Surface Mount Soldering

How to surface mount solder:

Obtain your materials:

• Soldering iron
• Board
• Chips/components
• Tweezers
• Solder
• Flux
• Brush to apply flux/syringe to apply flux
• Clamp (to hold the board)

1. Place flux over the pads that will be soldered. Flux can be applied with a syringe or spread on with a brush if liquid.
2. Tin the tip of the soldering iron. Add a bit more solder than would normally be used for through hole soldering.
3. Place solder on one of the pads that will be soldered.
4. Use tweezers to put the component into place.
5. Heat up the existing solder on the pad so that the component is "stuck" to the pad. If necessary, add more solder to that side. Make sure that the solder covers all of the pad and continues onto the top of the component.
6. Add solder to the other side of the component, again making sure that the solder covers the pad underneath and continues to the top of the component.

A common mistake when surface mount soldering chips: a solder bridge

To get rid of a solder bridge:

1. Clean the tip of the soldering iron until there is little to no solder on the end.
2. Swipe the solder away from the pins, pulling the soldering tip toward you in swift motions.
3. If this does not remove the solder bridge, use a desoldering braid. Put some solder on the braid and place the braid over the bridge.
4. Place the tip of the soldering iron on top of the braid. The braid should wick away any excess solder.
5. After removing the solder, you may have to resolder the pins.