Addressing future semiconductor systems and application needs
Addressing future semiconductor systems and application needs
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What is CHIMES?
What is CHIMES?
The Center for Heterogeneous Integration of Micro Electronic Systems (CHIMES) was established in January 2023 with funding from the Semiconductor Research Corporation (SRC) and support from the Defense Advanced Research Projects Agency (DARPA) with industry partners.
The Center brings together seventeen universities to advance monolithic 3D and heterogenous integration, the efficient and effective integration and packaging of semiconductor devices, chips, and other components.
CHIMES in 2025
CHIMES in 2025
Over the 3 years since the center’s inception, CHIMES has made significant advances in the areas of research, education, and service as it relates to advanced packaging and HI.
In 2025 alone, CHIMES researchers reported 13 potential breakthroughs in electrical test, power delivery, 3D stacking, thermal management, photonics, and mmWave integration.
In August 2025, CHIMES hosted its 3rd Annual Review at Penn State University. Over 140 attendees from partner institutions, the SRC, DARPA, and industry liaisons came together to share, discuss, and collaborate.
2025 in Numbers
2025 CHIMES Annual Review
CHIMES in 2024
CHIMES in 2024
In 2024, CHIMES hosted its 2nd Annual Review at partner institution Georgia Tech.
2024 in Numbers
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