Mahin Ahamed

Research: Theme / Task: 3136.013: Ultra-Low Loss Vertical (3D) Tiers with Actives and Passives for (sub) THz Sensory I/O 

Advisor: Madhavan Swaminathan

Mohammad Al-Juwhari

Research: mmWave Integration

Advisor: Madhavan Swaminathan

Ruposri Bhattacharjee

Research: Theme 3
Embedded Power Delivery & Cooling Strategies 

Advisor: Madhavan Swaminathan

Ramin Rahimzadeh Khorasani

Research: Theme 3 Ultra-dense Heterogeneous Interconnects & Assembly​

Task Title: Embedded Power Delivery

Advisor: Madhavan Swaminathan
Email: rbr5373@psu.edu
Level: Grad Student
Date Available for Internship/Employment:
NA/December 2026

Eriksson Long

Research: Design and simulate mmWave structures for liquid crystal design for use in high-speed 6g applications

Advisor: Madhavan Swaminathan

Md. Rayid Hasan Mojumder

Research: Theme III: Ultra-dense Heterogeneous Interconnects & Assembly

Task ID: 3136.026 - 3D Photonic Waveguides in Glass Substrates

Advisors: Ning Li

Asish Nayak

Research: Theme 3
Embedded Power Delivery & Cooling Strategies 

Advisor: Madhavan Swaminathan

Shruti Shukla

Advisor: Madhavan Swaminathan

Aditya Bhattacharjee

Research: Theme 1 System Driven Functional Integration and Aggregation​

Task Title: Electrical Test and Security for Integrated M3D and HI Systems 

Advisor: Krishnendu Chakrabarty
Email: abhat139@asu.edu
Level: Grad Student
Date Available for Internship/Employment:
May 2027 / May 2029

Partho Bhoumik

Research: Theme 1 System Driven Functional Integration and Aggregation​

Task Title: Electrical Test and Security for Integrated M3D and HI Systems 

Advisor: Krishnendu Chakrabarty
Email: pbhoumik@asu.edu
Level: Grad Student
Date Available for Internship/Employment:
May 2027 / May 2027

Eduardo Ortega

Research: Theme 1: System Driven Functional Integration and Aggregation​

Task ID: 3136.005 Electrical Test & Security​

Advisor: Krishnendu Chakrabarty

Dhruv Thapar

Research: Theme 1 System Driven Functional Integration and Aggregation​

Task Title: Electrical Test and Security for Integrated M3D and HI Systems 

Advisor: Krishnendu Chakrabarty
Email: dhruv.thapar@asu.edu
Level: Grad Student
Date Available for Internship/Employment:
Nov 2026

Shun-Hung Lee

Research: Photonics

Advisor: S. J. Ben Yoo

Zhichao Chen

Research: Theme 1 System Driven Functional Integration and Aggregation

Task Title: System-driven Benchmarking and Pathfinding for Monolithic 3D and Heterogeneous Integration 

Advisor: Puneet Gupta
Email: zhichaochen@g.ucla.edu
Level: Grad Student
Date Available for Internship/Employment:
June 2027 / June 2028

Alexander Graening

Research:
Theme 1: System Driven Functional Integration and Aggregation​

Task ID: 3136.001 System-driven Benchmarking and Pathfinding for Monolithic 3D and Heterogeneous Integration​.

