With Cold Gas Re-circulation
Yuting Huang, Yanjun (Nick) Pan, May Lu, Zixuan (Lance) Lan
Background
Cohu, Inc. designs various types of testing manifolds for semiconductors. One of the manifolds tests semiconductors under extreme temperatures. One specific application is for aerospace industry where semiconductors are tested under temperatures as low as -55 C. The current system is an open cycle system in which liquid nitrogen (LN2) and compressed dry air (CDA) are mixed to the desired testing temperature and then exhausted after the cold gas mixture passes through the testing loads. This project's objective is to reduce the consumption of LN2, CDA, and power in order to reduce the cost of testing.
Current System Diagram
Objectives
Sealed closed cycle system capable of recirculating mixed gases
Compatible with sponsor's current setup in terms of sensor mountings and tubing system
Maintain heater temperature at -55℃ ± 5℃under variable test load power at steady state
Temperature measurement accuracy of 1℃
Use a 600-800 W heat source to emulate various testing loads.
Final System Diagram
Testing Results
Heater power varied from 600 to 800 W
Recirculated gas steady state temperature of about -5℃
Significantly lower than room temperature CDA for open cycle systems (about 14℃)
Higher system efficiency than open loop systems
Heater inlet temperature of about -70℃
Heater outlet temperature of about -140℃
Heater block temperature controlled to -55℃ with very small fluctuations
Very successful controller design !!!!!!
Maximum steady state temperature fluctuation of 0.5℃
Settled down after one cycle of fluctuation
Successfully met sponsor requirements
Duty cycle of 3 (maximum) during ramping
Meaning 6 valves turn on together for 50% of the loop time
Steady state duty cycle of about 0.3 (10% of maximum capability)
Meaning 3 valves turn on together for 10% of the loop time
System can handle a lot higher heating wattage
Steady state duty cycle almost do not fluctuate
Thanks to the dynamic offset duty cycle design
Pressure difference of ~20 kPa across the compressor
Pressure spikes and oscillations due to switching between opening LN2 valves or opening recirculated gas valve
Successfully met required temperature control accuracy
Successfully eliminated the need of CDA during normal operations
Successfully improved system efficiency
Problems Encountered
Possible Future Improvements
One RTD malfunctioning when power supply is plugged
Very small leakage in the system due to the compressor
Typically occurs at 193 kPa (28 psi)
Compressor significantly warmed up the recirculated gas
Recirculated gas was only about -5℃ at the exit of the sump
Clearly seen from the different level of frosting of the compressor inlet/outlet
Compressor
Better sealing to reduce gas leak
Decrease heating of gas to increase system efficiency
Sump
Smaller sump (3-5L) will be sufficient and will decrease heat loss
Rectangular box for better mounting in the system
Mixing Manifold
Integration of the mixing manifold and recirculated flow control manifold
To reduce system complexity and system cost
Cover Box
Liftable lid for easy system maintenance