Addressing future semiconductor systems and application needs
Addressing future semiconductor systems and application needs
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What is CHIMES?
What is CHIMES?
The Center for Heterogeneous Integration of Micro Electronic Systems (CHIMES) was established in January 2023 with funding from the Semiconductor Research Corporation (SRC) and support from the Defense Advanced Research Projects Agency (DARPA) with industry partners.
The Center brings together eighteen universities to advance monolithic 3D and heterogenous integration, the efficient and effective integration and packaging of semiconductor devices, chips, and other components.
CHIMES in 2026
CHIMES in 2026
CHIMES held its fourth annual review at the Georgia Institute of Technology in Atlanta, Georgia in August 2026.
Over the center’s first four years, it has supported 187 students and postdoctoral researchers working under the supervision of 27 principal investigators across 19 universities, with 85 of these students being employed by the semiconductor industry.
A major highlight at this year’s review was the presentation of 18 breakthrough technologies developed over the center’s first four years.
2026 CHIMES Annual Review
2026 in Numbers
CHIMES in 2025
CHIMES in 2025
Over the 3 years since the center’s inception, CHIMES has made significant advances in the areas of research, education, and service as it relates to advanced packaging and HI.
In 2025 alone, CHIMES researchers reported 13 potential breakthroughs in electrical test, power delivery, 3D stacking, thermal management, photonics, and mmWave integration.
In August 2025, CHIMES hosted its 3rd Annual Review at Penn State University. Over 140 attendees from partner institutions, the SRC, DARPA, and industry liaisons came together to share, discuss, and collaborate.
2025 in Numbers
2025 CHIMES Annual Review
CHIMES in 2024
CHIMES in 2024
In 2024, CHIMES hosted its 2nd Annual Review at partner institution Georgia Tech.
2024 in Numbers
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