Awards
May. 2025
IEEE EPS EPS Regional Contributions Award (2025)
For outstanding leadership and contributions to the IEEE EPS Central Indiana chapter, helping it become the largest and most active in the Midwest through organizing symposiums, monthly seminars, and supporting student chapter activities.
Nov. 2024
Purdue Seed for Success Acorn Award (2024)
This award recognizes Dr. Wei for receiving the DOE APAR-E COOLERCHIPS project, which has been awarded $2.5 million in funding to develop next-generation data center cooling systems.
Nov. 2024
IEEE REPP Best Student Poster Award (2024)
This award acknowledges Dr. Wei's student-led study on the scaling effects of Cu/Sn microbump solder-based bonding for high-density 3D interconnects, focusing on sizes ranging from 50 μm down to 5 μm.
August, 2024
Intel's 2024 Rising Star Faculty Award (8 recipients)
Recognizing his exceptional work in the field of advanced semiconductor packaging and chip/package level thermal management.
May. 2024
IEEE EPS / ECTC Student Travel Award (20 recipients)
Paper: “A Novel Copper Microporous-Assisted Bonding Method for Fine-Pitch Cu/Sn Microbump 3D Interconnects” PhD student: Keyu Wang
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
Nov. 2023
Elevation to the grade of IEEE Senior Member
Only 10% of IEEE’s more than 400,000 members hold this grade, which requires extensive experience, and reflects professional maturity and documented achievements of significance.
Nov. 2023
Best Poster Presentation Award (3/30)
Mentored undergraduate student (Cole Bradford Stephens, Jaiveer Singh Brar)
Scalable Asymmetric Lifecycle Engagement (SCALE) HI/AP at Purdue
June. 2022
Best Poster Presentation Award (5/300)
Mentored undergraduate student: Modin, Andrew Evan
Summer Undergraduate Research Fellowship (SURF) at Purdue
Nov. 2022
Best Student Presentation Award
Numerical Investigation of Impinging Surface Enhancement with Copper Inverse Opals (CIO) for Jet Cooling, Ph.D. student: Shuhang Lyu
2022 IEEE Symposium on Reliability for Electronics & Photonics Packaging
Oct. 2020
IMEC Ph.D. Excellence Award (3/200)
(3 winners out of 200 PhD students at IMEC)
PhD. Thesis “High Efficiency Polymer based Direct Multi-jet Impingement Cooling Solution for High Power Devices”
Oct. 2019
FWO PhD Fellowship
Research Foundation Flanders (FWO) funding for studying at Stanford
May. 2019
IEEE EPS / ECTC Student Travel Award (10 recipients)
Paper: “First Demonstration of a Low Cost/Customizable Chip Level 3D Printed Microjet HotspotTargeted Cooler for High Power Applications”
2019 IEEE 69th Electronic Components and Technology Conference (ECTC)
August, 2019
2019 Chinese Government Award for Outstanding Self-financed Students Abroad (国家优秀自费留学生奖学金)
August, 2019
2019 FWO Fellowship for Long Term Research Stay, FWO, Belgium
Aug. 2013
Outstanding Paper Award (10 recipients)
Paper: Copper filling process for small diameter, high aspect ratio through silicon via (TSV)
2013 14th International Conference on Electronic Packaging Technology, IEEE ICEPT-HDP
