Week 7: Progress Report
Team 10 Members:
Shom Bhandari Nobuto Ishii
Brian Mckenna Tomo Yamada
Overview of Status of Analysis, Design, Fabrication, Tests, etc.
Overflow Sensor
All new sensor materials arrived, fabrication of the final sensor design continues.
Calibration of Pump
Pump set at Power Supply Voltage of 17.729V, Potentiometer Voltage of 1.245 V, the flow rate of the pump is 0.012mL/sec.
Hardware
Acquired materials. In process of assembling.
Accomplishments from Previous Week
Overflow Sensor
New sensor tested using Cu foil and double-sided Polyimide semiconductor tape.
Dimensions: Cu foil (1 mil), Polyimide/Kapton tape (1 mil), combined silicon adhesive on tape (1.5 mil). Note 1 mil ~0.001 inches.
Est. thickness at water edge >3.5 mil
Tape sticks well to Cu surface, wires solder well to Cu foil as well:
Work instructions were generated for the sensor to now, and added to the appendix portion of the final report.
Goals for Next Week (list names after each item). Use specific and measurable objectives.
(may be delayed?)
- Perform if the DUT-TU system properly works (Tomo, Nobuto)
1. Run Adaq (DUT-TU system program) at different temperature under water’s normal boiling point
2. Run Adaq at DHF 100 (Command that sets temperature of DUT’ heater to 100C) and observe. Repeat this couple times.
3. Run Adaq at DHF 120 and observe.
(note: use the prototype water feeding system and control the flow manually.)
(note: Be sure to have there’s a good surface contact between TU and DUT, else, will burn up the DUT)
4. If anything unusual happens, contact the sponsor as soon as possible
- Perform a performance test of the system. (Shom, Brian)
- DUT power control system (Brian)
1. Set the Reference temperature at 100C
2. Set the DUT heater temperature at 100C
3. Apply 10W from a power source and observe if the system is properly functioning
- Flow Control (Shom)
1. wire all the necessary components.
2. Run Adaq at DHF 80
3. Run the flow control program
4. Observe if the pump is supplying the water after reaching sertain thermal resistance.
5. repeate 2~4 with DHF set at 100
- Overflow sensor (Brian)
1. attach the sensor onto the system.
2. wire all the necessary components
3. Run th Adaq at DHF 80.
4. Run the pump at low flow rate by adjusting the potentiometer.
5. Observe if the overflow sensor is properly working.
6. Run the Adaq at DHF 100 and 120.
7. Run the pump at higher flow rate.
8. Observe if the overflow sensor can be repeat its performance
- Overall system performance test (Shom and Brian)
- Attach all the system together, and perform the all the test.
1. perform condition when the overflow occurs,
2. perform condition when the underflow occurs
3. perform condition when DUT is set at 120C
4. perform condition when DUT is at 120C and Power Supply attempts to supply 10 W.
- Make any adjustments needed for the hardware of the system (Nobuto, Tomo)
1. Wiring (any loose, or adjustment of the lengths of wires)
2. Tubes (any way to keep the tubes from intertwine with other parts? or become a hinderance?)
3. Leakage need to be fix?
4. placement of the pump
- (if there is time) Acquire WIlliamson’s Pump (Brian)
Sponsor Comments from Last Meeting and Actions Taken to Address these Comments
Clarification of Thermal Resistance Calculation
Thermal Resistance
θ = (Th-Ta)/P
θ = Thermal Resistance between DUT and TU
Th = temperature of TU
Ta = Temperature of DUT
Power supplied to DUT
P = Power supplied to DUT = Vh * iR
Vh = Equivalent Voltage of DUT Heaters (aligned in parallel)
IR = Current going through a resistor = VR/RR
VR = Voltage of a resistor
RR = Resistance of a resistor (known value)
From Krikoff’s law, current through a resistor should equal to a current through the DUT
We need to keep the resistance of a resistor low for a low power dissipation from the resistor
Pump Control
Presented two ideas:
Have constant flow rate and have On/off control
Variable flow rate, and adjust to the temperature of the DUT
Answer: simpler the better
Attachment to TU
Usage of a gasket material:
Can shape the gasket into any shape, so it is easy to implement to the attachment for a seal
However, gasket needs more pressure in order to work. On other hand, O-ring can seal at low pressure. So use an O-ring
Couple Ideas of attaching the dispenser to the TU
Simply fill the hole with water
Pro: easy to make
Con: precise flow control is difficult
Make an attachment/aligner
Pro: capable of precise flow control
Con: may have difficulty fabricating
Sponsor provided us with small O-rings
Instructor Comments from Last Meeting and Actions Taken to Address these Comments
Names must be assigned to tasks
This was corrected after last week’s meeting.
All materials must be ordered ASAP.
Specific areas of concern regarding the Report:
Abstract must be corrected to address variable T up to 120C.
Pump chart contained inconsistencies.
MSRP of our pump must go into budget, not ebay cost.
Water analysis section must be corrected to contain more useful information.
Labview cost must go into budget.
Budget vs. Cost terms must be corrected on report.
Appendix must contain more information.
Delete DMM and other redundant pictures.
More calculations must be added to report.
Risks and Areas of Concern
Integrated LABVIEW VI’s not proven to work together.
Number of analog inputs may be insufficient
Although each VI works well seperately, project depends on 1 VI file to function.
T-core box's power source continues to fail. This may delay our test performance for the project.
Resources or Information Required but not Available
Due to the power supply of the T-core box needing repair, this limited the test of the integrated LABVIEW vi.
Schedule
Week 7 (2/20 ~ 2/24)
> Integrating LabVIEW programs (mainly three systems)
> Finalization of assembly
> Testing LabVIEW feedback controlling systems
> Test Run for entire systems
Week 8 (2/27 ~ 3/2)
> Optimizing designs and systems
Week 9 (3/5 ~ 3/9)
> Optimizing designs and systems (Final Checkup)
Gantt Chart
Budget (list amount spent and amount remaining)
Progress on Webpage
Updated gantt chart
Updated progress report
Improving ‘Home’ , ‘Final Design’ , ‘Multimedia’