Lime Yao

Research:
Theme I: System Driven Functional Integration and Aggregation

Task ID: 3136.001 System-driven Benchmarking and Pathfinding for Monolithic 3D and Heterogeneous Integration

Advisor: Puneet Gupta

Jiu-Han Liu

Research: Theme III: Ultra-dense Heterogeneous Interconnects & Assembly

Task ID: 3136.017 Task title: Lithographically Defined Fine Pitch Inter-Strata Interconnects for 3D Heterogenous Stacking using Ultra-Thinning Process

Advisor: Subramanian S. Iyer

University of California, San Diego

Ping-Che Lee

Research: Advanced thin film deposition techniques, including high-power impulse magnetron sputtering (HiPIMS) and atomic layer deposition (ALD), with an emphasis on aluminum nitride (AIN) and boron nitride (BN) films for high-performance thermal management in semiconductor devices

Advisor: Andrew Kummel

Diego A. Contreras Mora

Research: Theme 4
A Low-Pressure HiPIMS+ Kick AlN Deposition with 60 nm/min Deposition Rate

Advisor: Andrew Kummel

University of Colorado, Boulder

M. Hamza Ansar

Research:
Thermal etching of oxide-based channel materials for thin film transistors (TFTs)

Advisor: Steven M. George

Olusola Akinbami

Research:
Monolithic 3D & Stacking

Advisor: Steven M. George

Columbia University

Shriddha Chaitanya

Research: Theme 3
Optical Modulators in Heterogeneously Integrated Photonic Platforms

Advisor: Michal Lipson

Vivian Zhou

Research: Theme 3
Optical Modulators in Heterogeneously Integrated Photonic Platforms

Advisor: Michal Lipson

Cornell University

Daniel Hur

Research: Theme 4
Metrology

Advisor: Zhiting Tian

Gangchen Ren

Research:

Advisor: Zhiting Tian

University of Florida

Russell Schwartz

Research: Theme 3
Silicon photonic circuit design & packaging

Advisor: Volker Sorger

Thomas Spelmans

Research: Theme 3
Photonics

Advisor: Volker Sorger

Georgia Tech

Mingeun Choi

Research: Theme 3
Embedded Power Delivery & Cooling Strategies

Advisor: Satish Kumar

Dokwan Kook

Research:
Process-structure-property relation construction using machine learning for thermal materials used in semiconductors

Advisor: Satish Kumar

Amaan Rahman

Research: Theme I: System Driven Functional Integration & Aggregation

Task ID: 3136.002 Design Automation for Monolithic 3D and Heterogeneous Interposer Integration

Advisor: Sung-Kyu Lim

Hang Yang

Research: Theme 1
Modeling and Design Methodology for Backside Integration of Voltage Converters

Advisor: Sung-Kyu Lim

Jungyoun Kwak

Research:

Advisor: Shimeng Yu

Myriam Bouzidi

Research: Thermal Materials & Management

Advisor: Suresh Sitaraman

Madison Manley

Research: Monolithic 3D & Stacking

Advisor: Muhannad Bakir

Omkar Phadke

Research: Device Characterization of Ferroelectric Memories and BEOL Compatible Transistors

Advisor: Shimeng Yu

Xingchen Li

Research: mmWave Integration

Advisor: Madhavan Swaminathan

Hao-Hsiang Hsiao

Research: Theme II: System Architecture, Pathfinding, EDA & Test

Task ID: 3136.002 Design Automation

Advisor: Sung-Kyu Lim

Min Gyu Park

Research: Theme II: System Architecture, Pathfinding, EDA & Test

Task ID: 3136.002 Design Automation

Advisor: Sung-Kyu Lim

Seungmin Woo

Research: Theme I: System Driven Functional Integration & Aggregation

Task ID: 3136.002 Design Automation for Monolithic 3D and Heterogeneous Interposer Integration

Advisor: Muhannad Bakir

Zheng Yang

Research: Theme II: System Architecture, Pathfinding, EDA & Test

Task ID: 3136.002 Design Automation

Advisor: Sung-Kyu Lim

Sunbin Deng (postdoctoral researcher)

Research: Theme II: Monolithic 3D (M3D) Densification and Diversification on Silicon Platform

Task ID: 3136.007 Amorphous Oxide Semiconductor for Integrated Power Delivery & Conversion

Advisor: Suman Datta

University of Illinois, Chicago

Salma Abdelzaher

Research: Theme I: System Driven Functional Integration and Aggregation

Task ID: 3136.03 Low Loss Vertical System-Level Power Delivery with Backside M3D and Integrated Voltage Regulators

Advisor: Inna Partin-Vaisband

Rami Alsaeed Rasheedi

Research: Theme I: System Driven Functional Integration and Aggregation

Task ID: 3136.03 Low Loss Vertical System-Level Power Delivery with Backside M3D and Integrated Voltage Regulators

Advisor: Inna Partin-Vaisband

Sriharini Krishnakumar

Research: Theme I: System Driven Functional Integration and Aggregation

Task ID: 3136.03 Low Loss Vertical System-Level Power Delivery with Backside M3D and Integrated Voltage Regulators

Advisor: Inna Partin-Vaisband

Ayoub Sadeghi

Research: Theme I: System Driven Functional Integration and Aggregation

Task ID: 3136.03 Low Loss Vertical System-Level Power Delivery with Backside M3D and Integrated Voltage Regulators

Advisor: Inna Partin-Vaisband

Massachusetts Institute of Technology

Yixuan Jiao

Research:
System-driven functional integration and aggregation as well as 2D TMD material heterogeneous integration

Advisor: Tomás Palacios

Pradyot Yadav

Research: mmWave Integration

Developments Towards W-Band GaN/Si CMOS 3DICs

Advisor: Tomás Palacios

Misong Ju

Research:
Understanding the evolution of metastable metal thin films heated above the dewetting temperature and leveraging knowledge on solid-state dewetting to develop new processes for fabricating micro- and nanostructures

Advisor: Carl V. Thomspon

Rice University

Shisong Luo

Research: Theme II: Monolithic 3D (M3D) Densification and Diversification on Silicon Platform

Task ID: 3136.006 Backside of Silicon with GaN Integration for Active Power Delivery Network

Advisor: Yuji Zhao

Cheng Chang

Research: Theme II: Monolithic 3D (M3D) Densification and Diversification on Silicon Platform

Task ID: 3136.006 Backside of Silicon with GaN Integration for Active Power Delivery Network

Advisor: Yuji Zhao

Mingfei Xu

Research: Theme II: Monolithic 3D (M3D) Densification and Diversification on Silicon Platform

Task ID: 3136.006 Backside of Silicon with GaN Integration for Active Power Delivery Network

Advisor: Yuji Zhao

Stanford University

Fabia Athena

Research: Back-end-of-line (BEOL) compatible memory

Advisor: H.-S. Philip Wong

Wei-Chen Chen

Research: In-memory computing hardware design with resistive random access memory (RRAM) on emerging workloads

Advisor: H. S. Philip Wong

Shuhan Liu

Research:

Advisor: H. S. Philip Wong

University of Washington

Scott Davidson

Research: Theme I: System Driven Functional Integration and Aggregation

Task ID: 3136.024 Architectures for M3D Neighborhoods (System-in-Package) and M3D Chip Metropoli (System-of-Packages)

Advisor: Michael Taylor

Huwan Peng

Research: Theme I: System Driven Functional Integration and Aggregation

Task ID: 3136.024 Architectures for M3D Neighborhoods (System-in-Package) and M3D Chip Metropoli (System-of-Packages)

Advisor: Michael Taylor

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