Conference Proceedings
First author ‘Bold’, Corresponding author ‘*’
1. Devang Tavkari∗, Xiulin Ruan, Amy Marconnet, Tiwei Wei†, Multiphysics Topology Optimization of Metal-Polymer Composite Thermal Interface Materials, The 24th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 28-31 May 2025.
2. Gopinath Sahu, Ketan Yogi, Tiwei Wei*, Justin A. Weibel+, Concept Design of a Confined, Direct Two-Phase Jet Impingement Cooler with Phase Separation of Low-Surface-Tension Fluids, The 24th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 28-31 May 2025.
3. Harish Kumar Lattupalli, 1 Emily M. Stallbaumer-Cyr,1 Md Asif Iqbal,1 Sina Ghadi,1 Tiwei Wei,3 Scott N. Schiffres1,2 Direct printing of wick structures onto chips for two-phase jet impingement cooling, The 24th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 28-31 May 2025.
4. Sidharth Rajeev, Venkata Achyuth Kunchapu, Tiwei Wei, Srikanth Rangarajan*, Bahgat Sammakia, system level Reliability modeling of Liquid cooled Data Centers, The 24th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 28-31 May 2025.
5. G. Sahu, A. H. Patel, D. Hoang, K. Yogi, R. Li, and T. Wei, "First Demonstration of Metal-Lidded Integral Microjet Impingement On-Chip Cooling Structures with Alternating Feeding and Draining Nozzles for High-Performance Interposer Packages", IEEE 74th Electronic Components and Technology Conference (ECTC), 2025.
6. S. Lyu, T. Beechem, and T. Wei, "Reliability and Microstructure Characterization of Through-Silicon Vias (TSV) at Different Aspect Ratios Using EBSD-Raman Spectroscopy," IEEE 74th Electronic Components and Technology Conference (ECTC), 2025.
7. K. Wang, K. J. Yogi, G. Sahu, A. Du, and T. Wei, "Direct-on-Chip Two-Phase Microjet Cooling With Surface-Enhanced Electrodeposited Microporous Structures," IEEE 74th Electronic Components and Technology Conference (ECTC), 2025.
8. Y. Bao, S. Lyu, and T. Wei, "Bottom-Up Electrodeposition of Small Diameter, High Aspect Ratio Nanotwinned-Copper-Filled Through-Silicon Vias for Ultra High-Density 3D Integration," IEEE 74th Electronic Components and Technology Conference (ECTC), 2025.
9. Z. Chen, S. Kyatam, K. Wang, N. Opendo, M. A. Neto, R. Oliveira, J. Li, J. C. Mendes, and T. Wei, "Inter-die Hybrid Cu/Diamond Microbump Bonding for 3D Heterogeneous Integration," IEEE 74th Electronic Components and Technology Conference (ECTC), 2025.
10. Z. Chen, Z. Xiong, K. Wang, A. M. Marconnet, and T. Wei, "A Novel Thermal Isolation Method with Embedded ‘Glass Bridge’ Structures in Silicon-Based 2.5D Heterogeneous Integration Systems," IEEE 74th Electronic Components and Technology Conference (ECTC), 2025.
11. X. Zhang, S. Lyu, T. E. Beechem, and T. Wei, "Process Development and Characteristics of Small-Diameter (<3 µm), Cobalt-Filled Through Silicon Vias (TSVs) for High-Density 3D Chip Stacking," IEEE 74th Electronic Components and Technology Conference (ECTC), 2025.
12. Y. Yang, J. Chien, S. Lyu and T. Wei, "Development of Straight, Small-Diameter, High-Aspect Ratio Copper-Filled Through-Glass Vias (TGV) for High-Density 3D Interconnections," IEEE 74th Electronic Components and Technology Conference (ECTC), 2025.
13. Wang L.Q., Xie F.F. and Wei, T.W.*, Power and Thermal Integrity Analysis of High Performance and Low Power CPUs at Sub-2nm Node Designed with Various Advanced Backside PDNs, IEEE International Electron Devices Meeting (IEDM) 2024, December.
14. Wang, K.Y, Lyu, S.H., and Wei, T.W.*, A Novel Copper Microporous-Assisted Bonding Method for Fine-Pitch Cu/Sn Microbump 3D Interconnects, 2024 IEEE 74th Electronic Components and Technology Conference (ECTC), Denver, Colorado, May 28- May 31, 2024, pp. 563-570. IEEE, 2024.
15. Lyu, S.H., Thomas B., and Wei, T.W.*, Thermo-Mechanical Reliability Analysis and Raman Spectroscopy Characterization of Sub-micron Through Silicon Vias (TSVs) for Backside Power Delivery in 3D Interconnects, 2024 IEEE 74th Electronic Components and Technology Conference (ECTC), Denver, Colorado, May 28- May 31, 2024, pp. 834-841.
16. Xie, F.F., Chen R.M., and Wei, T.W.*, Thermal Mitigation Strategy for Backside Power Delivery Network, 2024 IEEE 74th Electronic Components and Technology Conference (ECTC), Denver, Colorado, May 28- May 31, 2024, pp. 1485-1492.
