Center for Heterogeneous Integration of Micro Electronic Systems
The Center for Heterogeneous Integration of Micro Electronic Systems (CHIMES) brings together seventeen universities to advance monolithic 3D and heterogeneous integration, the efficient and effective integration and packaging of semiconductor devices, chips, and other components. This center is supported through Semiconductor Research Corporation (SRC)’s Joint University Microelectronics Program 2.0 (JUMP 2.0), a consortium of industrial partners in cooperation with the Defense Advanced Research Projects Agency (DARPA).
Advancing Semiconductor
Integration & Packaging
17 Partner Universities
Support from the SRC's JUMP 2.0, DARPA & Industry Partners
4 Research Themes
A Strong Team of Principal Investigators & Student Researchers
MIT professor Tomás Palacios was the recipient of the Compound Semiconductor Week CSW2026 Quantum Devices Award. Palacios was recognized "for significant advancements in wide bandgap semiconductors and nanostructures to improve electronics and pave the way for heterogeneous integration with Si CMOS."
Lead author Mingeun Choi and advisor Professor Satish Kumar (Georgia Tech) were among the team presented the Prof. Avram Bar-Cohen Best Paper Award in the Emerging Technologies and Fundamentals Track at IEEE ITherm 2026 for their paper, “DeepONet-Enabled Fast and Scenario-Aware Spatial Temperature Prediction of a Vertical Power Delivery Module for Hyperscale Data Centers.”
Professor Suman Datta (Georgia Tech) was awarded the 2026 IEEE Andrew S. Grove Award, which is given annually to an individual or a team of up to three people for outstanding contributions to solid-state devices and technology.
Datta was honored for his "contributions to and leadership in high-performance and energy-efficient logic transistor research."
The European Design and Automation Association (EDAA) has selected Professor Krishnendu Chakrabarty (Arizona State) to receive the 2026 EDAA Achievement Award.
This award recognizes Chakrabarty's outstanding lifetime contributions to the areas of electronic design, automation and testing of electronic systems.
Upcoming Events
Learn more about the exciting research being done at CHIMES by meeting our students and PIs at these upcoming conferences!
CHIMES students presenting at Penn State's 2025 Materials Day