1. “Understanding Thermomechanical Response of Scaled Through-silicon vias for High-density 3D Packaging”, SNU–Purdue Semiconductor Joint Workshop, on May 19, 2025.

2. “Building a 200mm Equipment Line Platform for Semiconductor Packaging Prototyping and System Integration” Birck Annual Research Symposium, on April 28, 2025.

3. Ultra-dense 3D Chip/Packaging: Interconnect Materials and Thermal Management, invited talk at UC Berkeley, scheduled on March 12, 2025.

4. Advancing Thermal Science and Engineering for Next-Generation Semiconductor Packaging and Heterogeneous Systems, invited MAE Seminar to talk at UCLA, 02/28, 2025.

5. Ultra-dense 3D Chip/Packaging: Interconnect Materials and Thermal Management, invited talk at Cornell University, scheduled on January 21, 2025.

6. Interconnect Materials for Advanced Semiconductor Packaging, invited talk at University of Michigan, December 23, 2024

7. Advanced Manufacturing for Semiconductor Packaging and Electronic Cooling invited talk at 35th annual Electronics Packaging Symposium will take place Sept. 4-5, 2024, at Binghamton University.

8. Efficient and Innovative Thermal Management for Advanced Semiconductor Packaging, Invited talk at IEEE CEDA-EPS Special Session at DAC 2024 (Top EDA conference).

9. Efficient and Innovative Thermal Management for Power Hungry AI/ ML Applications: Challenges and Opportunities, Invited panel discussion in ECTC 2024 (Top electronic packaging conference).

10.  Advanced Manufacturing for Semiconductor Packaging and Electronic Cooling, invited seminar talk at Birck Nanotechnology Center, Purdue University, Wednesday 4/17/2024

11.  Introduction of Heterogeneous Integration and Advanced Packaging, Scalable Asymmetric Lifecycle Engagement (SCALE), Purdue University, 4/23/2024

12.  Thermal management for power electronic packaging, short courses at POETS to Industry member in April,2023, UIUC, Urbana, IL 61801

13.  Thermal Challenges for Heterogeneous Integration Packaging, Tutorial together with Prof. Mehdi Asheghi (Stanford University) at IEEE REPP 2023, November 2, 2023.

14.  Advanced Manufacturing for Semiconductor Packaging and Electronic Cooling, Seminar invitation - Iowa State University, December 2023

15.  Thermal management for advanced packaging, Keynote Speaker for International Forum on Semiconductors and Optoelectronics, (SEMICONFORUM2023), 2023/06.

16.  Heterogeneous 3D Integration and Advanced cooling, Stanford ME Thermofluids, Energy, and Propulsion Research Seminar, 2022/05

17.  Heat transfer in electronic packaging, University of Colorado Denver: Talk seminar: Thermal and Mechanical Challenges and Opportunities Panel, Virtual Event, United States, 02/14/2022

18.  Heterogenous integration and thermal management, Arizona State University, School of Electrical, Computer and Energy Engineering, seminars talk, 03/21/2022