17. Akshat Patel, Gopinath Sahu, Wei, T.W.*, Heat Transfer Enhancement for Direct-on-Chip Impingement Jet Cooling using Variable Micro Pin Fins and Tapered Impingement Cavity, Itherm 2024.
18. Feifan Xie, Shuhang Lyu, Wei, T.W.*, Thermal Analysis of Dual-sided Cooling for Backside Power Delivery Networks (BSPDN) on 2.5D Glass/Silicon Interposer Package, Itherm 2024.
19. Feifan Xie, Shuhang Lyu, Zhi Yang, Wei, T.W.*, Direct-On-Chip Hotspot Targeted Microjet Cooling for Ultra-fast Inference at Scale Running on Groq Language Processing Unit (LPU™), Itherm 2024.
20. Wei, T.W.*, Lin Zhang, Mehdi Asheghi, Kenneth E. Goodson, Embedded Microchannel Cryogenic Cooling for Silicon Crystal Monochromators using Liquid Nitrogen and Liquid Argon, Itherm 2024.
21. Gong, Z., Wu, Q., Chan, C.Y., Kwon, H., Goodson, K. and Wei, T.W.*, Experimental Characterization of Confined, Package-Level Direct Two-Phase Jet Impingement Cooling with Micro-Pin Fin Surface Enhancement. In International Electronic Packaging Technical Conference and Exhibition (Vol. 87516, p. V001T02A002). American Society of Mechanical Engineers, InterPACK 2023.
22. Wang K.Y., Lyu, S.H., and Wei, T.W.*, Microporous Surface Modification for Thermally Enhancement Micro-bump Bonding in 3D Integration, InterPACK 2023. (presentation only)
23. Qiao, H., Jiang, K., Wei, T.W., Lin, Y., Perez, C., Asheghi, M. and Goodson, K., 2023, October. Development of Thermal Interface Materials Tape Using Vertically Aligned Copper Nanowire-PDMS Composites. InterPACK 2023. (presentation only)
24. Wang K.Y., Lyu, S.H., and Wei, T.W.*, Multiscale Thermomechanical Modeling of Nano-Through Silicon Vias (nTSV) for Backside Power Delivery Networks (BSPDN), IEEE Symposium on Reliability for Electronics and Photonics Packaging (IEEE REPP), 2023. (presentation only)
25. Xie F.F., Lyu, S.H., and Wei, T.W.*, Package Level Thermal Modeling Analysis of High‐performance Glass Interposer Packages, IEEE REPP, 2023. (presentation only)
26. Yang, H., Armstrong, M., Radousky, H., Austin, R., Gong, Z., Wei, T.W., Mao, W., Goncharov, A. and Gleason, A., Ultrafast observation of temperature in laser-shocked Al and Zr. Bulletin of the American Physical Society, 2023.
27. Oprins H, Wei, T.W., Cherman V, Beyne E. Liquid jet impingement cooling of high-performance interposer packages: a hybrid CFD–FEM modeling study. In 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) 2023, (pp. 1-10).
28. Lyu, S., Wu, Q. and Wei, T.W.*, Hotspot-targeted Cooling Scheme with Hybrid Jet Impingement/Thermal Through Silicon Via (TSV). In 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (pp. 1-9). 2023.
29. Chen, H., Lin, Y., Wei, T.W., Li, X., Paul, R., Whitt, R., Song, X., Zhao, Y., Asheghi, M. and Mantooth, H.A., 2023, March. Fabrication and Experimental Validation of Low Inductance SiC Power Module with Integrated Microchannel Cooler. In 2023 IEEE Applied Power Electronics Conference and Exposition (APEC) (pp. 366-371). IEEE, 2023.
30. Lin, Y., Wei, T.W., Asheghi, M. and Goodson, K., The Capillary-driven Two-phase Embedded Microchannel Heatsink for the Efficient Cooling of Power Electronic Modules. Bulletin of the American Physical Society, 2023. (presentation only)
31. Zheng, G, Wu, Q. Y., Wei, T. W.*, “Thermomechanical Modeling and Reliability Analysis of Copper Inverse Opals (CIO) Structure for Capillary-Fed Boiling,” 2022 IEEE Symposium on Reliability for Electronics & Photonics Packaging (REPP), 2022. (presentation only)
32. Lyu, S. H.G, Wu, Q. Y., Wei, T. W.*, “Numerical Investigation of Impinging Surface Enhancement with Copper Inverse Opals (CIO) for Jet Cooling,” 2022 IEEE Symposium on Reliability for Electronics & Photonics Packaging (REPP), 2022. (presentation only)
33. Wu, Q. Y., Wei, T. W., Asheghi, M. and Goodson, K., “Thermal Oscillations and Reliability for
Capillary-driven Boiling in Microporous Wicks”, 2022 IEEE Symposium on Reliability for Electronics & Photonics Packaging (REPP), 2022. (presentation only)
34. Wei, T.W.*, Zhang, L., Asheghi, M. and Goodson, K.E., 2022, December. Embedded Micro-channel Cooling Technique to Minimize Thermal Deformation of X-ray and High-power Laser Optics. In Journal of Physics: Conference Series (Vol. 2380, No. 1, p. 012071). IOP Publishing.
