Center for Heterogeneous Integration of Micro Electronic Systems
The Center for Heterogeneous Integration of Micro Electronic Systems (CHIMES) brings together fifteen universities to advance monolithic 3D and heterogeneous integration, the efficient and effective integration and packaging of semiconductor devices, chips, and other components. This center is supported through Semiconductor Research Corporation (SRC)’s Joint University Microelectronics Program 2.0 (JUMP 2.0), a consortium of industrial partners in cooperation with the Defense Advanced Research Projects Agency (DARPA).
Advancing Semiconductor
Integration & Packaging
15 Partner Universities
Support from the SRC's JUMP 2.0, DARPA & Industry Partners
4 Research Themes
A Strong Team of Principal Investigators & Student Researchers
CHIMES supported and participated in the 2nd Semiconductor Technologies and Photonics workshop held at Penn State University, June 2-3, 2025. This workshop brought together leaders from industry and academia.
Congratulations to Arizona State CHIMES students Dhruv Thapar and Partho Bhoumik, advised by Professor Krishnendu Chakrabarty, on being selected for the 2025 Qualcomm Innovation Fellowship for their research on test for fanout wafer-level packaging!
Former CHIMES PhD student Jonti Talukdar (Duke University), advised by Krishnendu Chakrabarty (Arizona State University), won the 2025 EDAA Outstanding Dissertation Award at the Design, Automation and Test in Europe (DATE) Conference.
Ramin Rahimzadeh Khorasani (Penn State) won first place in the 2025 Eugene B. and Lizy K. John Electrical Engineering Graduate Student Research Poster Competition. The research was co-authored by former CHIMES student Kolman Puterman and advisor Madhavan Swaminathan.
Upcoming Events
Learn more about the exciting research being done at CHIMES by meeting our students and PIs at these upcoming conferences!