PROFESSIONAL ACTIVITIES

    1. Contributions to the ASME K-16 sponsored activities (ITherm, SHTC, InterPACK):

·       Track Chair at ASME K-16's Summer Heat Transfer Conference in 2023 and 2024.

·       Track Co-Chair for Interactive Presentations session at ASME InterPACK 2023 and 2024.

·       Session Chair for 3 sessions at the ASME K-16 Summer Heat Transfer Conference 2023, including Raymond Viskanta Memorial Symposium-05.

·       Session Chair for 2 sessions (Data centers and modular edge systems; Immersion cooling) at ASME InterPACK 2023.

·       Session Chair for 3 sessions at ITherm 2023 for various topics including additive manufacturing, thermal management, and power electronics cooling.

·       Session Chair for 4 sessions at ITherm 2024 for various topics including additive manufacturing, thermal management, and power electronics cooling.

·       Committee for the ASME K-16/IEEE EPS Heat Sink Design Competition.

·       Served as a judge for student poster sessions at ITherm conferences spanning from 2021 to 2023.

   2. Contributions to the IEEE Electronics Packaging Society sponsored activities

·       General Chair (2024), Technical Program Chair (2023) and Session Chair (2022) for IEEE EPS REPP (Reliability for Electronics and Photonics Packaging).

·       Founder and Chair of IEEE EPS Central Indiana chapter, and his team successfully organized 6 seminars talks organization with average attendances > 70 since 05/2023.

·       Vice Chair and Executive Committee for the IEEE-EPS Silicon Valley Area Chapter from November 2019 to 2023.

·       Session Chair on IEEE ECTC 2024 "Die-to-Wafer Hybrid Bonding for Heterogeneous Integration" with > 400 attendees during the session.

·       Technical program committee at the IEEE 3DIC (Three-Dimensional Integrated Circuits) Conference since October 2021 and serve on the technical program committees for IEEE EPTC (Electronics Packaging Technology Conference) and ESTC (Electronic System-Integration Technology Conference) starting in September 2021.

  3. Apr. 2018 - 2024: Recognized Journal Reviewer and Editor:

·       Nature 2025 (2x), Nature 2022 (2x), Nature 2020 (1x), Nature Communication (2x), Nature Nanotechnology (1x)

·   ASME Journal of Electronic Packaging (9x)

·   IEEE Transactions on Components, Packaging and Manufacturing Technology (CPMT) (19x)

·   Int. J. Heat Mass Transf (4x)

·   IEEE Transactions on Industrial Electronics (3x)

·   IEEE Transactions on Power Electronics (5x)

·   Journal of Micromechanics and Microengineering (JMM)