35. Chen, H., Wei, T.W., Li, X., Chen, Y., Lin, Y., Chinnaiyan, S., Asheghi, M. and Mantooth, H.A., 2022, October. Demonstration of Wire Bondless Silicon Carbide Power Module with Integrated LTCC Jet Impingement Cooler. In 2022 IEEE Energy Conversion Congress and Exposition (ECCE) (pp. 1-6).
36. Chen, H., Wei, T.W., Chen, Y., Li, X., Li, N., Zhu, Q., Hazra, S., Zhao, Y., Gupta, M.P., Asheghi, M. and Lu, Y., 2022, March. Feasibility design of tight integration of low inductance sic power module with microchannel cooler. In 2022 IEEE Applied power electronics conference and exposition (APEC) (pp. 962-965). IEEE.
37. Wei, T. W.*, Jung, K. W., Piazza, A., Hazra, S., Iyengar, M., Malone, C., Asheghi, M., & Goodson, K. E. Parametric CFD Study of Large Footprint (24 x 24 mm2) Silicon-based Embedded Microchannel-3D Manifold Coolers. InterPACK 2020. (presentation only)
38. Wei, T.W.*, Oprins, H., Cherman, V., Yang, Z., Rivera, K., Van der Plas, G., Pawlak, B. J., England, L., Beyne, E., & Baelmans, M., “Demonstration of Package Level 3D-printed Direct Jet Impingement Cooling applied to High power, Large Die Applications”, 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), Orlando, FL, USA, pp. 1422-1429. 2020,
39. Fei, G., Wei, T.W., Shi, Q., Guo, Y., Oprins, H. and Yang, S., 2019. Preliminary study on hybrid manufacturing of the electronic-mechanical integrated systems (EMIS) via the LCD stereolithography technology. In 2019 International Solid Freeform Fabrication Symposium. University of Texas.
40. Wei, T.W.*, Oprins, H., Cherman, V., De Wolf, I., Van der Plas, G., Beyne, E., & Baelmans, M.(2019, May). Thermal Analysis of Polymer 3D Printed Jet Impingement Coolers for High Performance 2.5 D Si Interposer Packages. In 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (pp. 1243-1252). IEEE. 2019.
41. Wei, T.W.*, Oprins, H., Cherman, V., De Wolf, I., Beyne, E., & Baelmans, M. (2019, May). First Demonstration of a Low Cost/Customizable Chip Level 3D Printed Microjet Hotspot-Targeted Cooler for High Power Applications. In 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (pp. 126-134). IEEE, 2019.
42. Wei, T.W.*, Oprins, H., Cherman, V., De Wolf, I., Beyne, E., Yang, S., & Baelmans, M. (2018, May). 3D Printed Liquid Jet Impingement Cooler: Demonstration, Opportunities and Challenges. In 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (pp. 2389-2396). IEEE, 2018.
43. Wei, T.W.*, Oprins, H., Cherman, V., De Wolf, I., Beyne, E., & Baelmans, T. (2018). Nozzle array scaling analysis of the thermal performance of liquid jet impingement coolers for high performance electronic applications. In The 16th International Heat Transfer Conference. The Assembly for International Heat Transfer Conferences; Beijing, China, 2018.
44. Wei, T.W.*, Oprins, H., Cherman, V., Van der Plas, G., De Wolf, I., Beyne, E., & Baelmans, M., High efficiency direct liquid jet impingement cooling of high-power devices using a 3D-shaped polymer cooler. In 2017 IEEE International Electron Devices Meeting (IEDM) (pp. 32-5). IEEE, 2017.
45. Wei, T.W.*, Qiu X., Lo J C C, Ricky L., Wafer level bumping technology for high voltage LED packaging[C]//2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT). IEEE, 2015: 54-57.
46. Wei, T.W.*, Wang Q., Cai J., et al. Performance and reliability study of TGV interposer in 3D integration[C]//2014 IEEE 16th Electronics Packaging Technology Conference (EPTC). IEEE, 2014: pp. 601-605, 2014.
47. Wei, T.W.*, Wang, Q., Liu, Z., Li, Y., Wang, D., Wang, T., & Cai, J. (2012, December). A 3D integration testing vehicle with TSV interconnects. In 2012 14th International Conference on Electronic Materials and Packaging (EMAP) (pp. 1-5). IEEE, 2012.
48. Wei, T.W.*, Cai J., Wang Q., et al. Copper filling process for small diameter, high aspect ratio through silicon via (TSV)[C]//2012 13th International Conference on Electronic Packaging Technology & High Density Packaging. IEEE, 2012: 483-487. (Outstanding Paper Award)
