Welcome to Alloy Design Project
Welcome to Alloy Design Project
Alloys are commonly used in daily life. We use experimental and modeling approaches to design new alloys for specific applications. Our designed alloys include low-temperature solder, high-temperature solder, aluminum alloy, ironmaking process, zinc-based alloys, etc.
Related papers:
Interconnection design
C.-H. Yang, Y.-C. Liu, H. Nishikawa, and S.-k. Lin, "Reducing anisotropy of rhombohedral Bi-rich phase for high-performance Ag-alloyed Sn–Bi low-temperature solders", Journal of Materials Research and Technology, 30, 16-24 (2024) (#IF = 6.4, Rank: 6/79 = 7.6% in METALLURGY & METALLURGICAL ENGINEERING -- SCIE). <Journal Pub>
C.-H. Yang, Y.-C. Liu, S.-k. Lin, Y. Hirata and H. Nishikawa, "High-strength Sn-Bi-based low-temperature solders with high toughness designed via high-throughput thermodynamic modeling", Science and Technology of Welding and Joining, (2022) (#IF = 4.114, Rank:14/79 = 17% in METALLURGY & METALLURGICAL ENGINEERING). <Journal Pub>
Y.-C. Liu, S.-K. Lin, H. Zhang, C. Chen, S. Nagao, and K. Suganuma, "Reactive wafer bonding with nanoscale Ag/Cu multilayers”, Scripta Materialia, 184, 1-5 (2020) (IF = 5.611, Rank: 5/80 = 6% in METALLURGY & METALLURGICAL ENGINEERING -- SCIE). <Journal Pub>
S.-K. Lin, S. Nagao, E. Yokoi, C. Oh, H. Zhang, Y.-C. Liu, S.-g. Lin & K. Suganuma, “Nano-volcanic Eruption of Silver”, Scientific Reports 6, 34769 (2016) (IF = 4.259, Rank: 10/64 = 16% in MULTIDISCIPLINARY SCIENCES -- SCIE). <Journal Pub>
T.-L. Yang, Y.-C. Liu, C.-H. Yang, Y.-K. Kao, and S.-K. Lin, “Formation of diffusion barrier-like intermetallic compound to suppress the formation of micro-voids at the Sn-0.7Cu/Cu interface by optimal Ga additions”, JOM, (2020) (IF = 2.471, Rank: 17/90 = 19% in METALLURGY & METALLURGICAL ENGINEERING -- SCIE). <Journal Pub>
S.-K. Lin, M.-J. Wang, C.-Y. Yeh, H.-M. Chang, Y.-C. Liu, “High-strength and thermal stable Cu-to-Cu joint fabricated with transient molten Ga and Ni under-bump-metallurgy”, Journal of Alloys and Compounds, 702, 561–567 (2017) (IF= 3.779, Rank: 4/75 = 5% in METALLURGY & METALLURGICAL ENGINEERING -- SCIE). <Journal Pub>
S.-K. Lin, H.-M. Chang, C.-L. Cho, Y.-C. Liu and Y.-K. Kuo, "Formation of solid-solution Cu-to-Cu joints using Ga solder and Pt under bump metallurgy for three-dimensional integrated circuits", Electronic Materials Letters, 11, 687-694 (2015) (IF =2.057, Rank: 103/271 = 50% in MATERIALS SCIENCE, MULTIDISCIPLINARY -- SCIE). <Journal Pub>
Electromigration effect
Y.-C. Liu, S.-K. Lin, and S.-J. Chiu, “On the Schmid's Law for the electric current-induced deformation: An in situ EBSD study”, International Journal of Mechanical Sciences, 168, 105295 (2020) (IF = 5.329, Rank:12/135 = 9% in MECHANICS -- SCIE). <Journal Pub>
Y.-C. Liu, B. Afflerbach, R. Jacobs, S.-K. Lin and D. Morgan, “Exploring effective charge in electromigration using machine learning”, MRS Communications, 1-9 (2019) (Special Issue Research Letter: Artificial Intelligence [by invitation only]) (IF = 1.997, Rank: 197/314 = 63% in MATERIALS SCIENCE, MULTIDISCIPLINARY -- SCIE). <Journal Pub> <Selected as the Worth Reading Literature by Citrine Informatics>
Y.-C. Liu, Y.-S. Yu, S.-J. Chiu, and S.-K. Lin, “Electromigration effect upon single- and two-phase Ag-Cu alloy strips: an in situ study”, Scripta Materialia, 173, 134-138 (2019) (IF = 5.079, Rank:6/79 = 8% in METALLURGY & METALLURGICAL ENGINEERING -- SCIE). <Journal Pub>
Y.-C. Liu, and S.-K. Lin, “A Critical Review on the Electromigration Effect, the Electroplastic Effect, and Perspectives on Effect of Electric Current upon Alloy Phase Stability”, JOM, 71(9), 3094-3106 (2019) P.1-13 (IF=2.029, Rank: 23/79 = 29% in METALLURGY & METALLURGICAL ENGINEERING -- SCIE). <Journal Pub>
S.-K. Lin, Y.-C. Liu, S.-J. Chiu, Y.-T. Liu, and H.-Y. Lee, "The electromigration effect revisited: non-uniform local tensile stress-driven diffusion", Scientific Reports 7, 3082 (2017) (IF = 4.122, Rank: 12/64 = 19% in MULTIDISCIPLINARY SCIENCES -- SCIE). <Journal Pub>
S.-K. Lin, C.-K. Yeh, W. Xie, Y.-C. Liu, and M. Yoshimura, "Ab initio-aided CALPHAD thermodynamic modeling of the Sn-Pb binary system under current stressing", Scientific Reports 3, 2731 (2013) (IF = 5.078, Rank: 5/55 = 9% in MULTIDISCIPLINARY SCIENCES -- SCIE). <Journal Pub>