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Center for Heterogeneous Integration of Micro Electronic Systems
The Center for Heterogeneous Integration of Micro Electronic Systems (CHIMES) brings together fifteen universities to advance monolithic 3D and heterogeneous integration, the efficient and effective integration and packaging of semiconductor devices, chips, and other components. This center is supported through Semiconductor Research Corporation (SRC)’s Joint University Microelectronics Program 2.0 (JUMP 2.0), a consortium of industrial partners in cooperation with the Defense Advanced Research Projects Agency (DARPA).
Advancing Semiconductor
Integration & Packaging
15 Partner Universities
Support from the SRC's JUMP 2.0, DARPA & Industry Partners
4 Research Themes
A Strong Team of Principal Investigators & Student Researchers
2025 TECHCON Student Presenter Award
2025 TECHCON Student Presenter Award
Congratulations to CHIMES student Alexander Graening who was a recipient of the SRC TECHCON 2025 Top 10 Best Student Presenter Award!
Alexander attends the University of California, Los Angeles and is advised by Professor Puneet Gupta.
2025 CHIMES Annual Review
2025 CHIMES Annual Review
Students and PIs met with representatives from the SRC, DARPA, and industry liaisons for the center's third annual review August 26-27. With 140+ attendees, the event served to display the center's research and progress, with technical presentations, student lightning talks and poster sessions, as well as software and hardware demos.
2025 SRC Awards to Two CHIMES Faculty
2025 SRC Awards to Two CHIMES Faculty
Congratulations to Professor Krishnendu Chakrabarty (Arizona State) and Professor Shimeng Yu (Georgia Tech), on being selected to receive 2025 SRC Awards.
Chakrabarty was awarded the Innovation Award and Yu was the recipient of the Rama Divakaruni Technical Excellence Award.
Zhiting Tian Awarded DARPA Director's Fellowship
Zhiting Tian Awarded DARPA Director's Fellowship
CHIMES PI Zhiting Tian (Cornell) was selected to receive the DARPA Director's Fellowship. Tian will receive an additional $500,000 to continue her ongoing DARPA research on "Transient Nanoscale Temperature Mapping of Active RF Devices."
Upcoming Events
Learn more about the exciting research being done at CHIMES by meeting our students and PIs at these upcoming conferences!
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