Advisor: Puneet Gupta

George Karfakis

Research: Theme 1
Thermal and hardware co-design in the GPU and AI accelerator space to maximize performance for future generations of 2.5D and 3D stacked chiplets

Advisor: Puneet Gupta

Jiu-Han Liu

Research: Theme 3 Ultra Dense Heterogeneous Interconnect and Assembly

Task Title: Lithographically Defined Fine Pitch Inter-Strata Interconnects for 3D Heterogenous Stacking using Hydrogen Exfoliation

Advisor: Subramanian S. Iyer
Email: jhliu10@g.ucla.edu 
Level: Grad Student
Date Available for Internship/Employment:
NA / June 2027

Dedeepyo Ray

Research: Theme 1: System Driven Functional Integration & Aggregation​

Task ID: 3136.001 System-driven Benchmarking and Pathfinding for Monolithic 3D and Heterogeneous Integration 

Advisor: Puneet Gupta

Ernest Wang

Research: Theme 1 System Driven Functional Integration and Aggregation

Task Title: System-driven Benchmarking and Pathfinding for Monolithic 3D and Heterogeneous Integration 

Advisor: Puneet Gupta
Email: ernew21@g.ucla.edu
Level: Grad Student
Date Available for Internship/Employment:
June 2027 / June 2030

Lime Yao

Research:
Theme 1: System Driven Functional Integration and Aggregation​

Task ID: 3136.001 System-driven Benchmarking and Pathfinding for Monolithic 3D and Heterogeneous Integration​

Advisor: Puneet Gupta

Ping-Che Lee

Research: Advanced thin film deposition techniques, including high-power impulse magnetron sputtering (HiPIMS) and atomic layer deposition (ALD), with an emphasis on aluminum nitride (AIN) and boron nitride (BN) films for high-performance thermal management in semiconductor devices

Advisor: Andrew Kummel

Boya Li

Research: Theme 4 Materials Behavior, Synthesis, Metrology, and Reliability

Task Title: Wafer and Chiplet Bonding with Selective ALD, Heat Spreader Infill, and Magnetic Alignment

Advisor: Andrew Kummel
Email: bol008@ucsd.edu  
Level: Postdoc
Date Available for Internship/Employment:
2027 (Full Time)

Diego A. Contreras Mora

Research: Theme 4
A Low-Pressure HiPIMS+ Kick AlN Deposition with 60 nm/min Deposition Rate 

Advisor: Andrew Kummel

Amy Ross

Research: Theme 4 Materials Behavior, Synthesis, Metrology, and Reliability

Task Title: Wafer and Chiplet Bonding with Selective ALD, Heat Spreader Infill, and Magnetic Alignment

Advisor: Andrew Kummel
Email: aeross@ucsd.edu  
Level: Grad Student
Date Available for Internship/Employment:
2029 (Full Time)

Xinyu (Isabelle) Wang

Research: Theme 4 Materials Behavior, Synthesis, Metrology, and Reliability

Task Title: Wafer and Chiplet Bonding with Selective ALD, Heat Spreader Infill, and Magnetic Alignment

Advisor: Andrew Kummel
Email: xiw066@ucsd.edu 
Level: Grad Student
Date Available for Internship/Employment:
May 2027 (Internship)

M. Hamza Ansar

Research:
Thermal etching of oxide-based channel materials for thin film transistors (TFTs) 

Advisor: Steven M. George

Olusola Akinbami

Research: Theme 4 Materials Behavior, Synthesis, Metrology, and Reliability

Task Title: Ultrathin Diffusion Barriers and Bottom-Up Metal Interconnects Using Electron-Enhanced Atomic Layer Deposition (EE-ALD) with Background Gas

Advisor: Steven M. George
Email: olusola.akinbami@colorado.edu
Level: Grad Student
Date Available for Internship/Employment: 2027

Zachary Sobell

Research: Theme 4 Materials Behavior, Synthesis, Metrology, and Reliability

Task Title: Ultrathin Diffusion Barriers and Bottom-Up Metal Interconnects Using Electron-Enhanced Atomic Layer Deposition (EE-ALD) with Background Gas

Advisor: Steven M. George
Email: olusola.akinbami@colorado.edu
Level: Postdoc
Date Available for Internship/Employment:
2027

Shriddha Chaitanya

Research: Theme 3
Optical Modulators in Heterogeneously Integrated Photonic Platforms

Advisor: Michal Lipson

Vivian Zhou

Research: Theme 3
Optical Modulators in Heterogeneously Integrated Photonic Platforms

