2025 Semiconductor Technologies & Photonics Workshop

2025 Semiconductor Technologies and Photonics Workshop Agenda

Monday, June 2

7:30am – 8:00am Breakfast

8:00am – 8:10am Workshop Kickoff

Madhavan Swaminathan
Department Head and William E. Leonhard Endowed Chair Professor of Electrical Engineering, Penn State and Director CHIMES Center for Heterogeneous Integration of Micro Electronic Systems

8:10am – 8:25am Welcome Address

Andrew Read
Senior Vice President for Research, Penn State

8:25am – 12:50pm Session 1: Current Status and Future of HI for AI (Plenary Speakers)

8:25am – 8:50am: Todd Younkin
CEO, Semiconductor Research Corporation and Executive Director, SMART USA Digital Twin Manufacturing Institute
Advancing Semiconductor Education and Research through Collaboration, the MAPT Roadmap, and SMART USA

8:50am – 9:15am: Ted Letavic
Corporate Fellow, Senior Vice President Technology & Innovation, GlobalFoundries

Essential Semiconductors and Advanced Packaging for AI 

9:15am – 9:40am: Ravi Mahajan
Intel Fellow, Technology Research, Intel Corporation

Road mapping the Heterogeneous Integration of Microelectronics

9:40am – 10:05am: Raja Swaminathan
Corporate Vice President of Packaging, AMD

Future of AI Hardware Enabled by Advanced Packaging

10:05am – 10:30am: Subramani (Subi)i Kengeri
Corporate Vice President and GM, Systems to Materials, Applied Materials 

System Technology Co-optimization in AI System Solutions

10:30am - 10:45am Coffee Break & Photo Shoot

10:45am – 11:10am: Claudio Mazzali
Vice President of Global Research, Corning Inc.
Unlocking Glass Potential as a Key Enabler for Co-Packaged Optics and Advanced Computing

11:10am – 11:35am: Kenichi Kasumi
Senior Researcher, Research Institute for Bioscience Products & Fine Chemicals, Ajinomoto Co., Inc.

Advanced Materials for Next Generation Packaging Technology

11:35am – 12:00pm: Jessie Rosenberg
Director of Laser Development, Lightmatter
Accelerating AI with Light

12:00pm – 12:25pm: Tzufang Tseng
Manager of Research and Development, Optics and Electronics Group, BizLink International

CPO for High Performance Computing: A Focus on Optical Assembly

12:25pm – 12:50pm: Surya Bhattacharya
Director and Head of System in Package, Institute of Microelectronics, Singapore

Multi-Chiplet Heterogeneous Integration Packaging for AI and High Performance Computing

12:50pm – 2:00pm Lunch & Student Poster Session

2:00pm – 4:30pm Session 2: Collaborative Opportunities for Academia with Industry (Plenary Speakers)

2:00pm – 2:25pm: William Chen
Fellow and Senior Technical Advisor, Advanced Semiconductor Engineering, Inc. (ASE)
The Future of Heterogeneous Integration

2:25pm – 2:50pm: Mark Lundstrom
Distinguished Professor of Electrical and Computer Engineering, Senior Advisor to the President, Chief Semiconductor Officer, Purdue University

HIAP: The New ’New Electronics’

2:50pm – 3:15pm: Subramanian Iyer
Distinguished Professor and Chair of Electrical Engineering and Materials Science Engineering, UCLA and Founding Director, UCLA CHIPS

Beyond Packaging: Scale-Down and Scale-Out and Then Some!

3:15pm – 3:40pm: Krishnendu Chakrabarty
Professor of Microelectronics, Arizona State University (ASU) and CTO, DoD Microelectronics Commons Southwest Advanced Prototyping (SWAP) Hub 

Catch Me If You Can: Defect Analysis and Built-In-Self-Test for Interconnects in Fan-out Wafer-Level Packaging

3:40pm – 4:05pm: Rohit Sharma
Professor of Electrical Engineering, Indian Institute of Technology, Ropar

Next-gen Interconnect Technologies for AI Hardware Enabled by Advanced Packaging

4:05pm – 4:30pm: Madhavan Swaminathan
Department Head and William E. Leonhard Endowed Chair Professor of Electrical Engineering, Penn State and Director CHIMES Center for Heterogeneous Integration of Micro Electronic Systems
CHIMES – A Technological Hub for Heterogeneous Integration

4:30pm – 4:45pm Coffee Break

4:45pm – 5:30pm Session 3: Panel Discussion: Is HI Ready for Prime Time?

