Welcome to Alloy Design Project

Alloys are commonly used in daily life. We use experimental and modeling approaches to design new alloys for specific applications. Our designed alloys include low-temperature solder, high-temperature solder, aluminum alloy, ironmaking process, zinc-based alloys, etc.

Related papers:

Interconnection design

1. C.-H. Yang, Y.-C. Liu, H. Nishikawa, and S.-k. Lin, "Reducing anisotropy of rhombohedral Bi-rich phase for high-performance Ag-alloyed Sn–Bi low-temperature solders", Journal of Materials Research and Technology, 30, 16-24 (2024) (#IF = 6.4, Rank: 6/79 = 7.6% in METALLURGY & METALLURGICAL ENGINEERING -- SCIE). <Journal Pub>

2. C.-H. Yang, Y.-C. Liu, S.-k. Lin, Y. Hirata and H. Nishikawa, "High-strength Sn-Bi-based low-temperature solders with high toughness designed via high-throughput thermodynamic modeling", Science and Technology of Welding and Joining, (2022) (#IF = 4.114, Rank:14/79 = 17% in METALLURGY & METALLURGICAL ENGINEERING). <Journal Pub>

3. Y.-C. Liu, S.-K. Lin, H. Zhang, C. Chen, S. Nagao, and K. Suganuma, "Reactive wafer bonding with nanoscale Ag/Cu multilayers”, Scripta Materialia, 184, 1-5 (2020) (IF = 5.611, Rank: 5/80 = 6% in METALLURGY & METALLURGICAL ENGINEERING -- SCIE). <Journal Pub> 

4. S.-K. Lin, S. Nagao, E. Yokoi, C. Oh, H. Zhang, Y.-C. Liu, S.-g. Lin & K. Suganuma, “Nano-volcanic Eruption of Silver”, Scientific Reports 6, 34769 (2016) (IF = 4.259, Rank: 10/64 = 16% in MULTIDISCIPLINARY SCIENCES -- SCIE). <Journal Pub>

5. T.-L. Yang, Y.-C. Liu, C.-H. Yang, Y.-K. Kao, and S.-K. Lin, “Formation of diffusion barrier-like intermetallic compound to suppress the formation of micro-voids at the Sn-0.7Cu/Cu interface by optimal Ga additions”, JOM, (2020) (IF = 2.471, Rank: 17/90 = 19% in METALLURGY & METALLURGICAL ENGINEERING -- SCIE). <Journal Pub>  

6. S.-K. Lin, M.-J. Wang, C.-Y. Yeh, H.-M. Chang, Y.-C. Liu, “High-strength and thermal stable Cu-to-Cu joint fabricated with transient molten Ga and Ni under-bump-metallurgy”, Journal of Alloys and Compounds, 702, 561–567 (2017) (IF= 3.779, Rank: 4/75 = 5% in METALLURGY & METALLURGICAL ENGINEERING -- SCIE). <Journal Pub>

7. S.-K. Lin, H.-M. Chang, C.-L. Cho, Y.-C. Liu and Y.-K. Kuo, "Formation of solid-solution Cu-to-Cu joints using Ga solder and Pt under bump metallurgy for three-dimensional integrated circuits", Electronic Materials Letters, 11, 687-694 (2015) (IF =2.057, Rank: 103/271 = 50% in MATERIALS SCIENCE, MULTIDISCIPLINARY -- SCIE). <Journal Pub>

Electromigration effect

1. Y.-C. Liu, S.-K. Lin, and S.-J. Chiu, “On the Schmid's Law for the electric current-induced deformation: An in situ EBSD study”, International Journal of Mechanical Sciences, 168, 105295  (2020) (IF = 5.329, Rank:12/135 = 9% in MECHANICS -- SCIE). <Journal Pub>

2. Y.-C. Liu, B. Afflerbach, R. Jacobs, S.-K. Lin and D. Morgan, “Exploring effective charge in electromigration using machine learning”, MRS Communications, 1-9 (2019) (Special Issue Research Letter: Artificial Intelligence [by invitation only]) (IF = 1.997, Rank: 197/314 = 63% in MATERIALS SCIENCE, MULTIDISCIPLINARY -- SCIE). <Journal Pub> <Selected as the Worth Reading Literature by Citrine Informatics>

3. Y.-C. Liu, Y.-S. Yu, S.-J. Chiu, and S.-K. Lin, “Electromigration effect upon single- and two-phase Ag-Cu alloy strips: an in situ study”, Scripta Materialia, 173, 134-138 (2019) (IF = 5.079, Rank:6/79 = 8% in METALLURGY & METALLURGICAL ENGINEERING -- SCIE). <Journal Pub>

4. Y.-C. Liu,  and  S.-K. Lin, “A Critical Review on the Electromigration Effect, the Electroplastic Effect, and Perspectives on Effect of Electric Current upon Alloy Phase Stability”, JOM, 71(9), 3094-3106 (2019) P.1-13 (IF=2.029, Rank: 23/79 = 29% in METALLURGY & METALLURGICAL ENGINEERING -- SCIE). <Journal Pub>

5. S.-K. Lin, Y.-C. Liu, S.-J. Chiu, Y.-T. Liu, and H.-Y. Lee, "The electromigration effect revisited: non-uniform local tensile stress-driven diffusion", Scientific Reports 7, 3082 (2017) (IF = 4.122, Rank: 12/64 = 19% in MULTIDISCIPLINARY SCIENCES -- SCIE). <Journal Pub>

6. S.-K. Lin, C.-K. Yeh, W. Xie, Y.-C. Liu, and M. Yoshimura, "Ab initio-aided CALPHAD thermodynamic modeling of the Sn-Pb binary system under current stressing", Scientific Reports 3, 2731 (2013) (IF = 5.078, Rank: 5/55 = 9% in MULTIDISCIPLINARY SCIENCES -- SCIE). <Journal Pub>