Advisor: Michal Lipson

Russell Schwartz

Research: Theme 3
Silicon photonic circuit design & packaging 

Advisor: Volker Sorger

Thomas Spelmans

Research: Theme 3
Photonics

Advisor: Volker Sorger

Myriam Bouzidi

Research: Theme 1 System Driven Functional Integration and Aggregation

Task Title: Flexible, Multi-Functional Thermal Management and Electro-Thermal Modeling for Ultra-Compact High Power Density Systems

Advisor: Suresh Sitaramen
Email: mbouzidi3@gatech.edu
Level: Grad Student
Date Available for Internship/Employment:
Dec 2027

Pin-Jun Chen

Research: Theme 2 Monolithic 3D (M3D) Densification and Diversification on Silicon Platform

Task Title: BEOL High-Mobility FeFET for Reconfigurable Interconnect

Advisor: Shimeng Yu
Email: pinjun.chen@gatech.edu  
Level: Grad Student
Date Available for Internship/Employment:
May 2027 (Internship) / Jan 2029 (FT)

Lixue Cheng

Research: Theme 3 Ultra Dense Heterogeneous Interconnect and Assembly

Task Title: IC Parallelism and Volume Scaling

Advisor: Muhannad S. Bakir
Email: lcheng97@gatech.edu  
Level: Grad Student
Date Available for Internship/Employment:
May 2027 (Internship)

Mingeun Choi

Research: Theme 4 Materials Behavior, Synthesis, Metrology, and Reliability

Task Title: Machine Learning Enabled Predictive Behavior and Materials Design

Advisor: Satish Kumar
Email: mchoi327@gatech.edu  
Level: Grad Student
Date Available for Internship/Employment:
May 2027 / Dec 2027

Hung-Chun Chou

Research: Theme 2 Monolithic 3D (M3D) Densification and Diversification on Silicon Platform

Task Title: BEOL High-Mobility FeFET for Reconfigurable Interconnect

Advisor: Shimeng Yu
Email: albert.chou@gatech.edu
Level: Grad Student
Date Available for Internship/Employment:
May 2027 /Aug 2028

Sunbin Deng

Research: Theme 2: Monolithic 3D (M3D) Densification and Diversification on Silicon Platform​

Task ID: 3136.007 Amorphous Oxide Semiconductor for Integrated Power Delivery & Conversion​

Advisor: Suman Datta
Level: Postdoc

Nolan Gronowski

Research: Theme 1 System Driven Functional Integration and Aggregation

Task Title: Flexible, Multi-Functional Thermal Management and Electro-Thermal Modeling for Ultra-Compact High Power Density Systems

Advisor: Suresh Sitaramen
Email: ngronowski3@gatech.edu  
Level: Grad Student
Date Available for Internship/Employment:
Jun 2028/ Dec 2028

Hao-Hsiang Hsiao

Research: Theme II: System Architecture, Pathfinding, EDA & Test​​

Task ID: 3136.002 Design Automation​

Advisor: Sung-Kyu Lim

Jiawei Hu

Research: Theme 1 System Driven Functional Integration and Aggregation

Task Title: Design Automation for Monolithic 3D and Heterogeneous Interposer Integration

Advisor: Sungkyu Lim
Email: jiaweihu@gatech.edu
Level: Grad Student
Date Available for Internship/Employment:
May 2027 / May 2028

Yen-Hsiang Huang

Research: Theme 1 System Driven Functional Integration and Aggregation

Task Title: Design Automation for Monolithic 3D and Heterogeneous Interposer Integration

Advisor: Sungkyu Lim
Email: yhhuang@gatech.edu
Level: Grad Student
Date Available for Internship/Employment:
May 2027 / Dec 2027