6:00pm – Depart for Dinner (Invited guests only)

Tuesday, June 3

8:45am – 9:00am Welcome Address

Vijaykrishnan Narayanan
Associate Dean for Innovation and Robert Noll Chair Professor, College of Engineering
Penn State

9:00am – 12:00pm Session 4: Is Photonics the Answer for AI? (MoU Speakers)

9:00am – 9:25am: Ning Li
Associate Professor of Electrical Engineering, Penn State
Breaking the Memory Wall with In-Memory Computing and Optical Interconnects

9:25am – 9:50am: Chao-Kuei Lee
Professor, Department of Photonics, NSYSU
Tantala Waveguide based High Efficient Broadband Coherent Light Source: Progress in NSYSU

9:50am – 10:15am: Xingjie Ni
Associate Professor of Electrical Engineering, Penn State
Low-Power Incoherent Light-Driven Optical Extreme Learner Outperforming Linear Neural Networks through Data Repetition

10:15am – 10:45am Coffee Break

10:45am – 11:10am: Hyeonseok Lee
Assistant Professor, Department of Photonics, NSYSU
Nanostructured Semiconductor Materials for Solar Energy Conversion to Fuels

11:10am – 11:35am: Stuart (Shizhuo) Yin
Professor of Electrical Engineering, Penn State
Multi-Functional Crystalline Materials and Their Applications to Advanced Laser Sources, Ultrafast Light Beam Control, and Extremely Harsh Environment Distributed Sensing Networks

11:35am – 12:00pm: Tsung-Hsien Lin
Chair Professor, Department of Photonics, NSYSU
Reconfigurable Scattering by LCPC for Optical Computing

12:00pm – 1:00pm Lunch

1:00pm – 4:10pm Session 5: The Future of Semiconductor Technologies (MoU Speakers)

1:00pm – 1:25pm: Yeong-Jyh Lin
Associate Professor, College of Semiconductor & Advanced Technology Research, NSYSU
Wafer Hybrid Bond with CoWoS 3D Integration and Si / Glass Interposer Developments

1:25pm – 1:50pm: Wooram Lee
Associate Professor of Electrical Engineering, Penn State
Scalable Sub-THz Phased Arrays for Advanced Communications and Sensing

1:50pm – 2:15pm: Wei-Hung Su
Associate Professor, Department of Materials and Optoelectronic Science, NSYSU
Application of Fringe Projection Techniques to 3D Profile, Velocity, and Deformation Measurements

2:15pm – 2:40pm Abhronil Sengupta
Joseph R. and Janice M. Monkowski Career Development Associate Professor of Electrical Engineering, Penn State

Neuromorphic Computing – Bridging the Gap Between Nanoelectronics, Neuroscience and Machine Learning

2:40pm - 2:55pm Coffee Break

2:55pm – 3:20pm: Chua-Chin Wang
Distinguished Professor, Institute for IC Design, NSYSU
Development of Photonic Neural Networks and Associated Interface Circuit Design

3:20pm – 3:45pm: Douglas Werner
John L. and Genevieve H. McCain Chair Professor of Electrical Engineering, Penn State
Multiphysics, Multiscale, and Multiobjective Inverse-Design Techniques in Electromagnetics and Photonics

3:45pm – 4:10pm: Chun-Ming (Albert) Wang
Professor, Institute of Innovative Semiconductor Manufacturing, NSYSU
Semiconductor Lithography in the AI Era: What do we do with or without EUV?

4:20pm – 5:00pm Panel Discussion: Collaborative Opportunities between NSYSU, and Penn State

Moderators:

Iam-Choon Khoo – William E. Leonhard Professor of Electrical Engineering, Penn State

Tseng-Hsien Lin – Chair Professor, Department of Photonics, NSYSU

Zhiwen Liu – Professor of Electrical Engineering, Penn State

5:10pm Wrap Up

5:30pm – 6:30pm Materials Research Institute Facilities Tour

6:30pm Depart for Dinner (Invited guests only)