Kad Dokwan Kook

Research: Theme 4 Materials Behavior, Synthesis, Metrology, and Reliability

Task Title: Machine Learning Enabled Predictive Behavior and Materials Design

Advisor: Satish Kumar
Email: dkook3@gatech.edu  
Level: Grad Student
Date Available for Internship/Employment:
May 2027 / Dec 2027

Songhyeon Kuk

Research: Theme 2 Monolithic 3D (M3D) Densification and Diversification on Silicon Platform

Task Title: 3D Self-Aligned Super High-Density SRAM

Advisor: Suman Datta
Email:  
Level: Postdoc
Date Available for Internship/Employment:
NA / Jan 2027

Jungyoun Kwak

Research:

Advisor: Shimeng Yu

Xingchen Li

Research: mmWave Integration

Advisor: Madhavan Swaminathan

Madison Manley

Research: Theme 3: Ultra-dense Heterogeneous Interconnect and Assembly, Task: 3136.011 IC Parallelism and Volume Scaling

Advisor: Muhannad Bakir

Omkar Phadke

Research: Device Characterization of Ferroelectric Memories and BEOL Compatible Transistors

Advisor: Shimeng Yu

Amaan Rahman

Research Theme 1: System Driven Functional Integration and Aggregation

Task Title: Design Automation for Monolithic 3D and Heterogeneous Interposer Integration

Advisor: Sungkyu Lim
Email: amaan.rahman@gatech.edu
Level: Grad Student
Date Available for Internship/Employment:
May 2027 / May 2028

Partha Pratim Roy

Research: Theme 4 Materials Behavior, Synthesis, Metrology, and Reliability

Task Title: Machine Learning Enabled Predictive Behavior and Materials Design

Advisor: Satish Kumar
Email: proy62@gatech.edu  
Level: Grad Student
Date Available for Internship/Employment:
Jun 2028/ Dec 2028

Ashita Victor

Research: Theme 3 Ultra Dense Heterogeneous Interconnect and Assembly

Task Title: IC Parallelism and Volume Scaling

Advisor: Muhannad S. Bakir
Email: avictor8@gatech.edu  
Level: Grad Student
Date Available for Internship/Employment:
Aug 2027 (Full Time)

Seungmin Woo

Research: Theme 1: System Driven Functional Integration & Aggregation​

Task ID: 3136.002 Design Automation for Monolithic 3D and Heterogeneous Interposer Integration​

Advisor: Muhannad Bakir

Hang Yang

Research: Theme 1
Modeling and Design Methodology for Backside Integration of Voltage Converters

Advisor: Sung-Kyu Lim

Zheng Yang

Research: Theme 2: System Architecture, Pathfinding, EDA & Test​​

Task ID: 3136.002 Design Automation​

Advisor: Sung-Kyu Lim

Wanshu Zeng

Research: Theme 3 Ultra Dense Heterogeneous Interconnect and Assembly

Task Title: IC Parallelism and Volume Scaling

Advisor: Muhannad S. Bakir
Email: wanshu_zeng@gatech.edu  
Level: Grad Student
Date Available for Internship/Employment:
Aug 2027 (Full Time)

Salma Abdelzaher

Research: Theme 1 System Driven Functional Integration and Aggregation​

Task Title: Low Loss Vertical System-Level Power Delivery with Backside M3D and Integrated Voltage Regulators 

Advisor: Inna Partin-Vaisband
Email: sabdel29@uic.edu  
Level: Grad Student
Date Available for Internship/Employment:
May 2027/Jan 2028

Rami Alsaeed

Research: Theme 1 System Driven Functional Integration and Aggregation​

Task Title: Low Loss Vertical System-Level Power Delivery with Backside M3D and Integrated Voltage Regulators 

Advisor: Inna Partin-Vaisband
Email: ralsae3@uic.edu 
Level: Grad Student
Date Available for Internship/Employment:
May 2027/May 2028

Sriharini Krishnakumar

Research: Theme 1 System Driven Functional Integration and Aggregation​

Task Title: Low Loss Vertical System-Level Power Delivery with Backside M3D and Integrated Voltage Regulators 

Advisor: Inna Partin-Vaisband
Email: skrish47@uic.edu
Level: Grad Student
Date Available for Internship/Employment:
May 2027/May 2027

Ayoub Sadeghi

Research: Theme 1 System Driven Functional Integration and Aggregation​

Task Title: Low Loss Vertical System-Level Power Delivery with Backside M3D and Integrated Voltage Regulators 

Advisor: Inna Partin-Vaisband
Email: asadeg3@uic.edu 
Level: Grad Student
Date Available for Internship/Employment:
May 2027/May 2028

Jiahao Dong

Research: Theme 4 Materials Behavior, Synthesis, Metrology, and Reliability

Task Title: Machine Learning-enhanced Coordinated Materials Synthesis, Metrology, and Reliability

Advisor: Carl V. Thompson
Email: jiahao_d@mit.edu  
Level: Postdoc
Date Available for Internship/Employment:
Jan 2027 (Full Time)

Yixuan Jiao

Research:
System-driven functional integration and aggregation as well as 2D TMD material heterogeneous integration

Advisor: Tomás Palacios

Misong Ju

Research:
Understanding the evolution of metastable metal thin films heated above the dewetting temperature and leveraging knowledge on solid-state dewetting to develop new processes for fabricating micro- and nanostructures

Advisor: Carl V. Thomspon

Parth Khandelwal

Research: Theme 4 Materials Behavior, Synthesis, Metrology, and Reliability

Task Title: Machine Learning-enhanced Coordinated Materials Synthesis, Metrology, and Reliability

Advisor: Carl V. Thompson
Email: parth108@mit.edu  
Level: Grad  Student
Date Available for Internship/Employment:
8/1/2027 (full time)

Pradyot Yadav

Research: mmWave Integration

Developments Towards W-Band GaN/Si CMOS 3DICs 

Advisor: Tomás Palacios

Peiyi Yue

Research: Theme 3 Ultra Dense Heterogeneous Interconnect and Assembly

Task Title: Reliability Optimized 3D-Integrated Packages for Efficient Power Delivery and Thermal Management

Advisor: Sachin S. Sapatnekar
Email: yue00100@umn.edu  
Level: Grad Student
Date Available for Internship/Employment:
May 2027

Tejas Ravindra Kulkarni

Research: Theme 3 Ultra Dense Heterogeneous Interconnect and Assembly

Task Title: Reliability Optimized 3D-Integrated Packages for Efficient Power Delivery and Thermal Management

Advisor: Ganesh Subbarayan
Email: kulkar72@purdue.edu
Level: Grad Student
Date Available for Internship/Employment:
NA / Dec 2026 (Full Time)

Cheng Chang

Research: Theme 4 Materials Behavior, Synthesis, Metrology, and Reliability

Task Title: Sub-300°C Diamond and Boron Nitride Heterostructure for Thermal Management

Advisor: Yuji Zhao
Email: cc206@rice.edu  
Level: Grad Student
Date Available for Internship/Employment:
June 2027/Dec 2027

Lucas Lau

Research: Theme 4 Materials Behavior, Synthesis, Metrology, and Reliability

Task Title: Sub-300°C Diamond and Boron Nitride Heterostructure for Thermal Management

Advisor: Yuji Zhao
Email: ll166@rice.edu  
Level: Grad Student
Date Available for Internship/Employment:
May 2027/ May 2029

Shisong Luo

Research: Theme 2: Monolithic 3D (M3D) Densification and Diversification on Silicon Platform​

Task ID: 3136.006 Backside of Silicon with GaN Integration for Active Power Delivery Network 

Advisor: Yuji Zhao

Zonghao Seven Zhang

Research: Theme 4 Materials Behavior, Synthesis, Metrology, and Reliability

Task Title: Sub-300°C Diamond and Boron Nitride Heterostructure for Thermal Management

Advisor: Yuji Zhao
Email: zz152@rice.edu  
Level: Grad Student
Date Available for Internship/Employment:
May 2027/ Dec 2027

Mingfei Xu

Research: Theme 2: Monolithic 3D (M3D) Densification and Diversification on Silicon Platform​

Task ID: 3136.006 Backside of Silicon with GaN Integration for Active Power Delivery Network 

Advisor: Yuji Zhao

Pin-Han Chen

Research Theme 1: System Driven Functional Integration and Aggregation

Task Title: AI-Driven Design Space Exploration and Optimization for Wafer-scale Systems 

Email: pinhanch@usc.edu
Level: Grad Student
Date Available for Internship/Employment:
May 2027 / May 2029

Youngjin Kim

Research Theme 1: System Driven Functional Integration and Aggregation

Task Title: AI-Driven Design Space Exploration and Optimization for Wafer-scale Systems 

Advisor: Sungkyu Lim
Email: ykim9554@usc.edu
Level: Grad Student
Date Available for Internship/Employment:
May 2027 / May 2029

Mingyu Park

Research Theme 1: System Driven Functional Integration and Aggregation

Task Title: AI-Driven Design Space Exploration and Optimization for Wafer-scale Systems 

Advisor: Sungkyu Lim
Email: parkming@usc.edu
Level: Grad Student
Date Available for Internship/Employment:
May 2027 / May 2028

Fabia Athena (Post-Doctoral Researcher)

Research: Back-end-of-line (BEOL) compatible memory 

Advisor: H.-S. Philip Wong

Wei-Chen Chen

Research: In-memory computing hardware design with resistive random access memory (RRAM) on emerging workloads 

Advisor: H. S. Philip Wong

Chi-Hsin Huang

Research: Theme 2 Monolithic 3D (M3D) Densification and Diversification on Silicon Platform

Task Title: BEOL eNVM/eDRAM Integration with Oxide Channel Access Transistor

Advisor: H.-S. Philip Wong
Email: chihsinh@stanford.edu
Level: Postdoc
Date Available for Internship/Employment: 2027

Shuhan Liu

Research: 

Advisor: H. S. Philip Wong

Colin Shan

Research: Theme 4 Materials Behavior, Synthesis, Metrology, and Reliability 

Task Title: Thermal Scaffolding

Advisor: Srabanti Chowdhury
Email: kyshan@stanford.edu
Level: Grad Student
Date Available for Internship/Employment:
May 2027/ June 2029

Xinxin Wang

Research: Theme 2 Monolithic 3D (M3D) Densification and Diversification on Silicon Platform

Task Title: BEOL eNVM/eDRAM Integration with Oxide Channel Access Transistor

Advisor: H.-S. Philip Wong
Email: xxwang1@stanford.edu
Level: Postdoc
Date Available for Internship/Employment: 2027

Scott Davidson

Research: Theme 1: System Driven Functional Integration and Aggregation​

Task ID: 3136.024 Architectures for M3D Neighborhoods (System-in-Package) and M3D Chip Metropoli (System-of-Packages) ​

Advisor: Michael Taylor

Rico Li

Research: Theme 1 System Driven Functional Integration and Aggregation​

Task Title: Architectures for M3D Neighborhoods (System-in-Package) and M3D Chip Metropoli (System-of-Packages) 

Advisor: Michael Taylor
Email: kangll@uw.edu
Level: Grad Student
Date Available for Internship/Employment:
June 2027 / June 2029

Huwan Peng

Research: Theme 1: System Driven Functional Integration and Aggregation​

Task ID: 3136.024 Architectures for M3D Neighborhoods (System-in-Package) and M3D Chip Metropoli (System-of-Packages) ​

Advisor: Michael Taylor

Daniel Hur

Cornell University
Research: Theme 4 Metrology

Gangchen Ren

Cornell University